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1. 发明专利

JP2001110837A SEMICONDUCTOR DEVICE AND MANUFACTURING DEVICE THEREOF 失效
公开(公告)号：JP2001110837A
公开(公告)日：2001-04-20
申请号：JP28672599
申请日：1999-10-07
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： TSUTSUMI YASUKI , MATSUNAGA TOSHIHIRO , SHIRAISHI TOMOHIRO , SHIRAI MASAYUKI , SEKI ISAO , ONO HIROMASA
IPC分类号： H01L23/12 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To prevent the generation of the wire cross of the short wire of BGA with the long wires of the BGA. SOLUTION: A plurality of inner leads 5 for a signal conductor are radially laid on a wiring board 3 of a BGA.LSI, an inner lead 6 for a power supply is laid in a square frame on the inside of a group of the inner leads 5 for the signal conductor and a chip 15 is bonded to a bonding layer 14 on the bottom of a cavity 13 formed in the board 3. When a short wire 17 is wire-bonded between the inner lead 6 and an electrode pad 16 and long wires 18 are respectively wire-bonded between the inner leads 5 and electrode pads 16, the position of the second bonding part of the wire 17 is shifted from the regular position set on the inner lead 6 in the state corresponding to the quantity of the positional deviation from the regular position of the chip 15 and the wire cross of the short wire 17 with the long wires 18 is prevented from being generated. As the result, the generation of a defect in a short-circuit between the wires 17 and 18 due to the wire cross can be prevented.

2. 发明专利

JP2009153161A Multimedia data recording and reproducing device and multimedia data producing method 有权
标题翻译：多媒体数据记录和复制设备和多媒体数据生成方法
公开(公告)号：JP2009153161A
公开(公告)日：2009-07-09
申请号：JP2009017495
申请日：2009-01-29
申请人： Hitachi Advanced Digital Inc , Hitachi Ltd , 株式会社日立アドバンストデジタル , 株式会社日立製作所
发明人： SATO YASUHIRO , ODA TOSHIYUKI , HARUNA TOMOMI , TAKEUCHI TAKASHI , KADOMA JUNYA , MATSUNAGA TOSHIHIRO
IPC分类号： H04N5/93 , G11B20/10 , G11B27/02 , G11B27/10 , H04N5/85 , H04N5/91
摘要： PROBLEM TO BE SOLVED: To provide a moving image stream creation method capable of linking and reproducing moving images, and branching and reproducing the image in the linking and reproducing processing. SOLUTION: The order of linking multimedia data files is determined according to reproduction link order information and reproduction branch information, a preload file to be used for a program search during reproduction is generated for each of the plurality of multimedia data files, and a file linking means is provided for linking the plurality of multimedia data files with the preload files generated by a preload file generating means. Then, a compound file linking the multimedia data files and the preload file having the possibility of linking with the multimedia data files is generated, and the compound file is linked according to the file linking order determined by a file linking order determining means and the reproduction branch information. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够链接和再现运动图像的运动图像流创建方法，以及在链接和再现处理中分支和再现图像。解决方案：根据再现链接顺序信息和再现分支信息确定链接多媒体数据文件的顺序，为多个多媒体数据文件中的每一个生成在再现期间用于节目搜索的预加载文件，以及提供文件链接装置，用于将多个多媒体数据文件与由预加载文件生成装置生成的预加载文件相链接。然后，生成链接多媒体数据文件和具有与多媒体数据文件链接的可能性的预加载文件的复合文件，并且根据由文件链接顺序确定装置确定的文件链接顺序和复制文件链接复合文件分支信息。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2005166856A Apparatus and method for semiconductor device testing and semiconductor device manufacturing method 审中-公开
标题翻译：半导体器件测试和半导体器件制造方法的装置和方法
公开(公告)号：JP2005166856A
公开(公告)日：2005-06-23
申请号：JP2003402422
申请日：2003-12-02
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MATSUO MITSUHISA , MATSUNAGA TOSHIHIRO , TANAKA TAMOTSU
IPC分类号： H01L23/12 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method for testing a semiconductor device for strength against impact, wherein quantification is easy and loss due to friction drag or the like is low.
SOLUTION: The semiconductor device testing apparatus wherein an impact is applied to a part of a specimen semiconductor device for testing the part for strength, comprises a stage for fixing immovable the specimen in the vertical direction as the direction of impact application, a piston movable in the direction of impact application with one of its ends in contact with the part of the specimen to be tested, and a plummet that freely falls in the direction of impact application for colliding with the other end of the piston. By using this method, friction drag is reduced because impact is applied to the specimen by a freely falling plummet, and because the impact of the plummet is applied to the specimen through a piston one of whose end is in contact with the specimen.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于测试抗冲击强度的半导体器件的方法，其中量化容易并且由于摩擦阻力等而导致的损耗低。解决方案：将冲击施加到用于强度测试的部件的试样半导体器件的一部分的半导体器件测试装置包括用于沿垂直方向固定试样的冲击应用方向的台，活塞可沿着冲击施加的方向移动，其一端与被测试样品的一部分接触，以及一个自动落在冲击施加方向上以与活塞另一端碰撞的倾斜器。通过使用这种方法，由于通过自由下落的对接头对样品施加冲击，并且由于通过其端部与试样接触的活塞将试样施加到试样上，因此摩擦阻力减小。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2004064736A Recording method, recording medium, and reproducing method 有权
公开(公告)号：JP2004064736A
公开(公告)日：2004-02-26
申请号：JP2003139760
申请日：2003-05-19
申请人： Hitachi Advanced Digital Inc , Hitachi Ltd , 株式会社日立アドバンストデジタル , 株式会社日立製作所
发明人： SATO YASUHIRO , ODA TOSHIYUKI , HARUNA TOMOMI , TAKEUCHI TAKASHI , KADOMA JUNYA , MATSUNAGA TOSHIHIRO
IPC分类号： H04N5/93 , G11B20/10 , G11B20/12 , G11B27/10 , H04N5/92
摘要： PROBLEM TO BE SOLVED: To provide a creation method of a moving image stream for making possible linked reproduction of moving images and realizing branched reproduction during the linked reproduction as well, a creation means for realizing the above creation method, a reproduction method of the moving image stream created by the above creation means, and a means for the reproduction method.
SOLUTION: The creation method of a moving image stream is provided with: a file link order determining means for determining the order of linking multimedia data files according to reproduction link order information and reproduction branch information; a preload file generating means for generating a preload file to be used for a program search during reproduction by using a part of or all constitutive data with respect to the plurality of multimedia data files; and a preload file linking means. Then, the file linking means generates a compound file linking the preload files and links the compound file according to the file link order determined by the file link order determining means and the reproduction branch information.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JPH11112131A METHOD AND DEVICE FOR REPAIRING SEMICONDUCTOR DEVICE AND REMOVING METHOD OF DEVICE THEREOF 失效
公开(公告)号：JPH11112131A
公开(公告)日：1999-04-23
申请号：JP27003897
申请日：1997-10-02
申请人： HITACHI LTD
发明人： MATSUNAGA TOSHIHIRO , TSUTSUMI YASUKI , HIDA AKIHIRO , SHIRAISHI TOMOHIRO , KURODA HIROSHI , KUBOSONO MINORU , SHIRAI MASAYUKI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To improve reliability of a repaired semiconductor device and mounted substrate and especially to simplify the repair of the semiconductor device, wherein connecting terminals are arranged in the array pattern. SOLUTION: When this device is constituted of a solution part 1 for forming vapor atmosphere, of a repair part 2 wherein the semiconductor device of a repair part is set, and of a driving part 3 which supports the semiconductor device of the repiar part, solution 4 in the solution part 1 is heated and boiled by a heater 5 when the semiconductor device 9 of the repair part mounted on the surface is removed from a mounting substrate 8 by a solder 11, and the repair part 2 is made to be vapor atmosphere 6. By this vapor heat, the connecting part of the mounting substrate 8 and the semiconductor device 9 is heated, and the solder 11 is fused. The semiconductor device 9 of the repair part is separated and removed from the mounting substrate 8. Furthermore, the remounting is also performed by fusing the solder 11 with the vapor atmosphere 6 by the same way.

6. 发明专利

JPH1174406A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1174406A
公开(公告)日：1999-03-16
申请号：JP23412597
申请日：1997-08-29
申请人： HITACHI LTD , HITACHI MICROCOMPUTER SYST
发明人： OGUMA HIROSHI , MATSUGAMI SHOJI , OZAKI HIROSHI , TSUBOI TOSHIHIRO , SHIRAI MASAYUKI , MATSUNAGA TOSHIHIRO , TSUTSUMI YASUKI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To suppress height variations among connector terminals on the surface of a package substrate and stresses in the terminals, by forming an adhesive for fixing the package substrate to a heat sink in such a state that the stress caused by the thermal expansion of the heat sink does not warp the package substrate. SOLUTION: A package substrate 4 having the same size as a heat sink 2 has is stuck to the upper surface of the plate 2 with an adhesive 6. The adhesive 6 is composed of silicon rubber or an epoxy resin and the adhesive 6 interposed between the plate 2 and the substrate 4 is formed relatively thick. The adhesive 6 is formed so that the stress applied to the substrate 4 by the thermal expansion of the plate 2 can be relieved as much as possible to prevent the warping of the substrate 4 by the stress. Therefore, the occurrence of height variations among connector terminals 12 on the surface of the substrate 4 and stresses in the terminals 12 can be suppressed.

7. 发明专利

JPH1168302A ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE MOUNTING METHOD 失效
公开(公告)号：JPH1168302A
公开(公告)日：1999-03-09
申请号：JP22874097
申请日：1997-08-26
申请人： HITACHI LTD
发明人： SHIRAISHI TOMOHIRO , TSUTSUMI YASUKI , MATSUNAGA TOSHIHIRO , KUBOSONO MINORU , HIDA AKIHIRO , KURODA HIROSHI , SHIRAI MASAYUKI
IPC分类号： H05K3/34 , H05K3/32 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To easily exchange the BGA type semiconductor device of a defective product without generating a warp on a printed wiring board or adversely affecting surrounding elements. SOLUTION: This electronic device for mounting a semiconductor device using solder balls 8 onto the printed wiring board 9 is provided with a structure for which an electrically conductive projection 11 is provided on the terminal electrode 10 of the printed wiring board 9 and the projection 11 is inserted and incorporated in the solder ball 8. Also, in this mounting method, an insulating film provided with a small hole for exposing only a part of the terminal electrode 10 of the printed wiring board 9 is formed on the upper surface of the printed wiring board 9, the solder ball 8 is mounted on the small hole, the solder ball 8 is dissolved without dissolving the insulating film and temporary mounting is performed in the state of electrically connecting the terminal electrode 10 of the printed wiring board 9 and the external electrode of the semiconductor device through the small hole of the insulating film. Testing is performed in the state, and when the result is a normal product, the insulating film is dissolved and removed and thereafter, main mounting is performed.

8. 发明专利

JPH07110785A ORGANIZATION FILE PREPARATION DEVICE 失效
公开(公告)号：JPH07110785A
公开(公告)日：1995-04-25
申请号：JP25549093
申请日：1993-10-13
申请人： HITACHI LTD , HITACHI VIDEO & INF SYST
发明人： SATO YASUHIRO , ODA TOSHIYUKI , TAKEUCHI TAKASHI , KADOMA JUNYA , MATSUNAGA TOSHIHIRO , TONAMI KATSUHIKO
IPC分类号： G06F3/08 , G06F12/00
摘要： PURPOSE:To efficiently reconstruct CD-ROM data for partial file correction by providing specified mixing file preparation means and an organization file preparation means. CONSTITUTION:A channel mixing processing means 105 prepares a channel mixing file 102 corresponding to channel mixing control information composed of plural file means in plural files, the corresponding channel numbers and the arrangement information of the respective files in the channel mixing file 102. Then, the files are organized in a desired order and a desired file hierarchical structure and CD-ROM disk images provided with tracks based on CD-ROM standard are generated. A disk image generation means 112 prepares a disk image file 117 by arranging CD-ROM file management information, the plural files and the mixing file in an order and simultaneously adds sector numbers to the respective sectors of the disk image file 111.

9. 发明专利

JPH06244354A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH06244354A
公开(公告)日：1994-09-02
申请号：JP3172593
申请日：1993-02-22
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： OTSUKA KANJI , MIZUKAMI MASAO , SHIRAI MASAYUKI , MIWA TAKASHI , OKINAGA TAKAYUKI , SUZUKI HIROMICHI , MATSUNAGA TOSHIHIRO
IPC分类号： H01L23/50
摘要： PURPOSE:To provide a differential-interface LSI capable of processing signals with high clock frequency between LSI's and making a package smaller. CONSTITUTION:A semiconductor integrated circuit device includes a differential- interface LSI for transmitting a pulse signal between LSI's, and a lead 5 is made up of an upper-layer lead 5a and a lower-layer lead 5b, which are electrically insulated from each other through a polyimide foil (insulating film) 6.

10. 发明专利

JPH0445564A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH0445564A
公开(公告)日：1992-02-14
申请号：JP15280390
申请日：1990-06-13
申请人： HITACHI LTD
发明人： MIWA TAKASHI , SHIRAI MASAYUKI , MATSUNAGA TOSHIHIRO
IPC分类号： H01L23/36
摘要： PURPOSE:To adjust the height of a semiconductor chip and also keep enough conductivity and relax stress by arranging a heat conductor between a heat radiating plate and a semiconductor chip, and letting the surplus of a binder in joining move to a binder escape. CONSTITUTION:High heat-conductive conductors 4, which have escapes for a binder and have functions of adjusting the height of a chip 2 to the height of a base 3, are arranged on the region for mounting a semiconductor 2 of a heat radiating plate 1. The chip 2 is placed on spherical heat conductors 4, and the binder 5 is dried while pressing down the semiconductor chip 2 as in this condition. When joining heat conductors 4 to a heat radiating plate 1, a binder 5 permeates into the under space between heat conductors 4, and the heat conductors 4 joins in point contact with the heat radiating plate 1 without causing the floating-up. Furthermore, as regards the joining between the heat conductors 4 and the chip 2, the binder 5 permeates into the upper space between the heat conductors 4. Hereby, the chip 2 is joined in point contact condition with the spherical heat conductors 4, without causing floating-up.

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