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    • 2. 发明专利
    • HIGH FREQUENCY AMPLIFIER CIRCUIT DEVICE
    • JP2000201036A
    • 2000-07-18
    • JP123999
    • 1999-01-06
    • HITACHI LTDHITACHI TOBU SEMICONDUCTOR LTD
    • YASUDA TAKESHIMASUDA AKIRA
    • H01L27/06H01L21/8234H01L29/80H03F3/193H03F3/195H03G3/10
    • PROBLEM TO BE SOLVED: To decrease the gate voltage of a control transistor in proportion to an AGC potential, and to reduce a voltage by providing a prescribed circuit constitution by using dual FET for both a main transistor and the transistor for controlling a gain. SOLUTION: A common part 21 of transistors TC1 and TC2 of a control transistor Q2 in a dual gate structure is connected through a resistor R2 with a gate G1 of a main body transistor Q1, and a gate G2 of the main transistor Q1 is connected with a gate 1 of the control transistor Q2. When an AGC potential is impressed to the gate G2, the voltage of the gate G1 of the control transistor Q2 is decreased according as the AGC potential is decreased, and currents running through the control transistor Q2 are decreased, and a potential VC of the common part 21 is increased according to the decrease of a voltage. As a result, a voltage is supplied to the gate G1 of the main transistor Q1 so that the function of a forward AGC function can be obtained. Thus, the voltage of the gate 1 of the control transistor is decreased in proportion to the decrease of the AGC potential so that distortion characteristics at the time of attenuating a gain can be improved.
    • 3. 发明专利
    • TREATMENT OF PRINTED BOARD
    • JPH1176980A
    • 1999-03-23
    • JP24501597
    • 1997-09-10
    • HITACHI LTD
    • YASUDA TAKESHISATO KOJISATO KAZUHIKOYAMASHITA HISAOAZUHATA SHIGERU
    • B09B5/00B02C21/00B07B9/00B09B3/00H05K3/22
    • PROBLEM TO BE SOLVED: To separate and recover metals and nonmetals in a waste printed board by heating a waste printed board to generate gas from resinous materials in the board and to weaken component-integrating functions in the board, and then, mechanically crushing the resulting weakly-integrated waste printed board by applying external force to the board. SOLUTION: In this treatment, a waste printed board 1 is charged into a board heating device 2 to heat the board 1, wherein, although the board heating temp. somewhat depends on the kind of the board 1, as this temp., any temp. within the range of 270 to 450 deg.C may be adopted. In this board heating device 2, resinous materials in the board 1 are converted, and concurrently, gas is generated from the resinous materials and discharged as waste gas 7. Accordingly, in the waste printed board 1 thus heat-treated, the integration of metallic components such as gold platings, copper foils and copper wires, with nonmetallic inorganic materials such as glass wool is weakened. However, sometimes, copper through-holes formed by plating, or the like, fine copper wires, etc., and these different kinds of materials are bound to each other. Therefore, the heat-treated waste printed board 1 is further crushed by a crusher 3 to easily separate metals and nonmetallic inorganic materials from each other.