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1. 发明专利

JPH07160763A WORK ALLOCATION METHOD 失效
公开(公告)号：JPH07160763A
公开(公告)日：1995-06-23
申请号：JP30774193
申请日：1993-12-08
申请人： HITACHI LTD
发明人： YAMADA YUKIO , TAKAI YUKIKO
IPC分类号： G05B19/418 , G06Q10/00 , G06Q10/06 , G06Q10/10 , G06Q50/00 , G06Q50/04 , G06F17/60
摘要： PURPOSE:To prepare a work schedule whose reduction rate of the number of using application time is minimized by preparing the using schdule of specified resources with respect to plural using time zones which are applied to. CONSTITUTION:A computer 11 consists of a using application frame dividing part 101, an overlapped frame direction part 102, a frame allocation part 103 and a schedule display part 104. Then, this method converts the usable time zone and the using application time zone of the resources to the set of frames by the unit of minimal allocation time peculiar to a system, based on the set of the converted frames, the method investigates whether overlapped plural time zones exisit or not, moves and reduces a using time by the unit of the frame in correspondence to the priority of application concerning the overlapped plural using time zones, so as to prepare the using schedule of the specified resources with respect to the plural using time zones which are applied to. When all the sets of the frames can not be allocated by only moving, this method allocates work while reducing the number of the frames.

8. 发明专利

JPS5836173A SEMICONDUCTOR BOILING AND COOLING DEVICE 失效
公开(公告)号：JPS5836173A
公开(公告)日：1983-03-03
申请号：JP13412981
申请日：1981-08-28
申请人： HITACHI LTD
发明人： KUWANA HISASHI , OKADA TEIGO , YAMADA YUKIO , ITAHANA HIROSHI
IPC分类号： H01L23/427 , B61C17/00 , H02M7/04 , H02M7/06
摘要： PURPOSE:To reduce the height of a semiconductor boiling and cooling device by substantially horizontally disposing a conduit which cmmunicates between an evaporator and a condenser and connecting a control liquid reservoir to a header. CONSTITUTION:Conduits which communicate between a plurality of evaporators 2 contacted with semiconductor elements 1 and header 8, 8' of a coolant condenser 7 are provided, and are connected directly to the headers 8, 8' of the condenser 7 so that the longitudinal direction of the conduit becomes substantially horizontal. A liquid surface compensating control liquid reservoir 12 which holds the coolant surface depth so that coolant vapor flows through the upper portion of the conduit and coolant liquid flows through the lower portion to always distribute the liquid to the respective evaporators 2 due to the variation in the attitude of the entire semiconductor boiling and cooling device is connected to the headers 8, 8'. In this manner, the device having very low height can be formed.

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