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    • 3. 发明专利
    • Coil securing device of rotary electric machine
    • 旋转电机线圈安装装置
    • JPS59213250A
    • 1984-12-03
    • JP8680083
    • 1983-05-18
    • Hitachi Ltd
    • SUZUKI KEIJIHAGIWARA TOSHIAKI
    • H02K3/487H02K3/48
    • H02K3/48
    • PURPOSE:To prevent a waveform spring from moving in a slot by forming a wavy part obliquely to an axial direction and in adjacent waveform spring units in different directions. CONSTITUTION:A waveform spring 1a is formed so that the waveform part P0 is oblique to an axial direction and the directions are different between adjacent waveform spring units 1b and 1c. In other words, the oblique angle of the waveform part P0 to the axial direction of the spring unit 1b is represented by QA and that of the sring unit 1C is represented by QB and the QB is increased larger than the QA so that the waveform parts P0 of adjacent waveform spring units 1b and 1c are oblique to the axial direction and the directions are different. In this manner, the adjacent spring units 1b, 1c are not superposed, thereby preventing them from moving in the slot 5 of the spring 1a.
    • 目的:通过在轴向方向上倾斜形成波浪形部分,并在不同方向上相邻的波形弹簧单元中防止波形弹簧移动。 构成:形成波形弹簧1a,使得波形部P0相对于轴向倾斜,并且相邻的波形弹簧单元1b和1c之间的方向不同。 换句话说,波形部P0相对于弹簧单元1b的轴向的倾斜角度由QA表示,并且绳索单元1C的斜角由QB表示,并且QB增加到大于QA,使得波形部分 相邻的波形弹簧单元1b和1c的P0相对于轴向倾斜并且方向不同。 以这种方式,相邻的弹簧单元1b,1c不重叠,从而防止它们在弹簧1a的槽5中移动。
    • 4. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS5843550A
    • 1983-03-14
    • JP14110181
    • 1981-09-09
    • HITACHI LTDHITACHI ENG CO LTD
    • TOIDA HIROTOSHIHAGIWARA TOSHIAKIMASUKO YASUHIRO
    • H01L23/50H01L21/48
    • PURPOSE:To improve the bonding characteristic between a lead and metal plate and obtain a semiconductor device in high productibity and reliability in an insulated type semiconductor device, particularly in a hydrid integrated circuit device by providing the concave part whose maximum depth is equal to the thickness of metal plate at the specified part of the main surface of the metal plate or foil material and by brazing the lead while the end of it is inserted. CONSTITUTION:A solder foil chip 14 is placed within the through hole 13 of a metal plate 11 (it substantially becomes a concave part since the one aperture is stopped by the insulating plate 2) and then a jig 15 is set. The jig 15 is provided with the part 151 which engages with the insulating plate 2 and the metal plate 11 and the hole 152 which guides the lead 10 to the position of the solder foil chip 14. As the hole 152, the specified number of holes are generally provided in the same manner. The lead 10 having a disk part 101 at the end thereof is inserted into the hole 152, these are sent to the furnace in the condition that the disk part 101 of lead 10 is placed on the solder foil chip 14 and then the lead 10 is soldered to the metal plate 11.
    • 5. 发明专利
    • MANUFACTURING OF MAGNETIC FIELD COIL
    • JPS5683246A
    • 1981-07-07
    • JP16039679
    • 1979-12-12
    • HITACHI LTD
    • HAGIWARA TOSHIAKI
    • H02K15/04H02K15/12
    • PURPOSE:To eliminate generation of gaps in a coil, when manufacturing the coil in such a manner as to coat resin on an insulated conductor while winding it, by providing further coating of powdery insulating material on the portions of the conductor where gaps between the conductors are liable to get larger. CONSTITUTION:After an insulated conductor 1 is passed through a resin coating device 2 to be provided with coating of necessary amount of resin 3, it is wound into a coil core 7. At that time, the portions of the insulated conductor, where gaps between the insulated conductors are liable to get large, like the portions of transposition, are provided with further coating of powdery insulating material 6 after having passed through the resin coating device, and finally, the coil as a whole is treated for hardening. It is possible, by doing so, to eliminate generation gaps in the coil, prevent sliding or disarray between the conductors and improve the thermal conductivity.