会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明专利
    • VACUUM PUMP
    • JPS6480786A
    • 1989-03-27
    • JP23481187
    • 1987-09-21
    • HITACHI LTD
    • AKIBA MASAKUNI
    • F04C18/16F04C18/08H01L21/205
    • PURPOSE:To prevent the rotation stop of a screw due to the sticking of a foreign object or the like by forming at least either spiral screws or the inner wall face of a casing facing them with a rugged surface. CONSTITUTION:Rotors 3a, 3b are constituted in a pair, one rotor 3a has a valley-shaped spiral screw 21a, and the other rotor 3b has a ridge-shaped spiral screw 21b. When suction is performed from the processing space with a vacuum pump, a foreign object in the processing space may be mingled in the air A to infiltrate into a rotor space 4. If the sticking and accumulation of the foreign object proceeds to some degree, the foreign object is cut from the inside face 4a of the rotor space by the rugged shape of a groove section 22a provided on the peripheral face of the screw 21a, and the cut chips 30a are discharged to the outside of the rotor space 4 through an exhaust port 6 together with the air A.
    • 7. 发明专利
    • WAFER TREATING DEVICE AND MICROMANOMETER USED THEREFOR
    • JPS63238281A
    • 1988-10-04
    • JP7143487
    • 1987-03-27
    • HITACHI LTD
    • AKIBA MASAKUNI
    • H01L21/66C23C16/52H01L21/31
    • PURPOSE:To control automatically the pressure in a reaction chamber with satisfactory accuracy and sensibility by providing a micromanometer capable of transducing the pressure change in the reaction chamber into an electric signal to the evacuation system of the reaction chamber. CONSTITUTION:A gaseous reactant 26A is introduced into the reaction chamber 19 from the upper part, the exhaust gas 26B is discharged from the evacuation system 38 to keep the inside of the reaction chamber 19 at a specified pressure, a wafer 22 on a susceptor 21 is heated by a heater 24, rotated, and revolved, and a thin film is formed on the wafer 22. At this time, the micromanometer 33A is connected to the evacuation system 38 through a pressure detecting boat 34A, and the micromanometer 33A is also connected to the atmosphere 30 through a pressure detecting boat 35A. Under such a constitution, when the pressure in the reaction chamber 19 is changed, the change in the flow rate of the atmosphere 30 is transduced by the micromanometer 33A into an electric signal which is sent to a control part 37A, a driving motor 28 and an exhaust fan 25 are controlled, the opening degree of an exhaust pressure control damper 27 and the rotational speed of the exhaust fan 25 are changed, and the pressure in the reaction chamber 19 is automatically controlled.
    • 9. 发明专利
    • REDUCED PRESSURE CVD EQUIPMENT
    • JPS6265414A
    • 1987-03-24
    • JP20424985
    • 1985-09-18
    • HITACHI LTD
    • TSUTSUMI YOSHIAKIUEDA SHINJIROKOBARI TOSHIAKIAKIBA MASAKUNI
    • H01L21/205H01L21/31
    • PURPOSE:To reduce deterioration of oil used in an exhaust vacuum pump and decrease faults in the vacuum pump to improve its reliability, by effectively lowering the temperature of air in a heat exchanger when high-temperature air at the atmospheric pressure is exhausted through an auxiliary exhaust pipe. CONSTITUTION:After a wafer 6 is introduced into a reaction pipe 1, an exhaust valve 10 is closed and an auxiliary exhaust valve 11 is opened so that the air inside the reaction pipe 1 is slowly exhausted through an auxiliary exhaust pipe 9. At this time the high-temperature air at the atmospheric pressure in the reaction pipe 1 is heat-exchanged in a heat exchanger 16 installed on the auxiliary exhaust pipe 9. Therefore, the temperature becomes low enough not to promote deterioration of oil used n an exhaust mechanical booster 14 and a rotary pump 15. And when the pressure inside the reaction pipe 1 becomes comparatively low, the auxiliary exhaust valve 11 is closed and the exhaust valve 10 is opened so that exhaust pipe 8 during reaction, decrease in heat exchange efficiency is not caused by the reaction products attaching to the heat exchanger 16. Resultantly, reliability can be improved throughout the whole device.