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    • 6. 发明专利
    • Composition for n-type diffusion layer formation, method for manufacturing semiconductor substrate having n-type diffusion layer, and method for manufacturing solar battery device
    • 用于N型扩散层形成的组合物,用于制造具有N型扩散层的半导体衬底的方法,以及用于制造太阳能电池器件的方法
    • JP2014179360A
    • 2014-09-25
    • JP2013050396
    • 2013-03-13
    • Hitachi Chemical Co Ltd日立化成株式会社
    • SATO HIDEKAZUMACHII YOICHIYOSHIDA MASATONOJIRI TAKESHIKURATA YASUSHIIWAMURO MITSUNORIODA AKIHIROSHIMIZU MARISATO TETSUYA
    • H01L31/06
    • Y02E10/547
    • PROBLEM TO BE SOLVED: To provide: a composition for n-type diffusion layer formation which allows an n-type diffusion layer to be formed in a particular portion while suppressing the occurrence of out-diffusion; a method for manufacturing a semiconductor substrate having an n-type diffusion layer; and a method for manufacturing a solar battery device.SOLUTION: A composition 11 for n-type diffusion layer formation comprises glass powder including at least a donor element, and a dispersant, and has a free phosphoric acid concentration of 50,000 ppm or less. A method for manufacturing a semiconductor substrate having an n-type diffusion layer comprises the steps of: applying the composition 11 for n-type diffusion layer formation to a surface of a p-type semiconductor substrate 10, namely a face forming a light-receiving surface of a solar battery device; and performing a thermal treatment on the p-type semiconductor substrate 10 with the composition 11 for n-type diffusion layer formation applied thereto at a temperature of 600-1,200°C for 5-90 minutes. As a result of the thermal treatment, the donor element is diffused into the p-type semiconductor substrate, whereby an n-type diffusion layer 12 is formed.
    • 要解决的问题:提供:一种用于n型扩散层形成的组合物,其允许在抑制扩散的发生的同时在特定部分形成n型扩散层; 一种制造具有n型扩散层的半导体衬底的方法; 以及太阳能电池装置的制造方法。解决方案:用于n型扩散层形成的组合物11包括至少包含供体元素的玻璃粉末和分散剂,并且游离磷酸浓度为50,000ppm以下。 制造具有n型扩散层的半导体衬底的方法包括以下步骤:将n型扩散层形成用组合物11施加到p型半导体衬底10的表面,即形成光接收的面 太阳能电池装置的表面; 并且在600-1200℃的温度下对其施加用于n型扩散层形成的组合物11,对p型半导体衬底10进行热处理5-90分钟。 作为热处理的结果,施主元件扩散到p型半导体衬底中,由此形成n型扩散层12。