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1. 发明专利

JP2014015528A Prepreg and laminate sheet 审中-公开
标题翻译： PREPREG和层压板
公开(公告)号：JP2014015528A
公开(公告)日：2014-01-30
申请号：JP2012153535
申请日：2012-07-09
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： AOSHIMA MASAHIRO , KAMIGATA YASUO , KOTAKE TOMOHIKO , MIYATAKE MASATO , TAKAHASHI YOSHIHIRO
IPC分类号： C08J5/24 , C08K3/10 , C08K5/3415 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide a prepreg and a laminate sheet showing a small reduction in the thermal conductivity when a glass fiber fabric is impregnated with a resin composition, and having low thermal expansion property.SOLUTION: The prepreg is obtained by impregnating and coating a glass fiber base material with a resin composition that comprises an epoxy resin having a specified structure as a thermosetting resin and a polyimide resin having a specified structure as a hardening agent. In the resin composition, the content of the epoxy resin having the specified structure is 30 to 50 mass%. The resin composition further contains an inorganic filler; the content of the inorganic filler is 30 to 70 vol% with respect to the whole resin composition; and the inorganic filler contains at least aluminum oxide.
摘要翻译：要解决的问题：提供一种当玻璃纤维织物浸渍有树脂组合物并且具有低热膨胀性能时，预浸料和层压片材显示出小的导热性降低。溶解性：预浸料通过浸渍和涂布获得具有树脂组合物的玻璃纤维基材，其包含具有特定结构的环氧树脂作为热固性树脂和具有特定结构的聚酰亚胺树脂作为硬化剂。树脂组合物中，具有规定结构的环氧树脂的含量为30〜50质量％。树脂组合物还含有无机填料; 无机填料的含量相对于整个树脂组合物为30〜70体积％无机填料至少含有氧化铝。

2. 发明专利

JP2013010861A Resin composition for laminate, prepreg, and laminate 有权
标题翻译：用于层压板，PREPREG和层压板的树脂组合物
公开(公告)号：JP2013010861A
公开(公告)日：2013-01-17
申请号：JP2011144357
申请日：2011-06-29
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： TAKAHASHI YOSHIHIRO , KAMIGATA YASUO , AOSHIMA MASAHIRO , MURAI AKIRA
IPC分类号： C08L101/00 , B32B5/28 , C08J5/24 , C08K3/24 , C08K3/36 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for laminate, which is excellent especially in drilling workability, low thermal expansion, heat resistance, and electric insulation, and is suitably used for semiconductor packages and the like; and to provide a prepreg, and the laminate.SOLUTION: The resin composition for laminate comprises a thermosetting resin, a silica, and aqueous zinc molybdate (ZnMoO(OH)) in which the atomic ratio of zinc to molybdenum is 3:2. The silica accounts for 40 to 60 vol.% of the whole resin composition, whereas the aqueous zinc molybdate (ZnMoO(OH)) accounts for 0.5 to 10 vol.% of the whole resin composition.
摘要翻译：要解决的问题：提供一种特别是在钻孔加工性，低热膨胀性，耐热性和电绝缘性方面优异的层叠体用树脂组合物，适用于半导体封装等; 并提供预浸料和层压材料。解决方案：层压体用树脂组合物包含热固性树脂，二氧化硅和钼酸锌水溶液（Zn 3 Mo 2 其中锌与钼的原子比为3:2的O 8 （OH） 2 ）。二氧化硅占整个树脂组合物的40至60体积％，而钼酸锌水溶液（Zn 3 Mo 2 占整个树脂组合物的0.5〜10体积％的O 8 （OH） 2 ）。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2003253092A EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC PART DEVICE USING THE SAME 审中-公开
公开(公告)号：JP2003253092A
公开(公告)日：2003-09-10
申请号：JP2002056319
申请日：2002-03-01
申请人： HITACHI CHEMICAL CO LTD
发明人： AKIMOTO TAKAYUKI , IKEZAWA RYOICHI , TAKAHASHI YOSHIHIRO , KATAYOSE MITSUO
IPC分类号： C08L63/00 , C08K3/22 , C08K3/32 , C08K5/521 , C08K5/5399 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain an epoxy resin material having non-halogen and non- antimony and showing good flame retardance without damaging reliability in properties such as moldability, reflow resistance, humidity resistance, storage stability at a high temperature, and to provide an electronic part device equipped with an element sealed with the epoxy resin material. SOLUTION: The epoxy resin molding material for sealing containing an epoxy resin (A), a curing agent (B) and a composite metal hydroxide as essential components is characterized in that, when the crashed pieces of a molded item of the material are extracted with water whose amount is 10 ml per 1 g of the pieces at 121°C under pressure of 2 atmospheres, the extracting water has a sodium ion (Na + ) content of no more than 3 ppm and a chlorine ion (Cl - ) content of not more than 3 ppm and shows electric conductivity of not more than 100 μS/cm and pH of 5.0 to 9.0. COPYRIGHT: (C)2003,JPO

4. 发明专利

JP2002220514A EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC PART DEVICE 失效
公开(公告)号：JP2002220514A
公开(公告)日：2002-08-09
申请号：JP2001018891
申请日：2001-01-26
申请人： HITACHI CHEMICAL CO LTD
发明人： AKIMOTO TAKAYUKI , IKEZAWA RYOICHI , TAKAHASHI YOSHIHIRO , FUJII MASANOBU , KATAYOSE MITSUO
IPC分类号： C08L63/00 , C08G59/62 , C08K3/00 , C08K3/02 , C08K9/02 , C08K9/04 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain a nonhalogen and antimony-free epoxy resin material for sealing having good flame retardance without deteriorating reliability of moldability, reflow and moisture resistances, high-temperature standing characteristics, etc., and to provide an electronic part device having an element sealed with the epoxy resin material. SOLUTION: This epoxy resin material for sealing consists essentially of (A) an epoxy resin, (B) a curing agent and (C) aluminum hydroxide coated with an epoxy resin. The electronic part device is provided with an element sealed with the epoxy resin molding material for sealing.

5. 发明专利

JP2000159981A EPOXY RESIN MOLDING MATERIAL FOR SEALING USE AND ELECTRONIC COMPONENT DEVICE 失效
公开(公告)号：JP2000159981A
公开(公告)日：2000-06-13
申请号：JP33926898
申请日：1998-11-30
申请人： HITACHI CHEMICAL CO LTD
发明人： TAKAHASHI YOSHIHIRO , AKIMOTO TAKAYUKI , AKAGI SEIICHI
IPC分类号： C08K3/00 , C08G59/22 , C08K5/00 , C08L63/02 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain the subject molding material free from any halogen and antimony, excellent in flame retardancy and moldability, and useful in electronic component devices, etc., by compounding a blend of respectively specific epoxy resins. SOLUTION: This molding material essentially comprises (A) a blend of (i) an epoxy resin of formula I and (ii) a 2nd epoxy resin of formula II, (B) a curing agent, (C) an inorganic filler, and (D) a flame retardant free from any halogen and/or antimony in the weight ratio i/ii of (20:80) to 80:20); wherein the component C accounts for 80-92 wt.% of this molding material as a whole, and it is preferable that the component B includes a curing agent of formula III [R is H or a (substituted) 1-10C hydrocarbon; n is 0-8], and the component D is a metal hydroxide, esp. magnesium hydroxide and its amount to be included being

6. 发明专利

JPH10214927A EPOXY RESIN MOLDING MATERIAL FOR ELECTRONIC PART SEALING AND ELECTRONIC PART 失效
公开(公告)号：JPH10214927A
公开(公告)日：1998-08-11
申请号：JP1652897
申请日：1997-01-30
申请人： HITACHI CHEMICAL CO LTD
发明人： TAKAHASHI YOSHIHIRO , SAITO HIROYUKI , HAGIWARA SHINSUKE
IPC分类号： C08K3/00 , C08G59/40 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain good frame retardance and setting property by non-halogen and non-antimony by adopting epoxy resin, phenol compound, at least one kind of molybdenum and inorganic filler as essential elements and setting a content of filler in a range of specific percentage to an entire of element materials. SOLUTION: As epoxy resin, linear aliphatic epoxy resin which is obtained by oxidation with acyl hydraperoxide and cycloaliphatic epoxy resin are included, which are used single or in a proper variety. Phenol compound functions as a setting agent of epoxy resin and is not limited especially. At least one kind of molybdenum compound selected from molybdenum sulfide, molybdenum carbide and molybdenum silicide is used as flame retarder and its mixing is not especially limited. A mixing amount of inorganic filler is 85 to 95wt.% to an entire of molding materials. If a mixing amount is 85wt.% or less, frame retandance is insufficient and if it exceeds 95wt.%, setting property and hardening matter property lower.

7. 发明专利

JPH10158397A POLYIMIDE PRECURSOR, ITS PRODUCTION, POLYIMIDE, ITS PRODUCTION AND PHOTOSENSITIVE RESIN COMPOSITION 失效
公开(公告)号：JPH10158397A
公开(公告)日：1998-06-16
申请号：JP31662996
申请日：1996-11-27
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWAKAMI HIROYUKI , TAKAHASHI YOSHIHIRO , NISHIZAWA HIROSHI
IPC分类号： G03F7/038 , C08G73/10 , C08G73/14
摘要： PROBLEM TO BE SOLVED: To obtain a polyimide precursor comprising a specific repeating unit, having an excellent image-forming property, further capable of expressing excellent mechanical characteristics, excellent heat resistance, excellent adhesivity and low thermal expansion after thermally cured, and useful as a heat-resistant photo-sensitive material in the fields of semiconductor-integrated circuits, etc. SOLUTION: This polyimide precursor comprises (A) a repeating unit of formula I [R is a tetravalent organic group; R is a divalent organic group; X, X' are each OH, a group of the formula: O-R (R is double bond-containing group, a 1-3C alkyl), a group of the formula: NH-R' (R' is R), a group of the formula: O . NR'' (R'' is R; Z is H, a 1-3C alkyl)] and (B) a repeating unit of formula II [Y is a group of formula III (R , R are each a divalent organic group such as (substituted) m- or p-phenylene)] in an A/B molar ratio of e.g. 10/90 to 98/2. The compound is obtained by reacting a compound of formula IV with a compound of the formula: H2 N-R -NH2 and a compound of the formula: H2 N-R -CO-NH-R -NH2 .

8. 发明专利

JP2586770B2 失效
公开(公告)号：JP2586770B2
公开(公告)日：1997-03-05
申请号：JP31625291
申请日：1991-11-29
申请人： HITACHI CHEMICAL CO LTD
发明人： NAKAYAMA HAJIME , FUKUTOMI NAOKI , TSUBOMATSU YOSHIAKI , TAKAHASHI YOSHIHIRO
IPC分类号： H05K3/46

9. 发明专利

JPH07266076A LASER BEAM MACHINING METHOD FOR HEAT RESISTANT RESIN 失效
公开(公告)号：JPH07266076A
公开(公告)日：1995-10-17
申请号：JP6283994
申请日：1994-03-31
申请人： HITACHI CHEMICAL CO LTD
发明人： YAMAZAKI AKIO , TSUBOMATSU YOSHIAKI , TAKAHASHI YOSHIHIRO
IPC分类号： B23K26/382 , B23K26/16 , C08J7/00 , H05K3/00 , B23K26/00
摘要： PURPOSE:To well remove processing residues and to improve processing accuracy and connection reliability of wiring boards by irradiating a heat resistant resin with a laser beam and treating this resin with a specific material. CONSTITUTION:The heat resistant resin is irradiated with the excimer laser beam and is then treated with an alkaline soln. of a permanganate. The precipitated manganese compd. is removed by precipitation for the laser beam machining for the resistant resin. The manganese compd. is easily removable by a neutralization treatment by a soln. contg. a reducing agent. This reducing agent includes a hydroxyl amine sulfate, etc., and the soln. prepd. by adding an acid thereto is preferably used. For example, a polyimide film is irradiated with the excimer laser beam, by which the film is partly bored. Next, the film is subjected to an imersion treatment in an aq. alkaline potassium permanganate soln. and neutralization treatment. The processing residues observed around the processed parts of the polyamide are removed after the treatment. As a result, the accuracy of laser beam processing of the heat resistant resin, such as small-diameter boring in the production stages for the wiring boards and the reliability of the processed products are improved.

10. 发明专利

JPH03173197A MANUFACTURE OF WIRING BOARD AND MACROMOLECULE FILM HAVING METAL LAYER 失效
公开(公告)号：JPH03173197A
公开(公告)日：1991-07-26
申请号：JP31198389
申请日：1989-11-30
申请人： HITACHI CHEMICAL CO LTD
发明人： TSURU YOSHIYUKI , TSUBOMATSU YOSHIAKI , TAKAHASHI YOSHIHIRO , FUKUTOMI NAOKI
IPC分类号： H05K3/38
摘要： PURPOSE:To offer a macromolecule film having a metal thin film layer which has a force for adhering to a provisional metal substrate and is suitable to a replication method by using the heatproof macromolecule film which has no or a weak chemical interaction with copper and has a predetermined layer diffused with copper in the interface between the film and copper by a heat treatment. CONSTITUTION:A heatproof macromolecule material having no or a weak chemical interaction with copper is used as a macromolecule film and a suitable holding power is given to the film by diffusing copper into the macromolecule film by a heat treatment. When the thickness of the copper diffusing layer is less than 200Angstrom , the adhesive force between the metal layer and the film is weak and the metal layer is easy to be peeled. When it exceeds 1000Angstrom , the adhesive force is too strong to be easy to peel the film after a replication. When manufacturing a wiring board, the thickness of the macromolecule layer diffused with copper is controlled so that the summation of the thicknesses occurred by the working process for forming the metal layer on the film and the one for peeling the film after the replication is 1000Angstrom or less. When the summation exceeds 1000Angstrom , the adhesive force goes too strong to be easy to peel the film after the replication.

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