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1. 发明专利

JP2002189896A SYSTEM FOR PROVIDING SEMICONDUCTOR CONSTRUCTION MATERIAL 失效
公开(公告)号：JP2002189896A
公开(公告)日：2002-07-05
申请号：JP2000387126
申请日：2000-12-20
申请人： HITACHI CHEMICAL CO LTD
发明人： YASUDA MASAAKI , SUGAWARA TAKAO , KAGEYAMA AKIRA , KURABUCHI KAZUHIKO , SUZUKI NAOYA
IPC分类号： G06Q30/06 , G06Q50/00 , G06Q50/04 , G06F17/60
摘要： PROBLEM TO BE SOLVED: To provide a system for providing a semiconductor construction material capable of rapidly providing, at a low cost, a semiconductor construction material meeting the characteristic requirements requested from consumers. SOLUTION: In this system 1 for providing the semiconductor construction material, a semiconductor construction material provider side terminal 3 is connected to consumer side terminals through a communication line. On the consumer side terminal 5, a consumer inputs at least one of the specification values of the type, dimension, and material of an entire semiconductor device, at least one of the characteristic requirements of reliability items, and the characteristic requirement values thereof, or selects them from the pre-displayed standard values of the characteristic requirements. On the supplier side terminal 3, a calculation device 7 selects an applicable semiconductor construction material from the accumulated semiconductor construction information based on the inputted or selected signals on the consumer side terminal 5, and displays on the consumer side terminal.

2. 发明专利

JP2001226586A METHOD FOR MANUFACTURING REINFORCED WAFER AND ELECTRONIC PART 失效
公开(公告)号：JP2001226586A
公开(公告)日：2001-08-21
申请号：JP2000043544
申请日：2000-02-16
申请人： HITACHI CHEMICAL CO LTD
发明人： SAKATA TOICHI , NISHIZAWA HIROSHI , KAGEYAMA AKIRA
IPC分类号： B05D7/00 , C08G73/10 , C08L79/08 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a reinforced wafer that furnishes little wafer breakage, excellent processability and excellent yield in the manufacturing steps of wafers and chips as well as in the transportation steps of the chips, and to provide an electronic part having high reliability, excellent productivity (tact) and good yield. SOLUTION: According to this method for manufacturing a reinforced wafer, an organic or inorganic viscous material is applied to location on the rear surface of a thin wafer, the locations corresponding to the patterns formed on the front surface of the wafer. An electronic part can be manufactured by applying the organic or inorganic viscous material to the locations according to the above method.

3. 发明专利

JP2001225003A GROOVE COATING METHOD AND ELECTRONIC PART 失效
公开(公告)号：JP2001225003A
公开(公告)日：2001-08-21
申请号：JP2000043543
申请日：2000-02-16
申请人： HITACHI CHEMICAL CO LTD
发明人： NISHIZAWA HIROSHI , SAKATA TOICHI , KAGEYAMA AKIRA
IPC分类号： B05D1/30 , B05C5/02 , B05D7/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive groove coating method in which an organic or inorganic viscous material can be applied efficiently and continuously, and a thick coating film with reduced bleeding, bubbles, and contamination is obtained by a simple process and non-contact application when grooves formed on the surface of a base material are coated with the viscous material and an electronic part high in reliability and good in production yield. SOLUTION: In the method for coating the grooves with the viscous material, while a discharge speed of the material from a nozzle is adjusted by changing gas pressure applied to the material, the material is applied non-contactwise only on the base material surface of the grooves or on the periphery of the grooves, including the grooves, and a trimmed pattern is formed accurately on the surface of the base material. In the electronic part, the base material surface of the grooves or on the periphery of the grooves, including the grooves, is coated with the viscous material by the method.

4. 发明专利

JP2001096881A METHOD FOR FORMING PRECISE PATTERN AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001096881A
公开(公告)日：2001-04-10
申请号：JP27771199
申请日：1999-09-30
申请人： HITACHI CHEMICAL CO LTD
发明人： TANAKA TOSHIAKI , YASUDA MASAAKI , NISHIZAWA HIROSHI , KAGEYAMA AKIRA , NOMURA YOSHIHIRO
IPC分类号： B41F15/40 , B41M1/12 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a precise pattern having excellent resolution without bleeding or sagging and a semiconductor device having the pattern and excellent reliability. SOLUTION: The method for forming a precise pattern comprises the steps of printing a resin paste having a complex viscosity measured at a frequency of 1 rad/s of 5 to 1,000 Pa.s, a ratio tanδ of a loss elastic modulus to a storage elastic modulus measured at a frequency of 100 rad/s of 1.2 to 10 times as large as a ratio tan δof the loss elastic modulus to the storage elastic modulus measured at the frequency of 1 rad/s while controlling a printing pressure. In this case, the method for forming the precise pattern comprises a step (A) of printing the resin paste having the complex viscosity measured at the frequency 1 rad/s of 5 to 1,000 Pa.s., a ratio tanδ of the loss elastic modulus to the storage elastic modulus measured at the frequency of 100 rad/s of 1.2 to 10 times as large as the ratio tanδ of the loss elastic modulus to the storage elastic modulus measured at the frequency of 1 rad/s while controlling to print through a meshless metal plate, a step (B) of thermally drying the printed paste, and repeating the steps (A) and (B) plural times. The semiconductor device is formed of the pattern on a substrate by the method for forming the pattern.

5. 发明专利

JP2000200793A DIE BONDING MATERIAL AND BONDING METHOD 失效
公开(公告)号：JP2000200793A
公开(公告)日：2000-07-18
申请号：JP2000043233
申请日：2000-02-21
申请人： HITACHI CHEMICAL CO LTD
发明人： TAKEDA SHINJI , MASUKO TAKASHI , YUSA MASAMI , KIKUCHI NOBURU , MIYADERA YASUO , MAEKAWA IWAO , YAMAZAKI MITSUO , KAGEYAMA AKIRA , KANEDA AIZO
IPC分类号： H01L21/52 , H01L21/58 , H01L23/495
摘要： PROBLEM TO BE SOLVED: To prevent reflow cracks in a solder reflow step when a semiconductor device is mounted. SOLUTION: In a bonding method, a semiconductor device includes a supporting material, a semiconductive element 8, a bonding material 1 for bonding a semiconductor element, and a sealing resin 9 for sealing the semiconductor element. The semiconductor element 10 is bonded to a lead frame 5 through an organic bonding material 1 in a film form with a coefficient of water absorption of 1.5 vol.% or below, a saturation coefficient of water absorption of 1.0 vol.% or below, a residual volatile component of 3.0 wt.% or below, or a modulus of elasticity of 10 MPa or below.

6. 发明专利

JPH07238268A ADHESIVE AND SEMI-CONDUCTOR UNIT 失效
公开(公告)号：JPH07238268A
公开(公告)日：1995-09-12
申请号：JP2866794
申请日：1994-02-28
申请人： HITACHI CHEMICAL CO LTD
发明人： ICHIMURA NOBUO , TAKETAZU JUN , KAGEYAMA AKIRA
IPC分类号： C08L63/00 , C08F290/00 , C08F290/04 , C08G59/34 , C09J4/00 , C09J9/02 , C09J163/00 , C09J163/10 , H01L21/52
摘要： PURPOSE:To obtain the adhesive having high reliability without reflow cracking and useful in semiconductor devices by using an epoxy group-containing polybutadiene, a curing agent, a (meth)acryl group-containing organic compound and a free radical polymerization initiator. CONSTITUTION:The object adhesive comprises (A) an epoxy group-bearing polybutadiene, (B) a curing agent, (C) a (meth)acryl group-having organic compound and (D) a free radical polymerization initiator, preferably further (E) a filler (preferably silver dust). It is preferable that the component (B) is used in an amount of 0.5 to 1.5 equivalent per equivalent of the epoxy group in the component (A), and also the component (C) and the component (D) are used in amounts of 50 to 200 pts.wt. and 0.1 to 10 pts.wt. per 100 pts.wt. of the component (A), respectively.

7. 发明专利

JPH06196513A ADHESIVE AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06196513A
公开(公告)日：1994-07-15
申请号：JP34209492
申请日：1992-12-22
申请人： HITACHI CHEMICAL CO LTD
发明人： ICHIMURA NOBUO , TAKETAZU JUN , KAGEYAMA AKIRA
IPC分类号： C09J163/00 , H01L21/52
摘要： PURPOSE:To reduce generation of reflow cracks at the time of solder reflow, and improve the reliability of a semiconductor device, by bonding a semiconductor element to a retaining member by using adhesive containing epoxy resin, hardner and moisture absorber. CONSTITUTION:Varnish is obtained by dissolving and mixing epoxy resin and diluent. To the varnish the following are added and mixed, thereby obtaining adhesive; hardner, moisture absorber, and, if necessary, filler and hardening accelerator. The adhesive is used when a semiconductor element is bonded to a retaining member like a lead frame. In virtue of the effect of the adhesive for restraining moisture absorption, generation of moisture in the adhesive can be restrained in the course of solder reflow. Hence, when the adhesive is applied to the die bonding agent of a semiconductor device, generation of reflow cracks at the time of solder reflow can be reduced, and a semiconductor device of high reliability can be obtained.

8. 发明专利

JPH05142801A COMPOSITE FOR PHOTOSENSITIVE LAYER AND ELECTROPHOTOGRAPHIC SENSITIVE BODY USING COMPOSITE THEREOF 失效
公开(公告)号：JPH05142801A
公开(公告)日：1993-06-11
申请号：JP30770191
申请日：1991-11-22
申请人： HITACHI CHEMICAL CO LTD
发明人： ENDO KEIICHI , MIYAOKA SEIJI , OGOSHI KOJI , KANEKO SUSUMU , KATSUYA YASUO , KAGEYAMA AKIRA , MORISHITA YOSHII
IPC分类号： C08L69/00 , G03G5/05 , G03G5/06 , G03G5/14
摘要： PURPOSE:To provide quick responsiveness, high image quality, and high printing withstanding property without causing phase separation in a coated state even in the case of a highly symmetric electric charge-bearing substance being used by using specific polycarbonate resin together with a highly symmetric specific charge transporting substance excellent in light responsiveness. CONSTITUTION:A composite for a photosensitive layer contains polycarbonate resin comprising repeated structural units expressed by a formula I and a butadiene derivative expressed by a formula II. In an electrophotographic sensitive body a photosensitive layer is formed on a conductive base body by using this composite. In the formula I, R1 and R2 represent a hydrogen atom, alkyl group, aryl group; R3-R18 hydrogen atom, halogen atom, alkyl group, aryl group; (k) and (m) positive integer; and k/m within 1-10. In the formula II, R19-R22 represent lowclass alkyl group; R23 and R24 substituted or unsubstituted aryl group.

9. 发明专利

JPH04240861A ELECTROPHOTOGRAPHIC SENSITIVE BODY 失效
公开(公告)号：JPH04240861A
公开(公告)日：1992-08-28
申请号：JP798791
申请日：1991-01-25
申请人： HITACHI CHEMICAL CO LTD
发明人： ENDO KEIICHI , KAGEYAMA AKIRA , MIYAOKA SEIJI , KANEKO SUSUMU , KATSUYA YASUO , SEKINE MAKOTO , OSHIKUBO TOSHIO , SHINPO YASUSHI
IPC分类号： C09B47/04 , G03G5/05 , G03G5/06 , G03G5/14
摘要： PURPOSE:To provide the electrophotographic sensitive body stable in electrophotographic characteristics in successive printing tests and superior in adhesion and image stability against change of temperature and humidity and long in life. CONSTITUTION:The electrophotographic sensitive body is formed by successively laminating on a conductive substrate an undercoat layer containing a binder resin, an electric charge generating layer containing an organic pigment for generating charge and a binder having a water absorbing capacity of

10. 发明专利

JPH04225361A ELECTROPHOTOGRAPHIC SENSITIVE BODY 失效
公开(公告)号：JPH04225361A
公开(公告)日：1992-08-14
申请号：JP40798190
申请日：1990-12-27
申请人： HITACHI CHEMICAL CO LTD
发明人： MIYAOKA SEIJI , KAGEYAMA AKIRA , ENDO KEIICHI , KATSUYA YASUO
IPC分类号： G03G5/05
摘要： PURPOSE:To improve the responsiveness of a sensitive body by using a specified binder in the electric charge transferring layer. CONSTITUTION:When an electric charge generating layer contg. an electric charge generating material and an electric charge transferring layer contg. an electric charge transferring material are formed on an electrically conductive substrate to obtain an electrophotographic sensitive body, the electric charge transferring layer is composed of the electric charge transferring material, a binder and additives and resin satisfying concn. of carbonyl group is used as the binder. The concn. of carbonyl group is defined as the ratio of the number of carbonyl groups in the repeating units of the resin to the mol.wt. of the repeating units.

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