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1. 发明专利

JP2003193020A ADHESIVE, METHOD FOR PRODUCING THE SAME AND METHOD FOR PRODUCTION OF CIRCUIT CONNECTED STRUCTURE USING THE ADHESIVE 审中-公开
公开(公告)号：JP2003193020A
公开(公告)日：2003-07-09
申请号：JP2001397178
申请日：2001-12-27
申请人： HITACHI CHEMICAL CO LTD
发明人： SATO KAZUYA , OTA SATORU , YUSA MASAMI
IPC分类号： C09J183/04 , C09J4/00 , C09J9/02 , C09J163/00 , C09J183/07 , H01B1/22 , H01B1/24 , H01B5/14 , H01B13/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain an adhesive with high adhesivity and reliability, and to provide the adhesive free from difference between lots, capable of producing high quality goods in high yield, suppressing deterioration of a silane coupling agent in storage of the adhesive and in use, imparting a long term storage stability, and imparting a long term retention of adhesivity after adhesion, to provide a method for producing the adhesive, and to provide a connected structure. SOLUTION: The adhesive contains an oligomer (SCO) that is a partly condensed silane coupling agent (A). The adhesive containing the oligomer (SCO) that is the partly condensed silane coupling agent that satisfies an equation (A-1):(A-2)=100:1-100 wherein (A-1) is the area of a single molecule of the silane coupling agent (A) and (A-2) is the area of a condensation product of two molecules of the silane coupling agent (A), which areas are obtained by a GPC (gel permeation chromatography). COPYRIGHT: (C)2003,JPO

2. 发明专利

JP2003109429A CONDUCTIVE PASTE AND CIRCUIT CONNECTING METHOD 审中-公开
公开(公告)号：JP2003109429A
公开(公告)日：2003-04-11
申请号：JP2001303490
申请日：2001-09-28
申请人： HITACHI CHEMICAL CO LTD
发明人： TAKEDA SHINJI , YUSA MASAMI , HIRAI OSAMU , TAGUCHI NORIYUKI , KOKAJI KAZUMI , INADA TEIICHI , YAMAMOTO KAZUNORI
IPC分类号： H05K1/09 , C08K3/02 , C08K7/06 , C08L101/00 , H01B1/22 , H01B1/24 , H05K3/36 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide conductive paste having excellent conductivity and reliability for connection and bringing a satisfactory cost reduction effect, a circuit connecting method, and a multilayer circuit board using it. SOLUTION: This conductive paste contains at least a hollow carbon fiber and a resin, and the conductive paste is used in the circuit connecting method and the multiplayer circuit board.

3. 发明专利

JP2002097443A ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL USING THE SAME, AND CONNECTED BODY 失效
公开(公告)号：JP2002097443A
公开(公告)日：2002-04-02
申请号：JP2000286295
申请日：2000-09-21
申请人： HITACHI CHEMICAL CO LTD
发明人： YANAGAWA TOSHIYUKI , YUSA MASAMI , KATOGI SHIGEKI , MOCHIDA YUKO
IPC分类号： C09J7/00 , C09J129/10 , C09J163/00 , C09J171/00 , C09J201/00 , H01B1/20 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain an adhesive composition, a circuit-connecting material and to provide a connected body which have the excellent workability and make possible a connection with high reliability and a connection between circuits each having a microelectrode under such a curing condition (at 100-120 deg.C, for several tens of seconds) at a low temperature and for a short time as can control the expansion of a base board by means of heating. SOLUTION: The adhesive composition contains essentially, on the basis of the whole adhesive composition, 10-90 wt.% of (A) a photocationically polymerizable compound, 0.05-30 wt.% of (B) a polymerization initiator which produces cationic species by means of the radiation of light containing a wavelength component of mainly 180-750 nm, and 0.05-30 wt.% of (C) a polymerization initiator which produces cationic species mainly by means of heating; the circuit-connecting material contains this adhesive composition and additionally electroconductive particles; and the connected body is such a body obtained by connecting circuit members by using this adhesive composition or this circuit- connecting material.

4. 发明专利

JP2001329240A ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CONNECTING CIRCUIT, CIRCUIT-CONNECTING MATERIAL, CONNECTOR AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001329240A
公开(公告)日：2001-11-27
申请号：JP2000150762
申请日：2000-05-23
申请人： HITACHI CHEMICAL CO LTD
发明人： KATOGI SHIGEKI , YANAGAWA TOSHIYUKI , MOCHIDA YUKO , YUSA MASAMI
IPC分类号： C09J163/00 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition which prevents lowering of reliability of an element caused by corrosion of an adherend consisting of a metal and an inorganic material, can be bonded in a short time at a low temperature, and is excellent in storage stability at room temperature, an adhesive composition for connecting a circuit, a connector and a semiconductor device. SOLUTION: The adhesive composition comprises (a) an epoxy compound and (b) a polymer compound having a number-average mol.wt. of 1,000-100,000 which generates a functional group reactive with the epoxy compound by photoirradiation at 150-750 nm. The polymer compound generating by photoirradiation at 150-750 nm a functional group reactive with an epoxy compound is preferably a compound generating by photoirradiation a group reactive with an epoxy group, that is, a phenolic hydroxyl group, a primary or secondary amino group or a mercapto group.

5. 发明专利

JP2001220551A COMPOSITION HAVING FUNCTION OF IMPROVING DIGNITY OF SCREEN 失效
公开(公告)号：JP2001220551A
公开(公告)日：2001-08-14
申请号：JP2000034349
申请日：2000-02-07
申请人： HITACHI CHEMICAL CO LTD
发明人： SASAKI SHOICHI , TAI SEIJI , NOJIRI TAKESHI , KAWAKAMI HIROYUKI , SHIMAMURA MARIKO , YUSA MASAMI , FUJINAWA MITSUGI
IPC分类号： C09B67/20 , C09D4/00 , C09D7/12 , C09D175/04 , C09D201/00 , C09J4/00 , C09J7/00 , C09J175/04 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide compositions having the function of improving the dignity of a screen which can form, on the surface of a transparent base material, a film which prevents the lowering in image resolution and contributes to the improvement in color purity and the improvement in contrast in the state of retaining sufficient dignity of a screen. SOLUTION: The compositions having the function of improving the dignity of screen comprise (A) a tetrazaporphyrin compound represented by formula (I) (wherein M is Si, Ge or Sn; two Ys are each independently a 6-18C aryloxy group, a 1-22C alkoxy group or the like; and A1, A2, A3, and A4 are each independently a specific aromatic ring), (B) an adhesive composition, and (C) a phthalocyanine compound represented by formula (II) (wherein M is H2 or a metal selected from the group consisting of Zn, Mn, Ti, Cu, Ni, Mg, Pb, Pd, V, Co, Nb, Al Sn, In and Fe, an oxide of the metal or a halide of the metal; and A5, A6, A7, and A8 are each independently a specific aromatic ring).

6. 发明专利

JP2001160671A CIRCUIT CONNECTING MATERIAL 失效
公开(公告)号：JP2001160671A
公开(公告)日：2001-06-12
申请号：JP34317999
申请日：1999-12-02
申请人： HITACHI CHEMICAL CO LTD
发明人： FUJINAWA MITSUGI , YUSA MASAMI , ONO YUTAKA , TAI SEIJI
IPC分类号： H05K1/14 , C09J9/00 , C09J201/00 , G02F1/1345 , H01B1/20 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an electric and electronic circuit connecting material for connecting the circuit electrically at low temperatures in a short time using an ultrasonic wave. SOLUTION: In a connecting method, a first circuit member with a first connection terminal and a second circuit member with a second connection terminal are so arrange that the first connection terminal and the second connection terminal are put opposite and overlapped with the circuit material in between. In this state, the first connection terminal and the second connection terminals are connected electrically using ultrasonic wave. The connecting material contains essentially an adhesive to be hardened by heating or radiation energy and an insulating micro-particle with an area/weight ratio of 0.1 to 500 m2/g.

7. 发明专利

JP2000311968A CHIP-SUPPORT SUBSTRATE FOR SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JP2000311968A
公开(公告)日：2000-11-07
申请号：JP2000115857
申请日：2000-04-12
申请人： SHARP KK , HITACHI CHEMICAL CO LTD
发明人： SODA YOSHIKI , MIYATA KOJI , YAMAZAKI AKIO , INOUE FUMIO , TSUBOMATSU YOSHIAKI , NAKAMURA HIDEHIRO , AWANO YASUHIKO , ICHIMURA SHIGEKI , YUSA MASAMI , IWASAKI YORIO
IPC分类号： H01L23/28 , H01L21/52 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To prevent a package crack and to manufacturing a reliable compact semiconductor package by forming at least one metal pattern for maintaining the flat plate property of an insulation, film-shaped adhesive material being formed later at a part where a semiconductor chip is mounted. SOLUTION: A support substrate is prepared, where a plurality of sets of inner connection parts, development wiring, and outer connection parts are formed by punching into a frame shape using a punching mold. Then, after a die bond film 8 is tentatively glued to the semiconductor chip-mounting region of the support substrate, a semiconductor chip 9 is glued to the specific position of the support substrate. Further, a semiconductor chip electrode and an inner connection part 5 are electrically connected by bonding a gold wire 10, which is loaded into a transfer mold die for sealing each by an epoxy resin 11 for sealing semiconductors. After that, a solder ball 12 is arranged at the outer connection part for melting before finally separating into each package by punching.

8. 发明专利

JP2000256443A POLYMERIZATION METHOD 失效
公开(公告)号：JP2000256443A
公开(公告)日：2000-09-19
申请号：JP5837499
申请日：1999-03-05
申请人： HITACHI CHEMICAL CO LTD
发明人： MARUYAMA KOJI , KATOGI SHIGEKI , YUSA MASAMI
IPC分类号： C08G61/08
摘要： PROBLEM TO BE SOLVED: To temporarily restrain activity of a metathesis polymerization catalyst and to facilitate the handling of the catalyst during polymerization reaction by deactivating the metathesis polymerization catalyst by mixing a coordinative compound having a nitrogen atom with the catalyst and then mixing a metathesis-polymerizable compound with the catalyst to reactivate the catalyst for polymerization. SOLUTION: The metathesis polymerization catalyst represented by formula I and/or II is deactivated by being mixed with a coordnative compound having a nitrogen atom (wherein M is Ru or Os; R and R1 are each H, a 1-20C alkyl group, 2-20C alkenyl group, aryl group, 1-20C carboxylate group, 1-20C alkoxy group, 2-20C alkenylthioxy group, aryloxy group or the like; X and X1 are each an anionic coordinating group; and L and L1 are each a neutral electron donative group). The deactivated catalyst is mixed with a metathesis polymerizable compound and the liquid mixture is heated up to a temperature of not lower than 50 deg.C which is however not higher than a decomposition temperature of the catalyst in order to reactivate the catalyst for polymerizing the metathesis polymerizable compound.

9. 发明专利

JP2000103842A RING-OPENING POLYMER 失效
公开(公告)号：JP2000103842A
公开(公告)日：2000-04-11
申请号：JP27634098
申请日：1998-09-30
申请人： HITACHI CHEMICAL CO LTD
发明人： YUSA MASAMI , KATOGI SHIGEKI , KIKUCHI NOBURU
IPC分类号： C08G61/08
摘要： PROBLEM TO BE SOLVED: To provide a polymer of a norbornene type which has acid anhydride groups and a dispersity, defined by the ratio of wt, average mol.wt. to number average mol.wt., of a specified value and can be modified with a compd. reactive with an acid anhydride group. SOLUTION: This polymer has a dispersity of 1.5 or lower, is represented by formula I, and is obtd. by the ring-opening metathesis polymn. of exo-5- norbornene-2,3-dicarboxylic anhydride. A complex catalyst of formula II contg. a transition metal is used in the ring-opening metathesis polymn. In formula II, M is ruthenium or osmium; X and X1 are each an anionic ligand; L and L1 are each a neutral electron-donating group; and R and R1 are each H or an optionally substd. alkyl or arom. group. The catalyst is used usually in an amt. of 0.0001-20 wt.% of the monomer, The reaction temp. is usually -50 deg.C to 150 deg.C, This polymer can be reacted with a compd. having a photosensitive group to give a photosensitive resin or can be reacted with an epoxy resin to produce a three-dimensional structure.

10. 发明专利

JP2000072857A PRODUCTION OF CYCLO-OLEFIN POLYMER 失效
公开(公告)号：JP2000072857A
公开(公告)日：2000-03-07
申请号：JP24445898
申请日：1998-08-31
申请人： HITACHI CHEMICAL CO LTD
发明人： YUSA MASAMI , KATOGI SHIGEKI , KIKUCHI NOBURU
IPC分类号： C08G61/06
摘要： PROBLEM TO BE SOLVED: To obtain a cyclo-olefin polymer having a desired molecular weight that can reduce the amount of unreacting monomer, can control its molecular weight with a reduced amount of a catalyst by admixing a metathesis polymerization catalyst and a metathesis polymerizable cyclo-olefin to the reaction system and allowing them to react with each other. SOLUTION: The objective polymer is obtained by introducing (A) a metathesis catalyst, preferably represented by formula I [M is ruthenium or the like; X and X1 are each an anionic ligand; L and L1 are each a neutral electron donor; R and R1 are each H, a (substituted) alkyl or the like] (for example, ruthenium carbene catalyst of formula II), (B) a metathesis polymerizable cyclo- olefin, for example, 2-norbornene or the like and (C) a compound bearing one or more vinyl ester groups in its molecule (for example, vinyl acetate) into the reaction system and allowing them to react with each other in an organic solvent, for example, toluene or the like, preferably at 0-100 deg.C usually for 1 minute to 48 hours.

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