专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPS62234337A FILM CARRIER FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62234337A
公开(公告)日：1987-10-14
申请号：JP7773786
申请日：1986-04-04
申请人： HITACHI CABLE
发明人： SATO HIDEAKI , SUZUKI KATSUMI , ISHIKAWA TETSUO , YAMAGISHI RYOZO
IPC分类号： H01L23/50 , H01L21/60 , H01L23/48
摘要： PURPOSE:To conduct positioning with high precision by forming a guide mark for positioning to an arbitrary section on an insulating film to which a lead is not shaped. CONSTITUTION:Copper foil tapes 5 are slit and cladded on a polyimide film (with a device hole and a sprocket hole) by adhesives, and a film carrier 1 in which predetermined leads and the copper foil patterns of cross-shaped guide marks 7 are shaped through a photoetching method is prepared. Inner leads are bonded with an IC chip 9 by a full automatic inner-lead bonder, using the guide marks 7 as indices to the film carrier 1. Accordingly, positioning having high accuracy can be performed, thus improving the yield of the bonding of the inner leads, then enhancing the reliability of electrical connections.

2. 发明专利

JPS62156276A METHOD FOR REMOVING PHOTORESIST 失效
公开(公告)号：JPS62156276A
公开(公告)日：1987-07-11
申请号：JP29767985
申请日：1985-12-26
申请人： HITACHI CABLE
发明人： ISHIKAWA TETSUO , SUZUKI KATSUMI , SATO HIDEAKI , YAMAGISHI RYOZO
IPC分类号： C23F1/00
摘要： PURPOSE:To perfectly remove a photoresist strippable by swelling from the substrate of a lead frame by stripping the photoresist in a stripping soln. under ultrasonic vibration. CONSTITUTION:A metallic material coated with a photoresist strippable by swelling is immersed in a stripping soln. During or after the swelling of the photoresist, ultrasonic vibration is applied to the metallic material and the photoresist is stripped. Thus, the photoresist is perfectly removed from the metallic material such as the substrate of a lead frame.

3. 发明专利

JPS58193391A Method of plating bundle of fiber 失效
标题翻译：光纤敷设方法
公开(公告)号：JPS58193391A
公开(公告)日：1983-11-11
申请号：JP7355682
申请日：1982-04-30
申请人： Hitachi Cable Ltd
发明人： ISHIKAWA TETSUO , SUZUMURA TAKASHI , YAMAGISHI RIYOUZOU , YOSHIDA HIROMICHI
IPC分类号： C25D7/00 , C23C18/16 , C23C18/31 , C23C18/34 , C23C18/40 , C25D7/06 , D06B3/02 , D06M11/00 , D06M11/83 , D06M11/84 , G09G5/10
摘要： PURPOSE: To plate each of fibrous strands with uniform thickness without the formation of damages or disconnection in the fibrous strands, by letting the bundle of fibers run along the same direction as that of the stream of a plating liquid ejected through a rectangular ejection opening, and opening the bundle of fibers by the flow of the plating liquid.
CONSTITUTION: Two or more nozzles 4 having rectangular ejection openings are provided at the side of inroducing the bundle 1 of fibers inside a plating tank 3, so that a plating liquid is sprayed in parallel with the direction of carrying the bundle 1 of fibers and circulated toward the side of discharging the bundle of fibers. In addition, a rectifying plate 6 having many small holes is provided at a proper domain from the vicinity of the nozzles 4 to the direction of discharging the bundle 1 of fibers, to define a parallel passage for the parallel stream of the plating liquid from the nozzles 4. Thus, the bundle 1 of fibers being twisted is sufficiently opened by the stream of the sprayed plating liquid, and each of fibrous strands can be stably plated with uniform thickness by the parallel stream of the plating liquid.
COPYRIGHT: (C)1983,JPO&Japio
摘要翻译：目的：通过使纤维束沿着与通过矩形喷射口喷射的电镀液流的方向相同的方向延伸，以均匀厚度平板化每个纤维线，而不会在纤维束中形成损伤或断开，并通过电镀液的流动来打开纤维束。构成：在引入电镀槽3内的纤维束1的一侧设置两个以上具有矩形喷射口的喷嘴4，使得电镀液体与携带纤维束1的方向平行地喷射并循环朝向排出纤维束的一侧。此外，具有许多小孔的整流板6设置在从喷嘴4附近到排出纤维束1的方向的适当范围，以限定平行流动的电镀液体因此，被扭转的纤维束1被喷镀的液体的液体充分地打开，并且每个纤维束可以通过电镀液体的平行流稳定地均匀地镀覆均匀的厚度。

4. 发明专利

JPS56105469A PRODUCTION OF COVERING PIPE FOR NUCLEAR FUEL 失效
公开(公告)号：JPS56105469A
公开(公告)日：1981-08-21
申请号：JP682880
申请日：1980-01-25
申请人： HITACHI LTD , HITACHI CABLE
发明人： MURAKAMI KANJI , WAJIMA MOTOYO , IMAHASHI HIROMICHI , KAWAHARA AKIRA , MATSUI TSUNEO , ISHIKAWA TETSUO
IPC分类号： C23C18/40 , C23C18/16 , G21C3/00 , G21C3/06 , G21C3/20
摘要： PURPOSE:To form a copper film not generating small blow holes by having a plating solution to contain polyethylene glycol when chemical copper plating is applied to form copper film on the internal surface of a covering pipe. CONSTITUTION:The internal surface of Zr or Zr alloy is made rough and treated with steam atmosphere to form oxide film of Zr. This is cut to the specified length and brought into contact with an aqueous acidic solution contg. palladium chloride and stannous chloride to cause catalyst for chemical copper plating to deposit on the inner surface of the pipe. Then, the pipe is plated by circulating through the pipe a chemical copper plating solution contg. more than 0.5g/l of polyethylene glycol, and is washed and dried, then heat-treated under reduced pressure, and gradually cooled. The process provides a copper barrier type nuclear fuel covering pipe free from minor blow holes.

5. 发明专利

JPS5662955A MANUFACTURE OF NUCLEAR FUEL CLADDING PIPE 失效
公开(公告)号：JPS5662955A
公开(公告)日：1981-05-29
申请号：JP13776079
申请日：1979-10-26
申请人： HITACHI LTD , HITACHI CABLE
发明人： MURAKAMI KANJI , WAJIMA MOTOYO , ISHIKAWA TETSUO
IPC分类号： C23C18/40 , G21C3/20
摘要： PURPOSE:To obtain a swelling-free copper barrier type nuclear fuel cladding pipe with high adhesion by forming an oxide film on the inner wall of a Zr pipe or the like after roughening followed by treatment with a noble metal-contg. catalyst soln. for chemical plating and plating with a copper plating soln. contg. 2,2'-dipyridyl. CONSTITUTION:The inner wall of a pipe made of Zr or Zr alloy is roughened and oxidized to form an oxide film. The film is then treated with a noble metal salt- contg. chemical catalyst soln. of stannous chloride or the like and plated with a chemical copper plating soln. contg. at least 3-1,000mg/l 2,2'-dipyridyl to form a copper plated film on the Zr oxide film. Thus, a swelling-free copper barrier type nuclear fuel cladding pipe with high adhesion is obtd.

6. 发明专利

JPH0632366B2 失效
公开(公告)号：JPH0632366B2
公开(公告)日：1994-04-27
申请号：JP15995285
申请日：1985-07-19
申请人： HITACHI CABLE
发明人： ISHIKAWA TETSUO , YAMAGISHI RYOZO , SUGYAMA MITSUHIKO
IPC分类号： H05K3/24 , C25D7/00 , C25D17/06 , C25D21/00 , C25D21/10 , H05K3/18

7. 发明专利

JPH0346584B2 失效
公开(公告)号：JPH0346584B2
公开(公告)日：1991-07-16
申请号：JP8823083
申请日：1983-05-19
申请人： HITACHI CABLE
发明人： YOSHIDA HIROMICHI , KAYANE KOICHI , SUZUMURA TAKASHI , YAMAGISHI RYOZO , YOSHIOKA OSAMU , ISHIKAWA TETSUO , SATO HIDEAKI
IPC分类号： C25D7/00 , C25D7/06 , D06M11/00 , D06M11/83 , D06M11/84 , D06M101/00 , D06M101/16 , D06M101/30 , D06M101/34 , D06M101/40

8. 发明专利

JPS6263681A SYSTEM FOR MONITORING ETCHING RATE 失效
公开(公告)号：JPS6263681A
公开(公告)日：1987-03-20
申请号：JP20281685
申请日：1985-09-13
申请人： HITACHI CABLE
发明人： SUZUKI KATSUMI , ISHIKAWA TETSUO , SATO HIDEAKI
IPC分类号： C23F1/00
摘要： PURPOSE:To easily monitor an etching rate and to make a criterion exact by impressing an AC voltage of a prescribed frequency between a material to be etched and counter electrode and measuring the polarization resistance. CONSTITUTION:The electrode which is the material to be etched and the counter electrode of the material electrochemically nobler than said material are immersed in an etching soln., then the AC voltage of a low frequency and AC voltage of a high frequency are impressed between the above-mentioned two electrodes. The above-mentioned low frequency is so adjusted that the impedance by the interface capacity of the electrodes and the etching soln. is made substantially higher than the polarization resistance of the electrodes. The above- mentioned high frequency is so adjusted that the impedance by the above- mentioned interfacial capacity is made substantially smaller than the polarization resistance of the electrodes. The above-mentioned polarization resistance is then measured and the etching rate of the material to be etched is monitored.

9. 发明专利

JPS6218059A MANUFACTURE OF LEAD FRAME 失效
公开(公告)号：JPS6218059A
公开(公告)日：1987-01-27
申请号：JP15749485
申请日：1985-07-17
申请人： HITACHI CABLE
发明人： SATO HIDEAKI , ISHIKAWA TETSUO , SUZUKI KATSUMI , YAMAGISHI RYOZO
IPC分类号： H01L23/50 , H01L23/48 , H01L23/495
摘要： PURPOSE:To obtain a lead frame whose lead tips are formed with high dimensional accuracy by a method wherein a photoresist layer is so formed as to have protrusions at the positions corresponding to the corners of the lead tips and is etched. CONSTITUTION:A lead frame 1 has an IC-mounting base 7 on which a semicon ductor integrated circuit device is mounted at its center and lead tips 5 which are connected to a number of electrodes provided on the semiconductor pellet of the semiconductor integrated circuit device by wire bonding. Photoresist is applied to nearly the whole surface of a metal plate 2 which may be made of iron, iron alloy, copper, alloy or the like. Then the photoresist is subjected to exposure and development to form a photoresist layer 3 of a required pattern on the metal plate 2. The parts of the photoresist layers 3 corresponding to the lead tips 5 are so formed as to have protrusions 4 at corners 6. With those protrusions 4, the rectangular lead tips 5 which do not have round corners can be obtained after etching.

10. 发明专利

JPS60238498A ELECTROPLATING METHOD OF BUNDLED CARBON FIBER 失效
公开(公告)号：JPS60238498A
公开(公告)日：1985-11-27
申请号：JP9404384
申请日：1984-05-10
申请人： HITACHI CABLE
发明人： ISHIKAWA TETSUO , YOSHIOKA OSAMU , YAMAGISHI RIYOUZOU , KAYANE KOUICHI , YOSHIDA HIROMICHI
IPC分类号： C25D7/00 , D06M11/00 , D06M11/83 , D06M101/00 , D06M101/40
摘要： PURPOSE:To plate continuously and stably the filament of bundled carbon fibers in uniform thickness with metal by shielding the unopened fiber part of bundled carbon fibers from an electric current, and electroplating only the opened fiber part after the second plating vessel of plural plating vessels. CONSTITUTION:Bundled carbon fibers 1 are passed through plural plating vessels 2, and a metal plating bath liquid 3 is sent by a pump 9 from a recovery tank 8 to an ejection mechanism 4, and spouted in the traveling direction of the bundled carbon fibers 1. An electrolytic current is impressed on an anode plate 6 and a cathode column 7 which is in contact with the bundled carbon fibers 1 in the plating bath liquid 3, and each filament of the bundled carbon fibers 1 traveling between rectifying plates 3 is electroplated. A current shielding plate 10 is provided to the unopened fiber part of the bundled carbon fibers 1 after the second plating vessel 2 to impede the plating, and only the opened fiber part is plated. Accordingly, each filament can be plated in uniform thickness.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式