专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH0368118B2 失效
公开(公告)号：JPH0368118B2
公开(公告)日：1991-10-25
申请号：JP3604685
申请日：1985-02-25
申请人： HITACHI CABLE
发明人： SUZUMURA TAKASHI , KOSAKA HIROYUKI , YOSHIDA HIROMICHI , OOTAKA TATSUYA , SATO KOSUKE
IPC分类号： C25D5/02 , H01L23/48 , H01L23/50

2. 发明专利

JPH0250836B2 失效
公开(公告)号：JPH0250836B2
公开(公告)日：1990-11-05
申请号：JP15707282
申请日：1982-09-09
申请人： HITACHI CABLE
发明人： OOTA TAKAYUKI , ABE MASAHIKO , OOTAKE HIROO , YOSHIDA ZENICHI , KODAMA HIROFUMI , YOSHIDA HIROMICHI
IPC分类号： B23K20/00 , B23K20/04

3. 发明专利

JPH02267820A DEVICE AND METHOD FOR COATING ENAMEL WIRE 失效
公开(公告)号：JPH02267820A
公开(公告)日：1990-11-01
申请号：JP8757189
申请日：1989-04-06
申请人： HITACHI CABLE
发明人： YOSHIDA HIROMICHI
IPC分类号： H01B13/16
摘要： PURPOSE:To obtain an enamel wire having a uniform coat thickness by provid ing a device for imparting one or more rotations to a core wire while once passing the core wire on at least either of the inlet part or outlet part of a horizontal baking furnace. CONSTITUTION:To make an enamel wire 2, a core wire 1 is passed to an enam el coating part 3 through a guide roller 5 and baked in a horizontal baking furnace 4, the baked enamel coated wire is again passed to the enamel coating part 3 through the guide roller 6, and baking is repeated in the baking furnace 4, whereby the enamel wire 2 is obtained. Rotation adding parts 9 are provided on the inlet part and outlet part of the baking furnace 4, and impart one or more rotations to the core wire or enamel coated wire 1 while the core wire or enamel coated wire 1 is once passed. Hence, an enamel wire having a uni form coat thickness can be obtained even by the horizontal baking furnace.

4. 发明专利

JPH02159393A HIGH-SPEED PARTIAL PLATING DEVICE 失效
公开(公告)号：JPH02159393A
公开(公告)日：1990-06-19
申请号：JP31309388
申请日：1988-12-12
申请人： HITACHI CABLE
发明人： OTAKA TATSUYA , YOSHIDA HIROMICHI
IPC分类号： C25D5/02
摘要： PURPOSE:To form a plating film having a uniform thickness by pressing soluble anodes by springs according to the consumption of anodes to maintain the specified spacing from the material to be plated at the time of shielding the surface of the plate object to be plated with a mask having apertures of a specific shape and subjecting the object to partial plating by using the anodes. CONSTITUTION:The metallic plate to be plated is superposed on the mask 5 having the aperture patterns 6 of the prescribed shape, and a plating liquid is ejected from nozzles 8 through the aperture patterns 6 of the mask 5 to the metallic plate to be plated as a cathode while the plate is kept moved in a specified direction to execute plating in the aperture pattern parts. The soluble anodes consisting of the same metal as the plating metal are used as the anodes 4 in the area of at least twice the area of the plating surface. The anodes are pressed upward by the springs 12 to ascend according to the consumption thereof and are thereby pressed to noncontinuous anode positioning pieces 10 to maintain always the specific spacing with the metallic plate to be plated as the cathode. The aperture pattern-shaped plating is thus formed on the surface of the object to be plated at the uniform thickness.

5. 发明专利

JPH0218399B2 失效
公开(公告)号：JPH0218399B2
公开(公告)日：1990-04-25
申请号：JP24935384
申请日：1984-11-26
申请人： HITACHI CABLE
发明人： YOSHIDA HIROMICHI , SUZUMURA TAKASHI , KAYANE KOICHI , YAMAGISHI RYOZO , YOSHIOKA OSAMU , OKABE NORIO , SUGYAMA MITSUHIKO , NAKANO FUMIO
IPC分类号： C25D7/06 , C25D5/02 , C25D5/08

6. 发明专利

JPH0149797B2 失效
公开(公告)号：JPH0149797B2
公开(公告)日：1989-10-26
申请号：JP3604785
申请日：1985-02-25
申请人： HITACHI CABLE
发明人： KAYANE KOICHI , YOSHIDA HIROMICHI , HAGITANI SHIGEO , OKABE NORIO
IPC分类号： C25D5/08 , C25D7/06 , C25D17/00

7. 发明专利

JPH01197910A EASILY COOLED OXIDE CERAMIC SUPERCONDUCTOR 失效
公开(公告)号：JPH01197910A
公开(公告)日：1989-08-09
申请号：JP2153188
申请日：1988-02-01
申请人： HITACHI CABLE
发明人： OTAKA TATSUYA , NUMAJIRI FUMIYA , YOSHIDA HIROMICHI
IPC分类号： B28B1/00 , H01B12/16
摘要： PURPOSE:To efficiently cool a superconductor and feed a large current by providing many projections at the end section. CONSTITUTION:An oxide ceramic superconductor 1 is formed into a shape with many projections at the end section. The shape of the oxide ceramic superconductor 1 is not limited to a sheet shape or a small cross section area, any shape with the cross section area corresponding to the required current value may be used. When the oxide ceramic superconductor 1 is used in a refrigerant such as liquid nitrogen, the surface area of the oxide ceramic superconductor 1, i.e., the contact area with the refrigerant, is increased, the oxide ceramic superconductor is efficiently cooled. In addition, a high current can be fed under the restriction for use at the critical current density or below.

8. 发明专利

JPS6343504B2 失效
公开(公告)号：JPS6343504B2
公开(公告)日：1988-08-31
申请号：JP7355682
申请日：1982-04-30
申请人： HITACHI CABLE
发明人： ISHIKAWA TETSUO , SUZUMURA TAKASHI , YAMAGISHI RYOZO , YOSHIDA HIROMICHI
IPC分类号： C25D7/00 , C23C18/16 , C23C18/31 , C23C18/34 , C23C18/40 , C25D7/06 , D06B3/02 , D06M11/00 , D06M11/83 , D06M11/84 , G09G5/10

9. 发明专利

JPS6369257A MANUFACTURE OF LEAD PIN WITH SOLDER 失效
公开(公告)号：JPS6369257A
公开(公告)日：1988-03-29
申请号：JP21301886
申请日：1986-09-10
申请人： HITACHI CABLE
发明人： OTAKE HIROO , KOSAKA HIROYUKI , YOSHIDA HIROMICHI
IPC分类号： H01L23/50
摘要： PURPOSE:To reduce the number of steps by applying bonding by conducting resistance heating and brazing during header working step without using a heating atmosphere furnace. CONSTITUTION:One end of a long wire blank 1 is chucked by split dies 2, and punched by a punch 3' to be worked by a header, thereby manufacturing a lead pin 8 with a head. A thicker insulating plate 5 than the head of the pin 8 is disposed fixedly to surround the head of the pin 8, and a sheetlike brazing material 4 is disposed in contact on the plate 5. With the plate 5 directly as a die the material 4 is punched by the punch 3 on the head of the pin 8 in the same diameter. After punching, a current flows through the pin 8 and the material 4 between the dies 2 and the punch 3 to melt the material 4 by conducting resistance heating to be fusion-bonded to the head of the pin 8 to be bonded.

10. 发明专利

JPS62205652A IC PACKAGE 失效
公开(公告)号：JPS62205652A
公开(公告)日：1987-09-10
申请号：JP4805486
申请日：1986-03-05
申请人： HITACHI CABLE
发明人： OTAKA TATSUYA , SUZUMURA TAKASHI , YOSHIDA HIROMICHI
IPC分类号： H01L23/29 , H01L23/16 , H01L23/31 , H01L23/30
摘要： PURPOSE:To prevent the yield of cracks in a resin, by providing an elastic body layer, which surrounds a semiconductor integrated circuit element in a molding resin. CONSTITUTION:An elastic body layer 8 is provided so as to surround an IC element 5 and a mounting stage 3 directly. The outer surface of the elastic body layer 8 is packaged with a resin 7. The elastic body layer 8 can be provided so as to surround the tip part of each lead 4. The thickness of the elastic layer 8 can be relatively thin and can be, e.g., about 10-50mum when the layer is formed by an applying method. The elastic body layer 8 absorbs inner stress (thermal expansion) and prevents the yield of cracks. Even if the cracks 9 are yielded in the resin 7 in the elastic body layer 8, the extension of the crack is stopped by the presence of the elastic body layer 8. Therefore, the cracks 9 do not reach the outer surface of the resin.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式