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1. 发明专利

JP2005060219A Silica sol and manufacturing method therefor 有权
标题翻译：二氧化硅溶胶及其制造方法
公开(公告)号：JP2005060219A
公开(公告)日：2005-03-10
申请号：JP2004217655
申请日：2004-07-26
申请人： Fuso Chemical Co Ltd , 扶桑化学工業株式会社
发明人： YAMAKAWA TAKAHIRO , TOMOTA YOSHIAKI , TOYAMA KEIJI , SAKAI MASATOSHI
IPC分类号： C01B33/141
摘要： PROBLEM TO BE SOLVED: To prepare a silica sol which can be suitably used as a material such as a polishing material for an electronic material and a silicon wafer requiring high purity and which has excellent stability of the sol so that the silica concentration is easily increased and can be controlled to a level equal to or higher than a silica sol produced from water glass, and to provide a manufacturing method therefor.
SOLUTION: The silica sol has silica fine particles dispersed in water and has 10 to 1,000 nm average secondary particle size of the silica fine particles, ≤1 ppm metal impurity content, and 10 to 50 wt.% silica concentration. The stable method for manufacturing the silica sol includes processes of: (a) subjecting a hydrolyzable silicon compound to hydrolysis and polycondensation to produce a silica sol; and (b) concentrating the silica sol obtained in the process (a) to a specified silica concentration or lower according to the particle size of the silica sol, substituting water for a dispersion medium and an alkali catalyst in the silica sol and controlling the pH to 6.0 to 9.0.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了制备适合用作电子材料用抛光材料和需要高纯度并且具有优异的溶胶稳定性的硅晶片等材料的二氧化硅溶胶，使得二氧化硅浓度容易地增加并且可以控制到等于或高于由水玻璃制成的硅溶胶的水平，并提供其制造方法。解决方案：二氧化硅溶胶具有分散在水中的二氧化硅微粒，二氧化硅微粒的平均二次粒径为10〜1000nm，金属杂质含量≤1ppm，二氧化硅浓度为10〜50重量％。制造二氧化硅溶胶的稳定方法包括以下工序：（a）使水解性硅化合物进行水解和缩聚反应，生成二氧化硅溶胶; 和（b）根据二氧化硅溶胶的粒度，将方法（a）中得到的二氧化硅溶胶浓缩至规定的二氧化硅浓度以下，在二氧化硅溶胶中取代水分散介质和碱催化剂，控制pH 至6.0〜9.0。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005060217A Silica sol and manufacturing method therefor 有权
标题翻译：二氧化硅溶胶及其制造方法
公开(公告)号：JP2005060217A
公开(公告)日：2005-03-10
申请号：JP2004216371
申请日：2004-07-23
申请人： Fuso Chemical Co Ltd , 扶桑化学工業株式会社
发明人： YAMAKAWA TAKAHIRO , TOMOTA YOSHIAKI , TOYAMA KEIJI , SAKAI MASATOSHI
IPC分类号： C01B33/145 , C09K3/14
摘要： PROBLEM TO BE SOLVED: To prepare a silica sol which can be suitably used as a material such as a polishing material for an electronic material and a silicon wafer requiring high purity, which has uniform particle diameters of silica fine particles, and which has excellent long-term storage stability, an increased concentration of the silica fine particles in a reaction solution and excellent productivity, and to provide a manufacturing method therefor.
SOLUTION: The method for manufacturing the silica sol is characterized in that an organic solvent containing tetramethoxy silane and a solvent containing an alkali catalyst and water are added to an organic solvent containing an alkali catalyst and water, thereby subjecting the tetramethoxy silane to hydrolysis and polycondensation to manufacture the silica sol. The silica sol has silica fine particles dispersed in water, and has 20 to 1,000 nm average secondary particle size of the silica fine particles, ≤1 ppm metal impurity content, and 10 to 50 wt.% silica concentration.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了制备适合用作电子材料用研磨材料的硅溶胶和需要高纯度的硅晶片，其具有均匀的二氧化硅微粒的粒径，并且其中具有优异的长期储存稳定性，反应溶液中二氧化硅细颗粒的浓度增加和生产率优异，并提供其制备方法。解决方案：制备二氧化硅溶胶的方法的特征在于，将含有四甲氧基硅烷和含有碱催化剂和水的溶剂的有机溶剂加入到含有碱催化剂和水的有机溶剂中，由此使四甲氧基硅烷水解和缩聚以制造硅溶胶。硅溶胶具有分散在水中的二氧化硅微粒，二氧化硅微粒的平均二次粒径为20〜1000nm，金属杂质含量≤1ppm，二氧化硅浓度为10〜50重量％。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2002045681A COLLOIDAL SILICA SLURRY 失效
公开(公告)号：JP2002045681A
公开(公告)日：2002-02-12
申请号：JP2000236454
申请日：2000-08-04
申请人： FUSO CHEMICAL CO LTD
发明人： MATSUMURA SHIGETOYO , OKADA YUKIO , MANAKI TATSUO , TOYAMA KEIJI , SAKAI MASATOSHI
IPC分类号： C01B33/14 , B01J13/00 , C01B33/141 , C01B33/145 , C09K3/14
摘要： PROBLEM TO BE SOLVED: To provide colloidal silica slurry which gives no adverse influence such as corrosion to a silica wafer and wiring materials on the silica wafer, further suppresses the generation of microorganisms, has high preservation stability due to excellent grain size stability of colloidal particles and thereby can continuously use for a long period. SOLUTION: The colloidal silica slurry is distinguished by being produced by adding 5 to 100 ppm of hydrogen peroxide to the colloidal silica.

4. 发明专利

JP2002050594A COLLOID-LIKE SILICA SLURRY 失效
公开(公告)号：JP2002050594A
公开(公告)日：2002-02-15
申请号：JP2000236453
申请日：2000-08-04
申请人： FUSO CHEMICAL CO LTD
发明人： MATSUMURA SHIGETOYO , OKADA YUKIO , MANAKI TATSUO , TOYAMA KEIJI , SAKAI MASATOSHI
IPC分类号： A01N25/04 , A01N25/08 , A01N31/08 , A01N33/12 , A01N35/06 , A01N43/36 , A01N43/64 , A01N43/78 , A01N43/80 , A01N47/44 , B24B37/00 , C09K3/14 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a colloid-like silica slurry which will not adversely influence, such as corrosion to a silicon wafer and a wiring material on the silicon wafer, suppresses the occurrence of microbes, whose preservation stability is high, since the particle size stability of colloid particles is superior and which can be used continuously. SOLUTION: Colloid-like silica slurry which includes colloid-like silica prepared from low metal silica sol and antibacterial/biocide and whose pH is 6.0-8.0 is supplied.

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