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1. 发明专利

JP2011009335A Solder joint structure, electronic device using the same, and solder joint method 审中-公开
标题翻译：焊接接头结构，使用其的电子器件和焊接接头方法
公开(公告)号：JP2011009335A
公开(公告)日：2011-01-13
申请号：JP2009149532
申请日：2009-06-24
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TANAKA HISAO , EMOTO SATORU , NAESHIROZAWA KENICHI , MATSUSHIMA NANA , MASUYAMA TAKUMI
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K3/363 , G11B5/4846 , H05K3/3452 , H05K2201/0373 , H05K2201/058 , H05K2201/098 , H05K2201/10234 , H05K2201/10992 , H05K2201/2036
摘要： PROBLEM TO BE SOLVED: To prevent a short circuit between terminals due to solders.SOLUTION: A terminal joining structure includes: a first terminal part provided with a plurality of first terminal conductors adjacent to each other; and a second terminal part arranged to face the first terminal part and provided with second terminal conductors joined to the first terminal conductors. The terminal joint structure also includes: solders electrically connecting the first terminal conductors to the second terminal conductors; and a means for suppressing the flow of the solders. The means for suppressing the flow of the solders is a gap adjusting member arranged between the first terminal part and the second terminal part. The flow of the solders caused by the approach of the first terminal part and the second terminal part is suppressed by the presence of the gap adjusting member, and a short circuit is prevented.
摘要翻译：要解决的问题：为了防止由于焊料引起的端子之间的短路。解决方案：端子接合结构包括：第一端子部分，设置有彼此相邻的多个第一端子导体; 以及第二端子部，其布置成面对所述第一端子部并且设置有连接到所述第一端子导体的第二端子导体。端子接头结构还包括：将第一端子导体电连接到第二端子导体的焊料; 以及抑制焊料流动的手段。用于抑制焊料流动的装置是布置在第一端子部分和第二端子部分之间的间隙调节部件。由于第一端子部和第二端子部的接近而引起的焊料的流动被间隙调整部件的存在抑制，并且防止了短路。

2. 发明专利

JP2013251449A Heat transfer cap, repair device, and repair method 审中-公开
标题翻译：热转印盖，修理装置和维修方法
公开(公告)号：JP2013251449A
公开(公告)日：2013-12-12
申请号：JP2012126212
申请日：2012-06-01
申请人： Fujitsu Ltd , 富士通株式会社
发明人： OKADA TORU , KOBAYASHI HIROSHI , MASUYAMA TAKUMI
IPC分类号： H05K3/34 , H01L21/60 , H01L25/04 , H01L25/18
CPC分类号： F28F9/00 , F21V33/0084 , H01L23/36 , H01L23/4093 , H01L2224/16 , H01L2224/16225 , H01L2924/15311 , H01L2924/19105 , H05K3/225 , H05K13/0486 , H05K2203/176
摘要： PROBLEM TO BE SOLVED: To provide a heat transfer cap which unfailingly supplies heat to a solder joint part of an electronic component even when a multi-chip package is included in a wiring board as an electronic component joined thereto by solder, and to provide a repair device including the heat transfer cap.SOLUTION: A heat transfer cap 18 includes a cap part 18A which is attached to an electronic component joined to a wiring board by solder and has a side wall 18b contacting with a side surface of the electronic component during heating; and a ring part 18B attached to the outer side of the side wall of the cap part and having a linear expansion coefficient smaller than that of the cap part.
摘要翻译：要解决的问题：即使当多芯片封装被包括在作为通过焊料连接到其上的电子部件的布线板中时，提供一种向电子部件的焊接部供应热量的传热帽，并且提供一种包括传热帽的修理装置。解决方案：传热帽18包括帽部分18A，帽部分18A通过焊料附接到与布线板接合的电子部件，并且具有与电子部件的侧表面接触的侧壁18b 加热; 以及安装在帽部的侧壁的外侧并具有比帽部的线膨胀系数小的线膨胀系数的环部18B。

3. 发明专利

JP2013214568A Wiring board and wiring board manufacturing method 审中-公开
标题翻译：接线板和接线板制造方法
公开(公告)号：JP2013214568A
公开(公告)日：2013-10-17
申请号：JP2012083175
申请日：2012-03-30
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KOBAYASHI HIROSHI , ISHIKAWA NAOKI , EMOTO SATORU , OKADA TORU , MASUYAMA TAKUMI
IPC分类号： H05K3/46 , H01L23/12 , H05K3/34
CPC分类号： H05K1/0271 , H01L2924/15311 , H01L2924/181 , H05K3/3436 , H05K2201/068 , H05K2201/10734 , H05K2201/2009 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a wiring board and the like which has improved pressure resistance against stress at a solder joint part and improved long-term reliability.SOLUTION: A wiring board assembly 1 comprises: a wiring board 2 including a plurality of insulation substrates 11 which include an insulation layer 12 and a wiring layer 13, and pads 15 formed on the insulation substrate 11; and a semiconductor component 3 joined on the pads 15 by solder bumps 16. The wiring board 2 includes a reinforcement member 40 which has a thickness thinner than that of the insulation layer 12; and has a thermal expansion coefficient smaller than a thermal expansion coefficient of each of the wiring layer 13 and the insulation layer 12; and has a high Young's modulus.
摘要翻译：要解决的问题：提供一种在焊接部分具有改善的抗压力抵抗性并提高长期可靠性的布线板等。解决方案：布线板组件1包括：布线板2，其包括多个绝缘层包括绝缘层12和布线层13的基板11和形成在绝缘基板11上的焊盘15; 以及通过焊料凸块16接合在焊盘15上的半导体部件3.布线基板2具有比绝缘层12的厚度薄的加强部件40。并且具有小于布线层13和绝缘层12中的每一个的热膨胀系数的热膨胀系数; 并具有较高的杨氏模量。

4. 发明专利

JP2014063835A Circuit board device and electronic apparatus 有权
标题翻译：电路板设备和电子设备
公开(公告)号：JP2014063835A
公开(公告)日：2014-04-10
申请号：JP2012207341
申请日：2012-09-20
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MASUYAMA TAKUMI , EMOTO SATORU , OKADA TORU , KOBAYASHI HIROSHI
IPC分类号： H05K1/02
CPC分类号： H05K1/0271 , H05K3/3436 , H05K2201/2009
摘要： PROBLEM TO BE SOLVED: To achieve downsizing of a reinforcement member in a circuit board device and an electronic apparatus, and to improve compression resistance and long-time reliability of electronic component bonding parts.SOLUTION: A circuit board device 1 comprises: a circuit board 10; an electronic component (semiconductor device 21) bonded to a first surface 10a of the circuit board 10 via electronic component bonding parts 40 which are positioned over a rectangular region R1; and reinforcement members 30 arranged on any of four corners of a rectangular region R2 on a second surface 10b of the circuit board 10, which is located on a reverse side of the rectangular region R1 on the first surface 10a. The reinforcement member 30 includes a stress reception part 31 having an end 31a on the outside in a diagonal direction D of the rectangular region R2 on the second surface 10b located beyond a corner of the rectangular region R2 in the diagonal direction D and a stress dispersion part 32 spreading like a fan or almost like a fan with the stress reception part 31 serving as a fan vertex toward an inside in the diagonal direction D.
摘要翻译：要解决的问题：为了实现电路板装置和电子设备中的加强构件的小型化，并且提高电子部件接合部件的抗压缩性和长时间可靠性。解决方案：电路板装置1包括：电路板 10; 电子部件（半导体装置21），经由位于矩形区域R1上的电子部件接合部40接合到电路基板10的第一面10a; 以及布置在电路板10的第二表面10b上的矩形区域R2的四个角中的任一个上的加强构件30，其位于第一表面10a上的矩形区域R1的相反侧。加强构件30包括应力接收部31，其在第二表面10b上的矩形区域R2的对角方向D的外侧具有端部31a，该第二表面10b位于对角方向D上的矩形区域R2的角部之外，应力分散部分32像风扇一样扩散，或者几乎像风扇一样，其中应力接收部分31用作朝向对角线方向D的内部的风扇顶点。

5. 发明专利

JP2013109671A Method for determining reinforcement positions of circuit board, and board assembly 有权
标题翻译：确定电路板加固位置的方法和板组件
公开(公告)号：JP2013109671A
公开(公告)日：2013-06-06
申请号：JP2011255535
申请日：2011-11-22
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KOBAYASHI HIROSHI , EMOTO SATORU , OKADA TORU , KITAJIMA MASAYUKI , MASUYAMA TAKUMI
IPC分类号： G06F17/50 , H05K1/02 , H05K1/18 , H05K3/00
CPC分类号： G06F17/5009 , G06F17/5086 , H01L24/10 , H05K1/0271 , H05K3/0005
摘要： PROBLEM TO BE SOLVED: To determine a minimum necessary countermeasure for reducing warpage in a circuit board on which studs are arranged around an electronic component.SOLUTION: A method for determining reinforcement positions of a circuit board sets a numerical model of a circuit board with an electronic component mounted on its top surface by a plurality of bumps, and reinforcement members adhered on its reverse surface in positions corresponding to the bumps disposed at corners of the electronic component. Then, information about studs that are arranged around the electronic component and fix the circuit board to a housing of an electronic apparatus is imported to the numerical model, and simulation is performed to calculate stresses generated in respective bumps at the corners when force is applied from the reverse side of the circuit board towards the electronic component. On the basis of the stress values calculated by the simulation, arrangement of the reinforcement members corresponding to the studs is determined.
摘要翻译：要解决的问题：确定减少在电子部件周围布置有螺柱的电路板的翘曲的最小必要对策。解决方案：用于确定电路板的加强位置的方法设置电路板的数值模型，其中电子部件具有通过多个凸起安装在其顶表面上的电子部件，以及加强部件，其对应于凸起设置在电子部件的角部。然后，将关于电子部件周围布置的螺柱和电路板固定到电子设备的壳体的信息被导入数字模型，并且进行模拟以计算当施加力时在角部处的各个凸块中产生的应力电路板朝向电子部件的反面。基于通过模拟计算的应力值，确定对应于螺柱的加强构件的布置。版权所有（C）2013，JPO＆INPIT

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