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    • 1. 发明专利
    • Camera state monitor, camera state monitoring program, and camera state monitoring method
    • 相机状态监视器,摄像机状态监视程序和摄像机状态监视方法
    • JP2011171941A
    • 2011-09-01
    • JP2010032927
    • 2010-02-17
    • Fujitsu Ltd富士通株式会社
    • TAKAHASHI HIROSHI
    • H04N5/225H04N7/18H04N17/00
    • PROBLEM TO BE SOLVED: To precisely determine defect of a camera. SOLUTION: A camera state monitor includes: a first change rate calculation section 22 which calculates a data quantity when compressing video data photographed by one camera among a plurality of cameras C 1 to C n and calculates a change rate from a data quantity when compressing video data photographed before this by the one camera; a camera extraction section 24 which extracts a camera existing within a predetermined distance from the one camera and photographing a predetermined angle range with the angle photographed by the one camera as reference; a second change rate calculation section 26 which calculates the data quantity when compressing the video data photographed by the extracted camera and calculates the change rate from the data quantity when compressing the video data photographed before this by the extracted camera; and a defect determining section 28 which compares the change rate calculated by the first change rate calculation section with the change rate calculated by the second change rate calculation section and determines the defect of the one camera. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:精确确定相机的缺陷。 解决方案:相机状态监视器包括:第一变化率计算部分22,当将多个照相机C 1 中的一个摄像机拍摄的视频数据压缩到C 时,计算数据量, 并且在通过一个照相机压缩在此之前拍摄的视频数据时,从数据量计算变化率; 照相机提取部分24,其提取存在于距一个照相机预定距离内的照相机,并以一个相机作为参照拍摄的角度拍摄预定角度范围; 第二变化率计算部分26,当压缩由所提取的摄像机摄影的视频数据时,计算数据量,并且在压缩通过所提取的照相机拍摄的视频数据之前从数据量计算变化率; 以及缺陷确定部分28,其将由第一变化率计算部分计算的变化率与由第二变化率计算部分计算的变化率进行比较,并确定一个照相机的缺陷。 版权所有(C)2011,JPO&INPIT
    • 2. 发明专利
    • Method for working contour
    • 工作方法
    • JP2005332246A
    • 2005-12-02
    • JP2004150597
    • 2004-05-20
    • Fujitsu Ltd富士通株式会社
    • YAMAGUCHI SHINGOKANBAYASHI SATORUTAKAHASHI HIROSHI
    • B23Q15/00G05B19/4093G05B19/4097
    • PROBLEM TO BE SOLVED: To provide a contour working method by which an individual difference does not occur in work precision and work time with a simple method concerning the contour work method for working the contour of a work having a steep/gentle slope.
      SOLUTION: Contour cross sectional lines are generated by a designated pitch in the direction of a tool axis with respect to the work. A grid plane with the designated pitch grid generated therein is arranged so as to be orthogonally crossed with a Z-axis. Each contour cross sectional line is projected on the grid plane. Then the respective distributions of the grids where the contour cross sectional line projected on the grid plane passes and does not pass are retrieved.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供一种在工作精度和工作时间内不会发生个体差异的轮廓加工方法,其中使用关于用于加工具有陡峭/平缓坡度的工件的轮廓的轮廓加工方法的简单方法 。

      解决方案:轮廓横截面线在刀具轴线相对于工件的方向上以指定的间距产生。 具有在其中产生的指定间距格栅的格子平面布置成与Z轴正交。 每个轮廓横截面线投影在网格平面上。 然后,检索投影在网格平面上的轮廓横截面线通过并且不通过的网格的相应分布。 版权所有(C)2006,JPO&NCIPI

    • 6. 发明专利
    • MOUNTING METHOD OF DOUBLE-SIDED PRINTED BOARD
    • JPH05129773A
    • 1993-05-25
    • JP28528691
    • 1991-10-31
    • FUJITSU LTD
    • TAKAHASHI HIROSHI
    • H05K3/26H05K1/18H05K3/34H05K13/04
    • PURPOSE:To provide a method of mounting a semiconductor chip on a double- sided printed board, where the semiconductor chip is enhanced in wire bonding reliability and contaminants are prevented from being left unremoved on the rear of the printed board when the board is cleaned after mounting is finished. CONSTITUTION:Circuit components 3 are mounting on both the front and the rear of a printed board 2 through brazing. Contaminants attendant on brazing are removed from the circuit components 3. A semiconductor chip 4 is die- bonded to the surface of the printed board 2, the chip 4 and the board 2 are connected together by wire-bonding. The semiconductor chip 4 and the bonding wires 5 are coated with resin 12. An insulating adhesive agent 13 is made to drop on the center of a package board 6. The tips of lead wires 7 penetrating the package board 6 are fitted into the printed board 2, the adhesive agent 13 is cured, and the tips of the lead wires 7 are brazed to the terminals of the printed board 2. Contaminants attached to the printed board 2 at the time when the lead wires 7 are brazed to the package board 6 at brazing are removed in an ultrasonic cleaning process.
    • 9. 发明专利
    • ELECTROPLATING BUBBLE STRIPPING DEVICE OF PRINTED WIRING BOARD
    • JPH03145793A
    • 1991-06-20
    • JP28567589
    • 1989-10-31
    • FUJITSU LTD
    • SAITO TAKESHITAKAHASHI HIROSHI
    • C25D21/10H05K3/18
    • PURPOSE:To enable bubbles attached to the plating region of a printed wiring board to be removed by a method wherein a bubble control plate which controls the jetted gas bubbles in size is provided almost horizontally between a bubble generator and the lower end of the printed wiring board. CONSTITUTION:An electroplating device 1 is provided with a plating tank 4 which is filled with plating solution 3 and houses a printed wiring plate 8 and an electrode 2, a bubble generator 5 is provided to the base of the plating tank 4, and a bubble control plate 9 provided with holes which control the jetted gas bubbles in size is provided almost horizontally between the bubble generator 5 and the end of the printed wiring board 8 apart from the generator 5 at a prescribed distance. For instance, if the bubble control plate 9 provided with holes 8mm in diameter and arranged in matrix is provided almost horizontally above the bubble jetting holes (diameter 3mmphi) of the bubble generator 5 10-15cm apart from them, the bubbles generating through the holes of the control plate 9 are made uniform in size and controlled to range from 8 to 20mm in diameter.