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1. 发明专利

JP2012231034A Bonding wire and printed circuit board and method of manufacturing the same 审中-公开
标题翻译：连接线和印刷电路板及其制造方法
公开(公告)号：JP2012231034A
公开(公告)日：2012-11-22
申请号：JP2011098782
申请日：2011-04-26
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： MINAMI KAZUMORI , SATO MASATAKA , MINAMI KOICHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/48091 , H01L2224/48227 , H01L2224/49433 , H01L2224/85 , H01L2224/8592 , H01L2924/00011 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a bonding wire for a semiconductor element which suppresses occurrence of dendrites and the like and is excellent in insulating reliability, and a printed circuit board using the bonding wire and a method of manufacturing the same.SOLUTION: There is provided a bonding wire for a semiconductor element 16, comprising: a wire 20 formed of copper or a copper alloy; and a copper ion diffusion suppression layer containing 1,2,3-Triazole and/or 1,2,4-Triazole configured to coat a surface of the wire.
摘要翻译：要解决的问题：提供一种用于抑制枝晶等的发生并且绝缘可靠性优异的半导体元件用接合线以及使用该接合线的印刷电路板及其制造方法。解决方案：提供了一种用于半导体元件16的接合线，包括：由铜或铜合金形成的线20; 以及包含1,2,3-三唑和/或1,2,4-三唑的铜离子扩散抑制层，其被配置为涂覆所述导线的表面。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012216759A Printed wiring board manufacturing method and printed wiring board 有权
标题翻译：印刷线路板制造方法和印刷线路板
公开(公告)号：JP2012216759A
公开(公告)日：2012-11-08
申请号：JP2011234664
申请日：2011-10-26
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： MINAMI KOICHI , SATO MASATAKA , OGIKUBO SHINYA , HARA MINAKO
IPC分类号： H05K3/28
CPC分类号： H05K3/282 , H05K2203/124
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board and a printed wiring board obtained by the method, which are excellent in insulation reliability between wirings.SOLUTION: A printed wiring board manufacturing method comprises a layer formation process of contacting a core substrate having a substrate and copper or copper alloy wiring provided on the substrate with a process liquid containing 1,2,3-triazole and/or 1,2,4-triazole and has pH5-12, and subsequently cleansing the core substrate by a solvent to form a copper ion diffusion suppression layer containing 1,2,3-triazole and/or 1,2,4-triazole on a surface of the copper or copper alloy wiring; and an insulation film formation process of forming an insulation film on the core substrate on which the copper ion diffusion suppression layer is formed after the layer formation process.
摘要翻译：要解决的问题：提供通过该方法获得的印刷线路板和印刷线路板的制造方法，其在布线之间的绝缘可靠性优异。解决方案：印刷线路板制造方法包括使具有基板的芯基板和设置在基板上的铜或铜合金布线与含有1,2,3-三唑和/或1的工艺液体接触的层形成工艺，2,4-三唑并具有pH5-12，随后通过溶剂清洗核心基材以在表面上形成含有1,2,3-三唑和/或1,2,4-三唑的铜离子扩散抑制层的铜或铜合金布线; 以及在层形成工艺之后在其上形成有铜离子扩散抑制层的芯基板上形成绝缘膜的绝缘膜形成工艺。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2009161857A Photosensitive resin composition for plating and method for producing substrate with metal layer using the same 审中-公开
标题翻译：用于制造用于制造具有金属层的基板的镀层的感光性树脂组合物
公开(公告)号：JP2009161857A
公开(公告)日：2009-07-23
申请号：JP2008318644
申请日：2008-12-15
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： SATO MASATAKA , KANO TAKEYOSHI
IPC分类号： C23C18/16 , C08F220/10 , C08J7/04 , C23C18/20 , C25D5/56 , H05K1/03 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for plating which allows a plating catalyst or its precursor accepting layer to be formed and which is excellent in adhesion with a metal film formed by plating and smoothness of the resin-metal interface and has high film formation sensitivity and good production suitability; and to provide a method for producing a substrate with a metal layer by which the substrate with a metal layer excellent in the adhesion between the metal layer and the substrate can be easily formed with a low energy. SOLUTION: The photosensitive resin composition for plating allowing a plating catalyst or its precursor accepting layer to be formed is characterized by containing a polymer having a functional group forming a coordination bond interaction with the plating catalyst or its precursor and a polymerizable group, and a polyfunctional monomer having at least two polymerizable groups in the molecule. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够形成电镀催化剂或其前体接受层的电镀用感光性树脂组合物，其与通过电镀形成的金属膜和树脂 - 金属界面的平滑性具有优异的粘附性并具有较高的成膜敏感性和良好的生产适应性; 并且提供一种用金属层制造基板的方法，通过该方法可以以低能量容易地形成具有金属层和基板之间的粘合性优异的金属层的基板。解决方案：使形成电镀催化剂或其前体接受层的电镀用感光性树脂组合物的特征在于含有具有与电镀催化剂或其前体和可聚合基团形成配位键相互作用的官能团的聚合物，和在分子中具有至少两个可聚合基团的多官能单体。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2009007662A Process for producing metal-film-coated material, metal-film-coated material, process for producing metallic-pattern material, metallic-pattern material and composition for polymer layer formation 有权
标题翻译：用于生产金属薄膜材料的方法，金属膜涂覆材料，用于生产金属图案材料的方法，金属图案材料和用于聚合物层形成的组合物
公开(公告)号：JP2009007662A
公开(公告)日：2009-01-15
申请号：JP2007256745
申请日：2007-09-28
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： KANO TAKEYOSHI , EISAKI HIDEO , SATO MASATAKA
IPC分类号： C23C18/20 , B32B15/08 , C25D5/56 , H05K3/18 , H05K3/38
CPC分类号： C23C18/1653 , C23C18/2086 , C23C18/30 , C23C18/405
摘要： PROBLEM TO BE SOLVED: To provide a process for producing a metallic-pattern material having excellent insulating reliability on the non-formation region of a metallic-pattern. SOLUTION: A process for producing a metallic-pattern material comprises: a step of (a1) forming on a substrate a polymer layer made of a polymer which has a functional group interacting with a plating catalyst or a precursor therefor and is directly chemically bonded to the substrate, a step of (a2) imparting the plating catalyst or precursor therefor to the polymer layer, a step of (a3) plating the plating catalyst or precursor therefor, and a step of (a4) pattern-wise etching the deposit film formed. The polymer layer satisfies all of the following requirements 1 to 4: requirement 1: to have a saturation water absorption as measured at 25°C and 50% of 0.01 to 10 mass%; requirement 2: to have a saturation water absorption as measured at 25°C and 95% of 0.05 to 20 mass%; requirement 3: to have a water absorption after 1 hour immersion in 100°C boiling water of 0.1 to 30 mass%; and requirement 4: to have a contact angle, as measured after dropping of 5 μL of distilled water thereonto and standing for 15 seconds of 50 to 150 degrees at 25°C and 50%. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种在金属图案的非形成区域上具有优异绝缘可靠性的金属图案材料的制造方法。解决方案：一种制造金属图案材料的方法包括：（a1）在基材上形成由具有与电镀催化剂或其前体相互作用的官能团的聚合物制成的聚合物层，并且直接化学键合到基底上，（a2）赋予电镀催化剂或其前体至聚合物层的步骤，（a3）电镀镀催化剂或其前体的步骤，（a4）以图形方式蚀刻沉积膜形成。聚合物层满足以下所有要求1〜4：要求1：在25℃，50％为0.01〜10质量％下测定饱和吸水率; 要求2：在25℃下测得的饱和吸水率为0.05〜20质量％，95％为饱和吸水率。要求3：在100℃沸水中浸渍1小时后具有0.1〜30质量％的吸水性; 要求4：在其上滴加5μL蒸馏水后测定的接触角，并在25℃和50％下静置15〜50度。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2009006698A Manufacturing process of film with metal film on both sides and film with metal film on both sides 审中-公开
标题翻译：金属薄膜与双面金属膜的薄膜制造工艺
公开(公告)号：JP2009006698A
公开(公告)日：2009-01-15
申请号：JP2007332426
申请日：2007-12-25
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： SATO MASATAKA , KANO TAKEYOSHI , TSURUMI MITSUYUKI
IPC分类号： B32B15/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing process of a film with metal films on the both sides by which a film with metal films having different functions on the both sides and having an excellent versatility in application is manufactured in a simple and easy way, and a film with metal films on the both sides manufactured by the manufacturing process. SOLUTION: The manufacturing process of a film with metal films on the both sides comprises (A) a step of forming a metal film on one side of a resin film by a casting, a metalizing or a lamination process, (B) a step of forming one or more resin layers having metal ion adsorption ability on the other side of the resin film, (C) a step of making the resin film having metal ion adsorption ability adsorb metal ions and (D) a step of reducing the metal ions, to form a plated metal film. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供在两侧具有金属膜的膜的制造工艺，通过该膜在两侧制造具有在两侧具有不同功能的金属膜并具有优异的应用通用性的膜，其制造简单和容易的方法，以及通过制造工艺制造的两侧具有金属膜的膜。（A）通过铸造，金属化或层压工艺在树脂膜的一侧上形成金属膜的步骤，（B）在金属膜的两面上形成金属膜的步骤，在树脂膜的另一侧形成一个或多个具有金属离子吸附能力的树脂层的步骤，（C）使具有金属离子吸附能力的树脂膜吸附金属离子的步骤，（D）降低金属离子，形成电镀金属膜。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2007199420A Manufacturing method of plastic optical fiber, plastic optical fiber, and optical transmission body 有权
标题翻译：塑料光纤，塑料光纤和光传输体的制造方法
公开(公告)号：JP2007199420A
公开(公告)日：2007-08-09
申请号：JP2006018130
申请日：2006-01-26
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： SATO MASATAKA
IPC分类号： G02B6/00
摘要： PROBLEM TO BE SOLVED: To manufacture a plastic optical fiber (POF) that materializes low transmission loss. SOLUTION: A first member 17 in which a plurality of polymerized body layers are laminated and a cylindrical second member 19 are separately formed. The first member 17 is inserted into the second member 19 and then combined with a cylindrical third member 21 to make a preform 12. In a first member forming process 18, the first member 17 is formed so that a difference between the orientation S1 of the innermost layer and the orientation S2 of the outermost layer of the first member 17 becomes not less than 0 but below 0.2. Also, in the first member forming process 18, a layer forming material containing at least one or more kinds of polymerizable compositions and a chain transfer agent comprising a thiol group is poured into a hollow tube and polymerized, with this process repeated to form the first member 17. By heating and drawing the preform 12, the POF 11 can be obtained in which thermal contraction due to heat is suppressed, resulting in a low transmission loss. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：制造实现低传输损耗的塑料光纤（POF）。解决方案：分层形成多个聚合体层的第一部件17和圆筒形的第二部件19。第一构件17插入到第二构件19中，然后与圆柱形第三构件21组合以制造预成型体12.在第一构件形成工序18中，第一构件17形成为使得第一构件17的取向S1 第一构件17的最外层和最外层的取向S2变为不小于0但小于0.2。此外，在第一构件形成工序18中，将含有至少一种以上的聚合性组合物的层形成材料和包含硫醇基的链转移剂倒入中空管中并聚合，重复该过程，形成第一通过加热和拉伸预成型体12，可以获得POF 11，其中由于热量的热收缩被抑制，导致低的传输损失。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2007101805A Apparatus and method of manufacturing preform for plastic optical material 有权
标题翻译：制造塑料光学材料预制件的装置和方法
公开(公告)号：JP2007101805A
公开(公告)日：2007-04-19
申请号：JP2005290238
申请日：2005-10-03
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： SATO MASATAKA , TSUYUKI ISAO
IPC分类号： G02B6/00 , G02B6/028
摘要： PROBLEM TO BE SOLVED: To manufacture a GI type POF having excellent optical performance. SOLUTION: A core forming machine 25 is composed of a rotary polymerizer 27, a liquid infuser 28 or the like. A tumbler 32 housing a polymerizing container 19 is set inside the rotary polymerizer 27, with the temperature therein adjusted so that the temperature of the polymerizing container 19 becomes a polymerization temperature. Integrally with the tumbler 32, the polymerizing container 19 is rotated around the center axis. When the temperature of the polymerizing container 19 reaches the polymerization temperature, a mixed solution 24(α) of two or more kinds of polymerizable compounds is infused into the polymerizing container 19 for polymerization using the liquid infuser 28. With the liquid infusion and the polymerization repeated for multiple times, a core having a multiple layered structure is formed on the inner face of the polymerizing container 19. The core taken out from the polymerizing container 19 is inserted into a clad pipe (not shown) to form a preform (not shown). By heating and drawing this preform, the GI type POF with excellent optical performance can be obtained. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：制造具有优异光学性能的GI型POF。解决方案：芯成型机25由旋转聚合器27，液体入口28等组成。容纳聚合容器19的转鼓32设置在旋转聚合器27内部，其中调节温度使得聚合容器19的温度变为聚合温度。与转鼓32一体地，聚合容器19围绕中心轴线旋转。当聚合容器19的温度达到聚合温度时，使用液体浸渍器28将两种或更多种可聚合化合物的混合溶液24（α）注入用于聚合的聚合容器19中。通过液体输注和聚合重复多次，在聚合容器19的内表面上形成具有多层结构的芯。将从聚合容器19中取出的芯插入包覆管（未示出）中以形成预成型体（未示出））。通过加热和拉伸该预制件，可以获得具有优异光学性能的GI型POF。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2012231035A Molded circuit board and manufacturing method thereof 审中-公开
标题翻译：模制电路板及其制造方法
公开(公告)号：JP2012231035A
公开(公告)日：2012-11-22
申请号：JP2011098783
申请日：2011-04-26
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： HARA MINAKO , SATO MASATAKA , MINAMI KOICHI
IPC分类号： H05K3/24 , H05K3/00 , H05K3/26 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a molded circuit board in which copper ion migration is suppressed and whose insulation reliability between wirings is excellent, and to provide a manufacturing method thereof.SOLUTION: A manufacturing method of a molded circuit board includes the steps of: forming a plating layer 16 on a molded substrate 10 with a wiring having a molded substrate 12 and a copper wiring or a copper alloy wiring 14 disposed on a surface of the molded substrate; forming a film 18 containing an azole compound by bringing the surface into contact with a treatment liquid containing 1,2,3-triazole and/or 1,2,4-triazole; forming a copper ion diffusion suppression layer 20 by cleaning the molded substrate with the wiring with a solvent; and coating the copper wiring or the copper alloy wiring by a metal plating layer other than copper.
摘要翻译：要解决的问题：提供一种抑制铜离子迁移并且其布线之间的绝缘可靠性优异的模制电路板，并提供其制造方法。解决方案：模制电路板的制造方法包括以下步骤：在具有模制基板12的布线和布置在表面上的铜布线或铜合金布线14的模制基板10上形成镀层16 的模塑基材; 通过使表面与含有1,2,3-三唑和/或1,2,4-三唑的处理液接触而形成含有唑类化合物的膜18; 通过用溶剂用布线清洗成型基板来形成铜离子扩散抑制层20; 并且通过铜以外的金属镀层涂布铜布线或铜合金布线。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2012231033A With surface-coated wiring printed wiring board and a method of manufacturing the same 审中-公开
标题翻译：具有表面涂布的印刷线路板及其制造方法
公开(公告)号：JP2012231033A
公开(公告)日：2012-11-22
申请号：JP2011098781
申请日：2011-04-26
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： OGIKUBO SHINYA , SATO MASATAKA , MINAMI KOICHI
IPC分类号： H05K3/26 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board in which copper ion migration is suppressed and whose insulation reliability between wirings is excellent, and to provide a manufacturing method thereof.SOLUTION: A manufacturing method of a printed wiring board with a surface coated wiring includes a layer formation step of bringing a printed wiring board having a substrate, a copper wiring or a copper alloy wiring disposed on the substrate, and an insulating layer which covers the copper wiring and the copper alloy wiring so that a part of the copper wiring or the copper alloy wiring is exposed into contact with a treatment liquid containing 1,2,3-triazole and/or 1,2,4-triazole and then cleaning the printed wiring board with a solvent to form a copper ion diffusion suppression layer containing the 1,2,3-triazole and/or 1,2,4-triazole on a surface of the exposed copper wiring or copper alloy wiring.
摘要翻译：要解决的问题：提供抑制铜离子迁移并且布线之间的绝缘可靠性优异的印刷电路板，并提供其制造方法。解决方案：具有表面被覆布线的印刷布线板的制造方法包括：层形成步骤，使具有基板的布线基板，配置在基板上的铜布线或铜合金布线以及绝缘层其覆盖铜布线和铜合金布线，使得铜布线或铜合金布线的一部分暴露于与含有1,2,3-三唑和/或1,2,4-三唑的处理液接触，然后用溶剂清洗印刷电路板，以在暴露的铜布线或铜合金布线的表面上形成含有1,2,3-三唑和/或1,2,4-三唑的铜离子扩散抑制层。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2011213782A Method for producing polymer solution and method for purifying polymer 审中-公开
标题翻译：生产聚合物溶液的方法和纯化聚合物的方法
公开(公告)号：JP2011213782A
公开(公告)日：2011-10-27
申请号：JP2010081193
申请日：2010-03-31
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： KANO TAKEYOSHI , SATO MASATAKA
IPC分类号： C08F6/06 , G03F7/038
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a polymer solution which is applicable in an industrial scale, ensures high removability of a hydrophilic organic solvent and hydrophilic compounds such as a hydrophilic reaction byproduct generated in polymer synthesis, also ensures a high polymer recovery rate, and can be used also as a coating liquid, and a method for purifying a polymer.SOLUTION: The method for producing a polymer solution, which contains a polymer containing a unit represented by general formula (A) and a unit represented by general formula (B) and an alcohol having a ratio of the number of carbon atoms to the number of OH groups of 4-7, includes: an addition step of adding the alcohol to a polymer solution A containing the polymer and an organic solvent which dissolves the polymer and is compatible with the alcohol to obtain a polymer solution B, and an extraction step of subjecting the polymer solution B to an extraction treatment with water.
摘要翻译：要解决的问题：为了提供可应用于工业规模的聚合物溶液的制造方法，确保亲水性有机溶剂的高度去除性和亲水性化合物如聚合物合成中产生的亲水性反应副产物，还确保高聚合物回收率速率，也可以用作涂布液，以及聚合物的纯化方法。溶液：聚合物溶液的制造方法，其含有含有通式（A）表示的单元的聚合物和由通式（A）表示的单元式（B）和碳原子数与OH基数之比为4-7的醇包括：将醇加入含聚合物和溶解有机溶剂的聚合物溶液A中的添加步骤该聚合物与醇相容以获得聚合物溶液B，以及将聚合物溶液B用水进行萃取处理的萃取步骤。

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