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1. 发明专利

JP2013067066A Inkjet head and method for producing the same 有权
标题翻译：喷墨头及其制造方法
公开(公告)号：JP2013067066A
公开(公告)日：2013-04-18
申请号：JP2011206748
申请日：2011-09-22
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： NOSAKA NORIHITO , WAKABAYASHI AKIRA , OGIKUBO MASAYA , HARA MINAKO
IPC分类号： B41J2/16 , B41J2/045 , B41J2/055
CPC分类号： H05K3/28 , B41J2/161 , B41J2/1623 , B41J2/1643 , B41J2002/14362 , B41J2002/14491 , H05K1/117 , H05K3/244 , H05K3/285 , H05K3/361 , H05K3/363 , H05K3/365 , H05K2201/0769 , H05K2203/124
摘要： PROBLEM TO BE SOLVED: To improve the ion migration resistance of an inkjet head.SOLUTION: A discharge die 17 has a discharge port, a piezoelectric element, a printed wiring pattern, a driving IC, and a first terminal 32. A flexible wiring circuit board 12 has a second terminal 34, and this second terminal 34 is connected to the first terminal 32 of the discharge die 17. A copper ion diffusion inhibiting coating 77 is formed by contacting treatment liquid including 1, 2, 3 triazoles or/and 1, 2, 4 triazoles to the surface of copper or copper alloy wiring of the second terminal 34. The second terminal 34 is connected to the first terminal 32, and these are connected electrically. The copper ion never diffuses by the copper ion diffusion inhibiting coating 77, and the occurrence of the migration by the copper ion is suppressed. The malfunction that originates in the occurrence of the migration is eliminated.
摘要翻译：要解决的问题：提高喷墨头的离子迁移阻力。解决方案：放电模具17具有排出口，压电元件，印刷布线图案，驱动IC和第一端子32.柔性布线电路板12具有第二端子34，并且该第二端子34 与放电模具17的第一端子32连接。铜离子扩散抑制涂层77是通过将包含1,2,3或3种或2种或4种三唑的处理液与铜或铜合金的表面接触而形成的第二端子34的布线。第二端子34连接到第一端子32，并且它们被电连接。铜离子不会被铜离子扩散抑制涂层77扩散，并且抑制了铜离子迁移的发生。消除了发生迁移的故障。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012216759A Printed wiring board manufacturing method and printed wiring board 有权
标题翻译：印刷线路板制造方法和印刷线路板
公开(公告)号：JP2012216759A
公开(公告)日：2012-11-08
申请号：JP2011234664
申请日：2011-10-26
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： MINAMI KOICHI , SATO MASATAKA , OGIKUBO SHINYA , HARA MINAKO
IPC分类号： H05K3/28
CPC分类号： H05K3/282 , H05K2203/124
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board and a printed wiring board obtained by the method, which are excellent in insulation reliability between wirings.SOLUTION: A printed wiring board manufacturing method comprises a layer formation process of contacting a core substrate having a substrate and copper or copper alloy wiring provided on the substrate with a process liquid containing 1,2,3-triazole and/or 1,2,4-triazole and has pH5-12, and subsequently cleansing the core substrate by a solvent to form a copper ion diffusion suppression layer containing 1,2,3-triazole and/or 1,2,4-triazole on a surface of the copper or copper alloy wiring; and an insulation film formation process of forming an insulation film on the core substrate on which the copper ion diffusion suppression layer is formed after the layer formation process.
摘要翻译：要解决的问题：提供通过该方法获得的印刷线路板和印刷线路板的制造方法，其在布线之间的绝缘可靠性优异。解决方案：印刷线路板制造方法包括使具有基板的芯基板和设置在基板上的铜或铜合金布线与含有1,2,3-三唑和/或1的工艺液体接触的层形成工艺，2,4-三唑并具有pH5-12，随后通过溶剂清洗核心基材以在表面上形成含有1,2,3-三唑和/或1,2,4-三唑的铜离子扩散抑制层的铜或铜合金布线; 以及在层形成工艺之后在其上形成有铜离子扩散抑制层的芯基板上形成绝缘膜的绝缘膜形成工艺。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2011062877A Protective film and front sheet for solar cell 有权
标题翻译：太阳能电池的保护膜和前片
公开(公告)号：JP2011062877A
公开(公告)日：2011-03-31
申请号：JP2009214354
申请日：2009-09-16
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： SAWADA MAKOTO , HARA MINAKO
IPC分类号： B32B27/18 , B32B27/36 , H01L31/042
CPC分类号： H01L51/448 , H01G9/2077 , H01L31/048 , Y02E10/549 , Y10T428/256
摘要： PROBLEM TO BE SOLVED: To provide a protective film which is composed of a plastic film and a coating layer and has high transparency, high ultraviolet absorptiveness, high weatherability and flexibility, and in which a coating layer does not peel from the plastic film even when irradiated with ultraviolet rays. SOLUTION: The protective film has the plastic film 1 and the coating layer 5 set on the surface of the plastic film 1. The coating layer 5 is formed by dispersing cerium oxide in a binder containing a compound with an average composition formula expressed by formula (1) R 11 m Si(OR 12 ) n O 4-m-n/2 , using a surfactant having Si-O bond and/or Si-C bond. The cerium oxide is contained in the coating layer 5 at a ratio of ≥10 wt.%, with particle sizes of the cerium oxide of ≤50 nm. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种由塑料膜和涂层组成的保护膜，具有高透明度，高紫外线吸收性，高耐候性和柔软性，并且其中涂层不会从塑料剥离即使用紫外线照射也是如此。＆lt; P＆gt;解决方案：保护膜具有设置在塑料膜1表面上的塑料膜1和涂层5.涂层5通过将氧化铈分散在含有平均组成式表达的化合物的粘合剂中而形成通过式（1）R（SP）11 /（S / S）S（OR 12） 2 ，使用具有Si-O键和/或Si-C键的表面活性剂。氧化铈以≥10重量％的比例包含在涂层5中，氧化铈的粒径≤50nm。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2013125797A Wiring board, method of manufacturing the same, and aqueous solution for silver ion diffusion suppression layer formation 审中-公开
标题翻译：接线板，其制造方法和用于银离子扩散抑制层形成的水溶液
公开(公告)号：JP2013125797A
公开(公告)日：2013-06-24
申请号：JP2011272578
申请日：2011-12-13
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： HARA MINAKO , OGIKUBO SHINYA , MITAMURA YASUHIRO
IPC分类号： H05K3/38 , H01L21/3205 , H01L21/768 , H01L23/532 , H05K3/22 , H05K3/26
摘要： PROBLEM TO BE SOLVED: To provide a wiring board in which silver ion migration between metal wiring made of silver or silver alloy is suppressed and insulation reliability between the metal wiring is more excellent, and also to provide a method of manufacturing the same.SOLUTION: A method of manufacturing a wiring board includes: a contact step in which an aqueous solution for silver ion diffusion suppression layer formation containing a compound represented by formula (1) and/or a compound represented by formula (2) and water is brought into contact with an insulation substrate with metal wiring having the insulation substrate and metal wiring made of silver or silver alloy disposed on the insulation substrate; and a cleaning step in which the insulation substrate with the metal wiring is cleaned using a solvent and a silver diffusion suppression layer covering the metal wiring in this order.
摘要翻译：解决的问题：提供一种布线基板，其中抑制由银或银合金制成的金属布线之间的银离子迁移，并且金属布线之间的绝缘可靠性更优异，并且还提供其制造方法。解决方案：制造布线板的方法包括：接触步骤，其中形成含有由式（1）表示的化合物和/或由式（2）表示的化合物的银离子扩散抑制层的水溶液和水与具有绝缘基板的金属布线和设置在绝缘基板上的由银或银合金制成的金属布线的绝缘基板接触; 以及清洗步骤，其中使用溶剂清洁具有金属布线的绝缘基板，并且依次覆盖金属布线的银扩散抑制层。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013008961A Printed circuit board and method for selecting the same 审中-公开
标题翻译：印刷电路板及其选择方法
公开(公告)号：JP2013008961A
公开(公告)日：2013-01-10
申请号：JP2012118658
申请日：2012-05-24
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： OGIKUBO SHINYA , HARA MINAKO , MINAMI KOICHI
IPC分类号： H05K3/28 , C23F1/18 , H05K3/06
CPC分类号： H05K3/282 , H05K2201/0769
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board that is excellent in insulation reliability between copper wirings.SOLUTION: A printed circuit board has a substrate with copper wirings that has a substrate and copper wirings disposed on the substrate, and a copper ion diffusion suppression layer that includes a nitrogen-containing organic compound coating the copper wirings. The adhesion amount of the nitrogen-containing organic compound is 5×10to 1×10g/mm. The ratio (B/A) of etching rate of the copper wirings when immersed in an etching aqueous solution that includes 1.8 mass% of sulfuric acid and 12 mass% of sodium peroxodisulfate (B μm/min) and that of the copper wirings having no copper ion diffusion suppression layers when immersed in the etching aqueous solution (A μm/min) is less than 1.2.
摘要翻译：要解决的问题：提供铜布线之间的绝缘可靠性优异的印刷电路板。解决方案：印刷电路板具有带布线的铜布线的基板和布置在基板上的铜布线，以及包含涂敷铜布线的含氮有机化合物的铜离子扩散抑制层。含氮有机化合物的附着量为5×10 至1×10 -6 g / SP POS =“POST”> 2 。浸渍在含有1.8质量％硫酸和12质量％过硫酸氢钠（Bμm/ min）的蚀刻水溶液中的铜布线的蚀刻速度与不具有铜线的铜配线的比例（B / A）浸入蚀刻水溶液中的铜离子扩散抑制层（μm/ min）小于1.2。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2012231035A Molded circuit board and manufacturing method thereof 审中-公开
标题翻译：模制电路板及其制造方法
公开(公告)号：JP2012231035A
公开(公告)日：2012-11-22
申请号：JP2011098783
申请日：2011-04-26
申请人： Fujifilm Corp , 富士フイルム株式会社
发明人： HARA MINAKO , SATO MASATAKA , MINAMI KOICHI
IPC分类号： H05K3/24 , H05K3/00 , H05K3/26 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a molded circuit board in which copper ion migration is suppressed and whose insulation reliability between wirings is excellent, and to provide a manufacturing method thereof.SOLUTION: A manufacturing method of a molded circuit board includes the steps of: forming a plating layer 16 on a molded substrate 10 with a wiring having a molded substrate 12 and a copper wiring or a copper alloy wiring 14 disposed on a surface of the molded substrate; forming a film 18 containing an azole compound by bringing the surface into contact with a treatment liquid containing 1,2,3-triazole and/or 1,2,4-triazole; forming a copper ion diffusion suppression layer 20 by cleaning the molded substrate with the wiring with a solvent; and coating the copper wiring or the copper alloy wiring by a metal plating layer other than copper.
摘要翻译：要解决的问题：提供一种抑制铜离子迁移并且其布线之间的绝缘可靠性优异的模制电路板，并提供其制造方法。解决方案：模制电路板的制造方法包括以下步骤：在具有模制基板12的布线和布置在表面上的铜布线或铜合金布线14的模制基板10上形成镀层16 的模塑基材; 通过使表面与含有1,2,3-三唑和/或1,2,4-三唑的处理液接触而形成含有唑类化合物的膜18; 通过用溶剂用布线清洗成型基板来形成铜离子扩散抑制层20; 并且通过铜以外的金属镀层涂布铜布线或铜合金布线。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2019019204A インク、インクカートリッジ、インクジェット捺染方法、及びポリマー审中-公开
公开(公告)号：JP2019019204A
公开(公告)日：2019-02-07
申请号：JP2017138196
申请日：2017-07-14
申请人： FUJIFILM CORP
发明人： MIZUMURA MASATOSHI , HARA MINAKO , OMOTO MAKOTO , KOBAYASHI HIROMI
IPC分类号： C09D11/328 , B41J2/01 , B41M5/00 , D06P1/02 , D06P5/00 , D06P5/20
摘要：【課題】画像鮮明性、風合い及び耐光性に優れた着色布を提供することができるインク、上記インクを有するインクカートリッジ、及び上記インクを用いたインクジェット捺染方法を提供する。【解決手段】下記一般式(X1)で表される基を有する染料に由来する構造を有し、かつ式(1)で表される様なウレタン結合を有するポリマーの水分散体を含むインク。上記インクを有するインクカートリッジ、及び上記インクを用いて、インクジェット方式で布帛に直接印捺する工程を有するインクジェット捺染方法。−{X1−L1(D1)−X2−C(=O)−NH−L2−NH−C(=O)}−(1)【選択図】なし

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