专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007294600A Sequential alignment device, and sequential alignment method 有权
标题翻译：顺序对准装置和顺序对准方法
公开(公告)号：JP2007294600A
公开(公告)日：2007-11-08
申请号：JP2006119460
申请日：2006-04-24
申请人： Fuji Xerox Co Ltd , Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社 , 富士ゼロックス株式会社
发明人： ISHIOKA MASATO , TSUNO TAKESHI , UCHIUMI ATSUSHI , GOTO TAKAYUKI , YAMADA TAKAYUKI
IPC分类号： H01L21/02
摘要： PROBLEM TO BE SOLVED: To raise efficiency in positioning when two substrates are joined.
SOLUTION: A sequential alignment device includes: a first stage 5 for movably supporting a target substrate in a z direction; a second stage 6 for supporting a donor substrate in an xy direction, where a plurality of patterns to be joined with the target substrate are formed; a detecting device 15 for receiving diffractive light 42 which is obtained by reflection against horizontal positioning alignment marks 34, 35 after radiating a laser beam 41 to the horizontal positioning alignment marks 34, 35 formed on the donor substrate; and a measuring instrument 17 for measuring the position of the donor substrate concerning the xy direction, based on the diffractive light 42. The detecting device 15 is fixed to the first stage 5.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提高两个基板接合时的定位效率。解决方案：顺序对准装置包括：用于在z方向上可移动地支撑目标衬底的第一级5; 用于在xy方向上支撑施主衬底的第二级6，其中形成与目标衬底接合的多个图案; 用于接收衍射光42的检测装置15，该衍射光42在将激光束41辐射到形成在供体基板上的水平定位对准标记34,35之后，通过反射水平定位对准标记34,35获得; 以及用于基于衍射光42测量施主基板与xy方向的位置相关的测量仪器17.检测装置15固定在第一阶段5.版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2010141092A Normal-temperature bonding device 有权
标题翻译：正温接合装置
公开(公告)号：JP2010141092A
公开(公告)日：2010-06-24
申请号：JP2008315431
申请日：2008-12-11
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： KINOUCHI MASAHITO , GOTO TAKAYUKI , TAWARA SATOSHI , TSUNO TAKESHI , UCHIUMI ATSUSHI , IDE KENSUKE , SUZUKI KITEN
IPC分类号： H01L21/02 , B23K20/00 , B23K101/40
CPC分类号： H01L21/6838 , B23K20/02 , B23K2201/40 , H01L21/67201 , Y10T156/10 , Y10T156/17
摘要： PROBLEM TO BE SOLVED: To improve reliability in wafer bonding, and to reduce manufacturing cost. SOLUTION: A normal-temperature bonding device 1 includes: a cartridge 11; a conveyance device for conveying the cartridge 11; a lower side stage for holding the cartridge 11; an upper side stage facing a wafer 50-1 mounted on the cartridge 11 when the lower stage holds the cartridge 11; and a compression-bonding mechanism for bringing the upper stage closer to the lower stage. The upper wafer 50-1 held to the upper stage is directly brought into contact with the upper stage. Thus, the conveyance device can convey the wafer 50-1 without direct contact with the wafer 50-1. The wafer 50-1 can be held to the lower stage without direct contact with the lower stage. As a result, the normal-temperature bonding device can prevent contamination of the wafer 50-1 to be bonded. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提高晶片接合的可靠性，降低制造成本。常温接合装置1包括：盒11; 用于输送盒11的输送装置; 用于保持盒11的下侧台阶; 当下级保持盒11时，面对安装在盒11上的晶片50-1的上侧级; 以及用于使上层更靠近下级的压缩机构。保持在上层的上晶片50-1直接与上层接触。因此，输送装置可以不与晶片50-1直接接触而输送晶片50-1。可以将晶片50-1保持在下级而不与下级直接接触。结果，常温接合装置能够防止待接合的晶片50-1的污染。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2003075337A Integrated surface plasmon resonance sensor 审中-公开
标题翻译：集成表面等离子体共振传感器
公开(公告)号：JP2003075337A
公开(公告)日：2003-03-12
申请号：JP2001265220
申请日：2001-09-03
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： INUZUKA HIROMASA , UCHIUMI ATSUSHI , TAWARA SATOSHI , GOTO TAKAYUKI , NAKAYAMA HIROYUKI
IPC分类号： G01N33/543 , G01N21/27 , G01N21/41
CPC分类号： G01N21/553
摘要： PROBLEM TO BE SOLVED: To provide an integrated surface plasmon resonance sensor having high measurement accuracy, and having a minute optical element capable of efficiently and accurately measuring plural samples. SOLUTION: This integrated surface plasmon resonance sensor can sequentially analyze the presence of occurrence of biochemical reactions in plural samples while relatively moving a transparent substrate and a silicon substrate by entering a laser beam emitted from the minute optical element into the transparent substrate through a diffraction grating and by detecting the intensity of reflected light emitted from the transparent substrate through another diffraction grating adjacent to the diffraction grating by the minute optical element.
摘要翻译：要解决的问题：提供具有高测量精度的集成表面等离子体共振传感器，并且具有能够有效且精确地测量多个样品的微小光学元件。解决方案：该集成表面等离子体共振传感器可以依次分析多个样品中生物化学反应发生的存在，同时通过衍射光栅将从微小光学元件发射的激光束进入透明衬底，同时相对移动透明衬底和硅衬底并且通过由微小光学元件检测从透明基板通过与衍射光栅相邻的另一衍射光栅发射的反射光的强度。

4. 发明专利

JP2003075333A Surface plasmon resonance sensor device 审中-公开
标题翻译：表面等离子体共振传感器装置
公开(公告)号：JP2003075333A
公开(公告)日：2003-03-12
申请号：JP2001263283
申请日：2001-08-31
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： UCHIUMI ATSUSHI , NAKAYAMA HIROYUKI , GOTO TAKAYUKI , INUZUKA HIROMASA , TAWARA SATOSHI
IPC分类号： G01N21/27
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive surface plasmon resonance sensor device capable of measuring multiple samples at a time and having a simple structure. SOLUTION: This surface plasmon resonance sensor device 30 is provided with: a surface plasmon resonance sensor 40 having at least one inspection part 41 comprising a recessed reflecting surface having a metal thin film 42 installed for generating surface plasmon resonance and machined so as to generate the surface plasmon resonance, and a biochemical reaction detection position 43 disposed on the thin film 42 and abutting on the sample 44; a light source part 50 for irradiating, to the reflecting surface of the inspection part 41 of the surface plasmon resonance sensor, a parallel light beam having a beam width having a breadth covering the entire detection area in the reflecting surface; and a light detection means 60 for detecting the reflected light of the light beam reflected by the reflecting surface of the inspection part 41 and emitted from the surface plasmon resonance sensor.
摘要翻译：要解决的问题：提供一种能够一次测量多个样品并具有简单结构的廉价的表面等离子体共振传感器装置。解决方案：该表面等离子体共振传感器装置30具有：具有至少一个检查部分41的表面等离子体共振传感器40，该检查部分41包括凹入的反射表面，该反射表面具有安装用于产生表面等离子体共振的机械加工的金属薄膜42，表面等离子体共振和设置在薄膜42上并邻接在样品44上的生化反应检测位置43; 用于向表面等离子体共振传感器的检查部41的反射面照射具有覆盖反射面的整个检测区域的宽度的光束宽度的平行光束的光源部50; 以及光检测装置60，用于检测由检查部分41的反射表面反射并从表面等离子体共振传感器发射的光束的反射光。

5. 发明专利

JP2003057171A Optical fiber type surface plasmon resonance sensor apparatus 审中-公开
标题翻译：光纤型表面等离子体共振传感器装置
公开(公告)号：JP2003057171A
公开(公告)日：2003-02-26
申请号：JP2001243592
申请日：2001-08-10
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： UCHIUMI ATSUSHI , NAKAYAMA HIROYUKI , GOTO TAKAYUKI , INUZUKA HIROMASA , TAWARA SATOSHI
IPC分类号： G01N21/27
摘要： PROBLEM TO BE SOLVED: To provide an optical fiber type surface plasmon resonance sensor apparatus that is inexpensive and has improved measurement accuracy since it has a simple configuration and can be machined easily, and further can be made multiple since measuring a number of samples simultaneously. SOLUTION: The optical fiber type surface plasmon resonance sensor apparatus 20 is provided with at least one optical fiber 30 that has a thin film 32 for causing surface plasmon resonance and has a tip end face 31 that is machined to a specific angle, a light source section 40 for applying white light beams to the tip surface 31 of the optical fiber 30, a beam splitter 50 that is included between the light source section 40 and the optical fiber 30, and a spectrophotometer 60 for detecting the reflection light of light beams that are reflected on the tip surface 31 of the optical fiber 30 and are guided via the beam splitter 50.
摘要翻译：要解决的问题：提供一种便宜且具有提高的测量精度的光纤型表面等离子体共振传感器装置，因为它具有简单的结构并且可以容易地加工，并且还可以同时测量多个样品而进行多次。解决方案：光纤型表面等离子体共振传感器装置20设置有至少一个光纤30，该光纤30具有用于引起表面等离子体共振的薄膜32，并且具有加工成特定角度的尖端面31，光源用于将白光束施加到光纤30的尖端表面31的部分40，包括在光源部分40和光纤30之间的分束器50以及用于检测光束的反射光的分光光度计60 被反射在光纤30的尖端表面31上并且经由分束器50被引导。

6. 发明专利

JP2009212491A Normal-temperature bonding device 有权
标题翻译：正常温度接合装置
公开(公告)号：JP2009212491A
公开(公告)日：2009-09-17
申请号：JP2008223640
申请日：2008-09-01
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： TSUNO TAKESHI , GOTO TAKAYUKI , KINOUCHI MASAHITO , TAWARA SATOSHI , UCHIUMI ATSUSHI , TSUMURA YOICHIRO , IDE KENSUKE , SUZUKI KITEN
IPC分类号： H01L21/02 , B23K15/00 , B23K20/00 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a normal-temperature bonding device capable of uniformly applying a large load on a bonding surface. SOLUTION: The normal-temperature bonding device is provided with: an angle adjusting mechanism 12 for supporting a first sample table 13 for supporting a first substrate on a first stage 11 so that the direction of the first sample table 13 can be changed; a first drive device 14 for driving the first stage 11 in a first direction; a second drive device for driving a second sample table 46 for supporting a second substrate in a second direction; and a carriage supporting table for supporting the second sample table in the first direction when the second substrate and the first substrate are pressure bonded. The angle adjusting mechanism 12 is formed of a plurality of shims. In this case, the normal-temperature device 1 can apply a large load exceeding the load resistance of the second drive device to the first substrate and the second substrate. Further, the normal-temperature bonding device 1 can use the angle adjusting mechanism 12 to change the direction of the first substrate so that the first substrate contacts in parallel to the second substrate, and can uniformly apply the large load on the bonding surface. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够在接合表面上均匀地施加大负载的常温接合装置。解决方案：常温接合装置设置有：角度调节机构12，用于支撑用于在第一平台11上支撑第一基板的第一样品台13，使得可以改变第一样品台13的方向 ; 用于沿第一方向驱动第一平台11的第一驱动装置14; 用于驱动用于在第二方向上支撑第二基板的第二样品台46的第二驱动装置; 以及当所述第二基板和所述第一基板被压接时，用于在所述第一方向上支撑所述第二样品台的托架支撑台。角度调节机构12由多个垫片形成。在这种情况下，常温装置1可以将超过第二驱动装置的负载电阻的大负载施加到第一基板和第二基板。此外，常温接合装置1可以使用角度调节机构12改变第一基板的方向，使得第一基板与第二基板平行地接触，并且可以均匀地在接合表面上施加大的负载。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009164457A Apparatus and method for controlling pressure 有权
标题翻译：用于控制压力的装置和方法
公开(公告)号：JP2009164457A
公开(公告)日：2009-07-23
申请号：JP2008002102
申请日：2008-01-09
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： KINOUCHI MASAHITO , GOTO TAKAYUKI , TAWARA SATOSHI , TSUNO TAKESHI , UCHIUMI ATSUSHI , IDE KENSUKE , SUZUKI KITEN
IPC分类号： H01L21/02
CPC分类号： B32B37/1009 , B23K20/02 , B32B37/10 , B32B2309/68 , H01L21/187 , H01L21/2007 , H01L21/67092 , H01L21/67253
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and method for controlling pressure capable of accurately controlling the pressure in a chamber. SOLUTION: The apparatus comprises an exhaust device 24 for exhausting gas from a chamber 2; a gas supplying device 25 for supplying an introducing gas into the chamber 2; a pressure gauge 23 for measuring pressure in the chamber 2; and a pressure controller 22. The pressure controller 22 controls a gas-exhaust speed of gas exhausted from the chamber 2 by the exhaust device 24 based on target pressure, and a supply flow rate of the introducing gas supplied into the chamber 2 by the gas supplying device 25 based on a measured pressure such that the pressure in the chamber 2 corresponds with the target pressure. The pressure control apparatus 21 can control the pressure in the chamber 2 highly precisely in a further wide range compared with the case that either the gas supplying device 25 or the exhaust device 24 is controlled. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于控制能够精确地控制室中的压力的压力的装置和方法。解决方案：该装置包括用于从腔室2排出气体的排气装置24; 用于将引入气体供给到室2中的气体供给装置25; 用于测量室2中的压力的压力计23; 和压力控制器22.压力控制器22基于目标压力控制由排气装置24从室2排出的气体的排气速度，以及通过气体供给到室2中的导入气体的供给流量基于测量的压力使得腔室2中的压力对应于目标压力。与控制气体供给装置25或排气装置24的情况相比，压力控制装置21能够在更大范围内高精度地控制室2内的压力。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2007324195A Device formed with room temperature bonding, method for manufacturing device, and room temperature bonding apparatus 有权
标题翻译：与室温结合形成的装置，制造装置的方法和室温结合装置
公开(公告)号：JP2007324195A
公开(公告)日：2007-12-13
申请号：JP2006149896
申请日：2006-05-30
申请人： Mitsubishi Heavy Ind Ltd , National Institute Of Advanced Industrial & Technology , 三菱重工業株式会社 , 独立行政法人産業技術総合研究所
发明人： UCHIUMI ATSUSHI , GOTO TAKAYUKI , IDE KENSUKE , FUNAYAMA MASAHIRO , TAKAGI HIDEKI
IPC分类号： H01L21/02
CPC分类号： B32B38/0008 , B23K20/02 , B23K20/22 , B32B37/14 , B32B2457/00 , B81C3/001 , B81C2203/032 , C23C14/14 , C23C14/3414 , C23C14/58 , Y10T428/31678
摘要： PROBLEM TO BE SOLVED: To provide a device that can be obtained by bonding a substrate formed of an unbondable material (for example, SiO 2 system material substrate) in the actual bonding strength with room temperature bonding process, and also to provide a method for manufacturing the same device. SOLUTION: An intermediate material layer 28 generating a bonding strength is formed at an interface 27 between a first substrate 11 and a second substrate 12, and a plurality of metal elements are included in this intermediate material layer. An existing ratio of a plurality of metal elements at the interface is controlled to 0.07 or more with an operation parameter during the sputtering process. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以通过将由不可键合材料（例如，SiO 2 系统材料基板）形成的基板以实际的接合强度与室温接合工艺，并且还提供用于制造相同装置的方法。解决方案：在第一基板11和第二基板12之间的界面27处形成产生接合强度的中间材料层28，并且在该中间材料层中包括多个金属元素。在溅射过程中，通过操作参数将界面处的多个金属元素的现有比率控制在0.07以上。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2003294743A Flexible array, manufacturing method of the flexible array, hybridization method of the flexible array, and measuring method of the flexible array 审中-公开
标题翻译：柔性阵列，灵活阵列的制造方法，柔性阵列的混合方法和柔性阵列的测量方法
公开(公告)号：JP2003294743A
公开(公告)日：2003-10-15
申请号：JP2002101486
申请日：2002-04-03
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： NAKAYAMA HIROYUKI , INUZUKA HIROMASA , UCHIUMI ATSUSHI , TAWARA SATOSHI , SAKAI TAKUMA
IPC分类号： G01N33/53 , C12M1/00 , C12N15/09 , C12Q1/68 , G01N37/00
摘要： PROBLEM TO BE SOLVED: To provide a flexible array having a plurality of ligand specimens immobilized thereon, being very convenient in handling such as hybridization, that is, capable of micronizing the reaction capacity, and capable of simplifying, mass-producing, and further cost-reducing consumables. SOLUTION: This flexible array 1 is characterized in that a plurality of ligand specimens 2a to 2f are aligned/immobilized in the longitudinal direction of an oblong carrier 6. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2003057175A Surface plasmon resonance sensor apparatus 审中-公开
标题翻译：表面等离子体共振传感器装置
公开(公告)号：JP2003057175A
公开(公告)日：2003-02-26
申请号：JP2001243772
申请日：2001-08-10
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： INUZUKA HIROMASA , UCHIUMI ATSUSHI , TAWARA SATOSHI , GOTO TAKAYUKI , NAKAYAMA HIROYUKI
IPC分类号： G01N33/543 , G01N21/27
摘要： PROBLEM TO BE SOLVED: To provide a surface plasmon resonance sensor apparatus that can continuously measure and process a number of samples, is simple in configuration and can travel relatively easily, has improved measurement accuracy, and is inexpensive.
SOLUTION: In the surface plasmon resonance sensor apparatus, a detection section is formed by covering a core fiber section where the cladding layer of an optical fiber is removed partially with a metal layer, a sample for measuring a biochemical reaction mounted at the detection section, and a plasmon resonance that is excited on the metal layer at the detection section when applying laser beams to the optical fiber is utilized for detecting the presence or absence of the biochemical reaction in the sample, thus judging the presence or absence of the generation of the biochemical reaction at the sample based on the light intensity in the scattered light in pulse laser beams to be applied to the optical fiber.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供能够连续地测量和处理多个样品的表面等离子体共振传感器装置，构造简单并且可以相对容易地行进，具有提高的测量精度并且便宜。解决方案：在表面等离子体共振传感器装置中，通过覆盖芯部纤维部分形成检测部分，其中光纤的包层部分地用金属层去除，用于测量安装在检测部分的生化反应的样品，利用在激光束向光纤施加激光时在检测部分的金属层上激发的等离子体共振，用于检测样品中是否存在生物化学反应，从而判断是否存在生物反应基于待施加到光纤的脉冲激光束中的散射光中的光强度在样品处的生化反应。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式