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1. 发明专利

JPH05198946A MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH05198946A
公开(公告)日：1993-08-06
申请号：JP3127392
申请日：1992-01-23
申请人： FURUKAWA ELECTRIC CO LTD
发明人： AMANO TOSHIAKI , SHIROISHI HIROKAZU
IPC分类号： H05K3/46
摘要： PURPOSE:To prevent irregularity from occurring at the surface by stacking a required number of sheets on a base material sheet, with the faces on the sides of adhesives directed toward the side of a base material sheet, and heating and pressing the laminate at a temperature lower than the fusing point of solder so as to bond each layer, and then, heating it at a temperature higher than the fusing point of solder so as to solder each layer. CONSTITUTION:A plural sheets of one-skied circuit films 27 are stacked on a metallic plate 29, with the adhesive layers 15 directed toward the side of the metallic plate 29. This laminate is heated and pressed at a temperature of 170 deg.C with a vacuum press so as to bond adjacent layer with each other. Then, the laminate is passed into a reflow furnace, but it is dipped in hot oil and is heated to a temperature above the fusing point of the solder so as to fuse the solder layer 25 and perform the soldering between layers. Thereupon, a metal base multilayer printed circuit board is completed. Hereby, continuity paths between layers can be made by the lamination of circuit films 27, the bonding between layers, and the soldering between layers, so the formation of a through hole becomes needless, and irregularity ceases to occur at the surface.

2. 发明专利

JPH05136551A SOLDER-COATED PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH05136551A
公开(公告)日：1993-06-01
申请号：JP31974191
申请日：1991-11-08
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： FUKUNAGA TAKAO , SHIROISHI HIROKAZU , FUSE KENICHI , KASHIWABARA HIROTAKA , OCHIAI RYOICHI , AZUMAGUCHI YUTAKA
IPC分类号： H05K3/34 , H05K1/11 , H05K3/40
摘要： PURPOSE:To prevent the leads of components from slipping down between metal conductor pads when the leads of the components are placed on solders and to stabilize the positions of the components by a method wherein a multitude of holes are formed in the metal conductor pads for component mounting use and the solders are respectively applied on the parts other than the holes of the pads. CONSTITUTION:A multitude of square holes 19 are formed in copper foil pads 13 on an insulating substrate 11 in a mesh form to form the pads 13 in a lattice type and solders 15 are respectively applied on the surfaces of the pads. When these soldered materials are used, the solders 15 are precipitated only on conductor parts of the pads 13 and are not precipitated on the parts of the holes 19. Therefore, the solders 15 are also formed in a lattice and bumps of the solders 15 become almost equal on the whole surfaces of the pads. Accordingly, face connecting the tops of the bumps of the solders 15 become almost flat and even if leads of components are placed on the solders, such a matter as the leads slip down between the pads is eliminated. As a result, the positions of the components are stabilized and an accurate soldering can be conducted.

3. 发明专利

JPH04330806A ANTENNA MODULE 失效
公开(公告)号：JPH04330806A
公开(公告)日：1992-11-18
申请号：JP12824891
申请日：1991-05-02
申请人： FUJITSU LTD , FURUKAWA ELECTRIC CO LTD
发明人： MISHIRO EIJI , INAGAKI MITSUO , AZUMAGUCHI YUTAKA , FUSE KENICHI , SHIROISHI HIROKAZU , AMANO TOSHIAKI
IPC分类号： H01Q1/24 , H01Q9/04 , H01Q13/08
摘要： PURPOSE:To realize a high dimension accuracy and a light weight, and to adjust the characteristic of an antenna while an antenna module is mounted on a printed circuit board after manufacture. CONSTITUTION:An antenna element conductive layer 22 made of a metallic foil, and a ground conductive layer 23 are adhered and fixed to the surface of a resin forming body 21 molded like a prescribed shape, and a feeder is drawn out from the pertinent antenna element conductive layer 22. Moreover, a plate member 25 inserted into the inside of the resin forming body 21 is attached so as to be folded to the resin forming body 21. Capacity between the antenna element conductive layer 22 and the ground conductive layer 23 is equivalently changed by sliding the plate member 25, so that the characteristic of the antenna can be adjusted.

4. 发明专利

JPH04208588A FLEXIBLE PRINTED BOARD MODULE AND THREE-DIMENSIONAL CIRCUIT MODULE USING THE SAME 失效
公开(公告)号：JPH04208588A
公开(公告)日：1992-07-30
申请号：JP34105790
申请日：1990-11-30
申请人： FUJITSU LTD , FURUKAWA ELECTRIC CO LTD
发明人： AZUMAGUCHI YUTAKA , HOSOGAI MASAO , OGATA KINUKO , FUSE KENICHI , SHIROISHI HIROKAZU , AMANO TOSHIAKI
IPC分类号： H01R13/639 , H05K1/00 , H05K1/02 , H05K9/00
摘要： PURPOSE:To mount printed boards in high density by engaging recesses formed in a mold integrally formed with a flexible printed board for placing components with protrusions to be secured. CONSTITUTION:Molding materials 21A-21E of injection molding are simultaneously formed integrally on the rear surface of a flexible printed board 22, circuit components are placed on the board 22, and folded at connecting seams of the materials 21A-21E. Protrusions 23 and recesses 24 are provided on the materials 21A-21E provided on the board 22, and the protrusions 23 are engaged with the recesses 24. Thus, the folding fixture of the board 22 can be facilitated by fixedly connecting by the engagements of the protrusions 23 with the recesses 24. Thus, components of twice or more as compared with conventional module can be mounted in high density, and a profile shape can be reduced to 1/2 or less.

5. 发明专利

JPH04199591A SURFACE PACKAGING MODULE 失效
公开(公告)号：JPH04199591A
公开(公告)日：1992-07-20
申请号：JP32566790
申请日：1990-11-29
申请人： FUJITSU LTD , FURUKAWA ELECTRIC CO LTD
发明人： KASHIWABARA HIROTAKA , INAGAKI MITSUO , AZUMAGUCHI YUTAKA , FUSE KENICHI , SHIROISHI HIROKAZU , AMANO TOSHIAKI
IPC分类号： H05K1/11 , H05K1/00 , H05K1/14
摘要： PURPOSE:To reduce time-elapsed deterioration by connecting and fixing terminal parts to a packaging board with resin members independently arranged only at parts of a flexible film which correspond to electronic components mount pads, and terminal parts and resin member unmolded parts formed on a board slackened. CONSTITUTION:With resin members 4, 5 arranged independently only at parts of a flexible film 3 which correspond to electronic component mount pads and terminal parts 7 to form resin member unmolded parts 8 between the mount pads and terminal parts, and the unmolded parts 8 slackened, components are packaged on a packaging board. Therefore, in case of expansion of the board 1, the unmolded parts 8 come elongated; whereas, in case of contraction, the unmolded parts come further elongated. It follows that force acting on the surface packaging module 1 by its expansion or contraction is absorbed by the unmolded parts 8, so that force by expansion or contraction less acts on the soldered junctions of conductive patterns of the board and those of the flexible film 3. This can realize a connected state stable with time.

6. 发明专利

JPH0818222A METHOD TO CORRECT PRECOATED SOLDERING DEFECTIVE PART 失效
公开(公告)号：JPH0818222A
公开(公告)日：1996-01-19
申请号：JP17046294
申请日：1994-06-30
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： FUKUNAGA TAKAO , SHIROISHI HIROKAZU , SHINOHARA TOMOSANE , OBARA YUICHI , KUMAMOTO SATOSHI , FUJIWARA TAKAHIRO
IPC分类号： H05K3/34 , H05K3/22 , H05K3/24
摘要： PURPOSE:To correct precoated solder defectives without giving thermal influence to other parts by locally heating solder to be supplied to the precoated solder defective part without making contact and integrating the solder with the precoated solder. CONSTITUTION:When there are defectives on some pad precoated with solder on the printed circuit substrate, another solder is supplied to the detective part, and melted by locally heating without making contact and is integrated with the precoated solder. Since this correction method locally heats the solder supplied to the defective part by optical beams, etc., without making contact, thermal influence is not given to the parts other than the pad to be corrected, and the defective part is effectively and surely corrected.

7. 发明专利

JPH0613737A SURFACE MOUNTING PRINTED-CIRCUIT BOARD 失效
公开(公告)号：JPH0613737A
公开(公告)日：1994-01-21
申请号：JP19135992
申请日：1992-06-26
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： HIKASA KAZUTO , FUKUNAGA TAKAO , SHIROISHI HIROKAZU , KUMAMOTO SATOSHI , FUJIWARA TAKAHIRO , KONO MASANAO
IPC分类号： H05K3/34
摘要： PURPOSE:To enable an electronic components to be mounted developing no defective soldering due to bridge and ball by a method wherein soldering layers are formed on pads to be coated with a flux and then plated with a releasable sheet so that the releasable sheet may be released to mount electronic components to be heated in the mounting step. CONSTITUTION:Fine pitch pads 3 and rough pitch pads 4 are formed on the surface of an insulating substrate 2 and then soldering layers 5, 6 in thickness required for soldering step of electronic components are formed on respective pads 3, 4. The soldering layers 5, 6 having no bridge and ball at all can be formed since these layers 5, 6 are formed in the stage wherein no electronic components are mounted. Next, the soldering layers 5, 6 are coated with a soldering flux as if covering the same 5, 6 and then the surface is plated with a releasable sheet 8 using the adhesion of the flux 7. Finally, when the electronic components are to be packaged, the releasable sheet 8 is released so that the electronic components may be mounted on the specific position to be heated at solder fusing temperature.

8. 发明专利

JPH04280655A HIGH DENSITY HYBRID CIRCUIT BOARD 失效
公开(公告)号：JPH04280655A
公开(公告)日：1992-10-06
申请号：JP6777091
申请日：1991-03-08
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： FUKUNAGA TAKAO , FUSE KENICHI , SHIROISHI HIROKAZU , HIKASA KAZUTO , KASHIWABARA HIROTAKA , OCHIAI RYOICHI , TOTANI MAKOTO , OTAGURO HIROYUKI
IPC分类号： H01L23/12 , H01L25/00 , H05K1/03 , H05K3/34 , H05K3/40
摘要： PURPOSE:To prevent a gold plated pad from being contaminated by solder by a method wherein the gold plated pad and a solder pad are formed directly on a ceramic board or through the intermediary of a polyimide insulating layer, the polyimide insulating layer protruding higher than the surface of the pad is provided, and a solder layer is provided onto the solder pad. CONSTITUTION:A wire bonding gold plated pad 12 and a solder connection solder pad 14 are formed directly on a ceramic board 11 or through the intermediary of a polyimide insulating layer. A polyimide insulating layer 16a protrudent higher than the surface of the pads concerned is provided between the gold plated pad 12 and the solder pad 14 provided adjacent to each other, and a solder layer 18 precipitation out of a solder precipitation composition which contains organic acid lead and tin powder is provided onto the solder pad 14. Furthermore, the solder pad 14 is surrounded with the polyimide insulating layer 16a, and the surface of the solder layer 18 precipitated on the solder pad 14 is lower than that of the polyimide insulating layer 16a in level.

9. 发明专利

JPH04208587A THREE-DIMENSIONAL CIRCUIT MODULE 失效
公开(公告)号：JPH04208587A
公开(公告)日：1992-07-30
申请号：JP34105690
申请日：1990-11-30
申请人： FUJITSU LTD , FURUKAWA ELECTRIC CO LTD
发明人： MISHIRO EIJI , AZUMAGUCHI YUTAKA , TSUJIMURA YUKO , FUSE KENICHI , SHIROISHI HIROKAZU , AMANO TOSHIAKI
IPC分类号： H05K9/00 , H05K1/00 , H05K1/02 , H05K3/46
摘要： PURPOSE:To mount a printed board in high density by bending a flexible printed board so that a molding material is disposed outside as a stereoscopic polygon, and forming surfaces for forming the polygon in a multilayer structure. CONSTITUTION:A molding material 2 of injection molding is integrally formed simultaneously on the rear surface of a flexible printed board 1. Circuit components are placed on the board 1, the material 2 is bent at its connecting seam, a circuit module of a stereoscopic polygon is formed, surfaces for constituting the polygon are superposed, and the material 2 is so extended as to become multilayers. Since the surfaces for constituting the polygon are superposed when the stereoscopic polygon is formed, the area for mounting the components is increased by an area of the superposed parts. Thus, the components can be placed further in higher density by a stereoscopic circuit of present state as a module, and the module can be reduced in size.

10. 发明专利

JPH04192392A SURFACE TREATMENT METHOD FOR CONDUCTIVE PASTE CIRCUIT CONDUCTOR 失效
公开(公告)号：JPH04192392A
公开(公告)日：1992-07-10
申请号：JP31768490
申请日：1990-11-26
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KATO TOMOYA , SHIROISHI HIROKAZU , AMANO TOSHIAKI , NISHIBASHI ATSUSHI
IPC分类号： H05K3/12 , H05K1/09 , H05K3/22 , H05K3/34 , H05K3/40
摘要： PURPOSE:To facilitate a mounting of an electronic component by soldering by a method wherein a circuit conductor is formed of a conductive paste, which is made using a thermosetting resin as a binder and using metal powder as a filler, and after the conductor is hardened, an excimer laser is applied to a soldering part of the conductive paste circuit conductor. CONSTITUTION:A conductive paste obtainable by mixing 150 to 250 parts weight of silver powder in 100 parts weight of an epoxy resin is subjected to screen printing on a polyimide film, is heated and hardened and a circuit conductor of a necessary pattern is formed. After that, a solder resist containing an epoxy resin as its main component is subjected to screen printing on a region, where a soldering is not needed at the time of mounting of an electronic component, of the conductor, and is heated and hardened. After that, an excimer laser is applied to a soldering part of the circuit conductor. When a soldering is performed on a circuit board manufactured in such a way using an eutectic solder, an excellent wettability with solder is obtained.

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