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1. 发明专利

JPH0440504A GENERATION PROCESSING SYSTEM FOR PARTS MOUNTING POSITION INFORMATION 失效
公开(公告)号：JPH0440504A
公开(公告)日：1992-02-10
申请号：JP14803490
申请日：1990-06-06
申请人： FUJITSU LTD , FUJITSU COMMUNICATION SYST
发明人： MATSUBAYASHI AKINORI , KUBO SHIGERU , YAMANAKA HIDEMOTO , WATANABE MASATO , HANEDA TOMOUMI , HIRAISHI KOICHI
IPC分类号： G05B19/4093
摘要： PURPOSE:To reduce a data processing quantity by segmenting parts into groups where interference does not mutually occur and detecting a part where a parts arrangement pattern becomes the same. CONSTITUTION:An interference processing part 2 which checks an interference state where subsequent parts cannot be mounted owing to the existence of previously mounted parts and selects a parts mounting order by a mounting machine is provided. Then, an evaluation function value considering the number of the parts which cannot be mounted as the result of interference is used as search knowledge, the mounting order as to plural parts is selected and NC data 3 is generated based on the mounting order. Thus, the data processing quantity can be reduced.

2. 发明专利

JPH06162036A PRODUCT INFORMATION MANAGEMENT SYSTEM 失效
公开(公告)号：JPH06162036A
公开(公告)日：1994-06-10
申请号：JP5737191
申请日：1991-03-20
申请人： FUJITSU LTD , FUJITSU COMMUNICATION SYST
发明人： SUDO KOJI , SHUKUTANI MASAO , OKUYAMA KATSUO , ISHIWATARI MASAOKI , UCHIBORI HIDETOSHI , MATSUI TOSHIARI , KUBO SHIGERU , MATSUBAYASHI AKINORI , TOYODA KAZUHIDE , TAKEI EIKO
IPC分类号： B23P21/00 , B65G61/00 , G05B19/418 , G06F17/50 , G06Q50/00 , G06Q50/04 , G06F15/21 , G06F15/60
摘要： PURPOSE:To unify details of the product loaded contents from an equipment mounting design to manufacture, inspection and shipment by preparing an appa ratus mounting file corresponding to an order by using a design data file and a design know-how data file in each separate customer order unit. CONSTITUTION:An equipment mounting design part 10 executes functions of an arrangement design of the equipment and the check of each design condition, etc., based on order information of a customer order file 13a and an estimate in accordance with a request of a design of a conversational format in a terminal equipment 2. In this case, a design data file 13b and design know-how file 13c are used, and an equipment mounting change file 14a is prepared. Also, when the contents of the design data file 13b are changed, a design change/ version number file 14b is prepared, based on design change information, in a design change information managing part 11a and a design version number information managing part 11b of a design change managing part 11. Subsequently, from this information, basic information of a version number unit of an electronic circuit printed board is prepared in a PKG basic information file 14c.

3. 发明专利

JPH04225591A WIRING DEVICE FOR REMODELING AND REPAIR OF PRINTED WIRING BOARD 失效
公开(公告)号：JPH04225591A
公开(公告)日：1992-08-14
申请号：JP40831490
申请日：1990-12-27
申请人： FUJITSU LTD
发明人： ICHIHARA YASUHIRO , MATSUBAYASHI AKINORI , SHINJO MAMORU
IPC分类号： H05K3/22 , H05K3/32
摘要： PURPOSE:To provide a wiring device capable of automatic wiring in order to remodel or repair a printed wiring board. CONSTITUTION:A heater chip device 31 is provided with a wire guide slanting hole 49 and a groove 47, which support one end of a cut off wire. A tube 38 is connected with the heater chip device 31. The tube 38 supports the other end of the cut off wire. The heater chip device 31 is provided with an inner blade member 35 and an outer blade member 37, which cut the wire.

4. 发明专利

JPS5932077B2 JPS5932077B2 - 失效
公开(公告)号：JPS5932077B2
公开(公告)日：1984-08-06
申请号：JP10620579
申请日：1979-08-21
申请人： Fujitsu Ltd
发明人： MATSUBAYASHI AKINORI , TSUCHA AKIRA , SHINJO MAMORU
IPC分类号： H05K1/02 , H05K3/44

5. 发明专利

JPH04111388A MANUFACTURE OF SEMICONDUCTOR DEVICE, AND HEATING FURNACE 失效
公开(公告)号：JPH04111388A
公开(公告)日：1992-04-13
申请号：JP22935590
申请日：1990-08-30
申请人： FUJITSU LTD
发明人： TEJIMA YASUHIRO , SHINJO MAMORU , MATSUBAYASHI AKINORI
IPC分类号： F27B9/14 , B23K1/008 , G05D23/19 , H01L21/56 , H05K3/28 , H05K3/34
摘要： PURPOSE:To execute the hardening operation of a resin and the soldering operation of an electronic component simultaneously in one heating furnace by a method wherein a module is placed on a conveyance part and the module is passed through the heating furnace. CONSTITUTION:A first zone 51 in a heating furnace 50 is set to a first temperature T1 at which a resin 30 used to seal a semiconductor element 10 is hardened; a second zone 52 is set to a second temperature T2 at which a surface-mounting electronic component 40 mounted on a board 20 is soldered. The element 10 is mounted on the board 20; the semiconductor element 10 is covered with the resin 30; after that, creamy solders A's are placed on the mounting face of the board 20; the electronic component 40 is placed on them. In this state, the electronic component is passed inside the heating furnace 50 by using a conveyance part 60; the component is heated at the temperature T1 and hardened. The component is passed through the zone 52 in the heating furnace 50; it is heated at the temperature T2; the solders A's are melted; the electronic component 40 is soldered.

6. 发明专利

JPH03263777A FIXING MEMBER FOR CONNECTOR HOUSING 失效
公开(公告)号：JPH03263777A
公开(公告)日：1991-11-25
申请号：JP6108590
申请日：1990-03-14
申请人： FUJITSU LTD
发明人： MATSUBAYASHI AKINORI , ONODA KAZUMI , OSONE HISAO , KOSHIKAWA NOBUO , SHINJO MAMORU
IPC分类号： H05K7/14
摘要： PURPOSE:To offer a fixing member capable of safely and properly fixing a connector housing to a back board by improving the construction of the fixing member for the back board. CONSTITUTION:Upper and lower oblong holes 2 are regularly formed in a fixing member 1 at the side for mounting a connector housing 53 in such a way as to be in parallel to the elastic deformation direction of the prismatic section 61a of the elastic engagement part 61 of the aforesaid housing 53. The oblong holes 2 are used for fixing the connector housing 58 to the upper and lower sides of a back board 52 when the fixing member 1 is connected thereto. In mounting the connector housing 53, therefore, the projection 61b of the engagement part 61 is coupled to the engagement surface of the fixing member 1, approximately concurrently with the contact and engagement of housing bottom with the upper surface of the fixing member 1. Consequently, the connector housing 53 is properly fixed to the fixing member 1 and, therefore, to the back board 52.

7. 发明专利

JPS60192399A Method of mounting electronic part 失效
公开(公告)号：JPS60192399A
公开(公告)日：1985-09-30
申请号：JP4881484
申请日：1984-03-14
申请人： Fujitsu Ltd
发明人： MATSUBAYASHI AKINORI , WATANABE MASATO , MABU AKIRA , MATSUI TOSHIARI
IPC分类号： H05K13/00 , B23P17/00 , H05K13/04

8. 发明专利

JPS6093003A AUTOMATIC STORAGE FOR PRINT SUBSTRATE 失效
公开(公告)号：JPS6093003A
公开(公告)日：1985-05-24
申请号：JP19738083
申请日：1983-10-20
申请人： FUJITSU LTD
发明人： MATSUBAYASHI AKINORI , MATSUI TOSHIARI , KASHIMA MASAHIRO
IPC分类号： H05K13/02 , B65G1/00 , B65G1/04 , B65G1/07 , B65G1/133 , B65G1/137
摘要： PURPOSE:To check the stock easily and simply by optically detecting substrates in a lot of substrates storing chambers disposed on a rotor. CONSTITUTION:The interior of a rotor 11 is partitioned by a lot of partition plates 12a, 12b... to form substrate storing chambers 13a, 13b,..., and through holes 14 are bored through the base portions of the respective storing chambers 13a, 13b... to permit light of a light emitting element 15 to pass therethrough. Print substrates 3 are leaned against the respective partition plates 12a, 12b... in the respective storing chambers and accomodated therein such a manner as to cover the through holes 14. In this arrangement, light of the light emitting element 15 is detected by a photo detector not shown, thereby to detect the substrates in the storing chambers easily.

9. 发明专利

JPH05324662A TRANSPORTATION AND STORAGE SYSTEM BY SHAPE DATA CONTROL 失效
公开(公告)号：JPH05324662A
公开(公告)日：1993-12-07
申请号：JP12399592
申请日：1992-05-18
申请人： FUJITSU LTD , FUJITSU KIYADOTETSUKU KK
发明人： MORITO MASATO , MATSUBAYASHI AKINORI , MATSUI TOSHIARI , NIHEI TAKASHI
IPC分类号： G05B19/418 , B65G47/49 , B65G61/00 , G06Q50/00 , G06Q50/04 , G06Q50/28 , G06F15/21
摘要： PURPOSE:To realize a transportation and storage system by shape data control to execute correctly physical distribution in a production process by inputting the shape and size data of an actual article by a shape recognizing means, and correcting a data base in respect of the transportation and storage system by the shape data control for parts and material. CONSTITUTION:The data base 10, a processor 20, the shape recognizing means 30, a data base changing means 40, and a sorting and transporting device 50 are provided. The shape and the size of the parts and the material traveling on the transporting device are inputted to the processor 20 by the shape recognizing means 30, and are compared with the shape and size data extracted from the data base 10, and in the case of non-coincidence, the data of the data base 10 is corrected, and the sorting and transporting device 50 is controlled by the shape and size data of the data base 10 after correction, and the transporting destination of the parts and the material are sorted.

10. 发明专利

JPH0472652A STRUCTURE AND METHOD FOR MOUNTING OF SEMICONDUCTOR CHIP 失效
公开(公告)号：JPH0472652A
公开(公告)日：1992-03-06
申请号：JP21351790
申请日：1990-08-10
申请人： FUJITSU LTD
发明人： TEJIMA YASUHIRO , SHINJO MAMORU , MATSUBAYASHI AKINORI
IPC分类号： H01L23/40 , H01L21/56
摘要： PURPOSE:To enhance a heat-dissipating property by a method wherein the edge of a shaft-shaped boss is fixed and bonded to the surface of a semiconductor chip via an adhesive, a heat-dissipating body is mounted on the semiconductor chip and the semiconductor chip is covered with a sealing agent. CONSTITUTION:A heat-dissipating body 10 is constituted of the following: a square-pillar shaft-shaped boss 11 on the surface pf a semiconductor chip 2; and two fins. The heat-dissipating body 10 is mounted on the chip 2 while the lower edge of the shaft-shaped boss is fixed and bonded to the surface of the chip 2 by using an adhesive 20. The mounting face between the lower- stage fins 12 and a circuit board 1 is filled with a sealing agent 6, and the semiconductor chip 2 is covered with the sealing agent 6. Thereby, heat of the chip 2 is conducted to the heat-dissipating body 10 and is released to the outside form the fins 12. That is to say, the heat-dissipating property of the semiconductor chip becomes good. Since the sealing agent 6 is filled into the mounting face between the fins 12 and the circuit board 1, a sealing moistureproof property becomes good.

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