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1. 发明专利

JP2007294960A Plasma display 有权
标题翻译：等离子显示
公开(公告)号：JP2007294960A
公开(公告)日：2007-11-08
申请号：JP2007106660
申请日：2007-04-16
申请人： Fujitsu Hitachi Plasma Display Ltd , 富士通日立プラズマディスプレイ株式会社
发明人： INOUE KOICHI , KAWADA TOYOSHI , SANO YUJI , OSAWA MICHITAKA
IPC分类号： H05K7/20 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide implementation structure for heat dissipation of driver IC with which heat generated in driver ICs of a scan and an address of a plasma display can be effectively conducted outside.
SOLUTION: The implementation structure for heat dissipation comprises: a thermally conductive chassis 103; a driver IC 301 having a circuit forming surface and a circuit non-forming surface; a thermally conductive member 306 arranged between the thermally conductive chassis 103 and the circuit non-forming surface of the driver IC 301; a wiring board 304 one surface of which has wiring connected to a circuit forming surface of the driver IC 301; and a resilient member 308 which pushes another surface of the wiring board 304. The heat generated in the driver IC 301 is dissipated through the thermally conductive member 306 and the thermally conductive chassis 103.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供驱动器IC的散热的实施结构，通过该驱动器IC的驱动IC中产生的热量和等离子体显示器的地址可以在外部有效地进行。解决方案：散热的实施结构包括：导热底盘103; 具有电路形成表面和电路非成形表面的驱动器IC 301; 布置在导热底盘103和驱动器IC301的电路非成形表面之间的导热构件306; 布线板304，其一面具有连接到驱动器IC 301的电路形成表面的布线; 以及弹性构件308，其推动布线板304的另一表面。驱动器IC 301中产生的热量通过导热构件306和导热底盘103消散。（C）2008，JPO和INPIT

2. 发明专利

JP2007148439A Plasma display device and flat display device 有权
标题翻译：等离子体显示装置和平面显示装置
公开(公告)号：JP2007148439A
公开(公告)日：2007-06-14
申请号：JP2007043120
申请日：2007-02-23
申请人： Fujitsu Hitachi Plasma Display Ltd , 富士通日立プラズマディスプレイ株式会社
发明人： KAWADA TOYOSHI , INOUE KOICHI , SANO YUJI
IPC分类号： G09F9/00 , H01L23/36
CPC分类号： H01L2224/16225 , H01L2224/73253
摘要： PROBLEM TO BE SOLVED: To effectively dissipate heat generated from an IC chip which has a flip chip structure, and is mounted on a wiring substrate and protected from being exposed outside, relating to the mounting structure of the IC chip and a display device. SOLUTION: The mounting structure of the IC chip comprises: a first surface with electrodes formed thereon; at least one IC chip 58 having a second surface opposed to the first surface; the wiring substrate 40 on which the IC chip is mounted and which has wiring connected to the electrodes of the IC chip;a protective member 66 which is attached to the wiring substrate and has an aperture part to expose the second surface of the IC chip; and a good heat-conductive resin member 68 which is located in the aperture part of the protective member and can come into contact with the second surface of the IC chip. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了有效地消散由具有倒装芯片结构的IC芯片产生的热量，并且安装在布线基板上并防止其暴露在外部，涉及IC芯片的安装结构和显示器设备。解决方案：IC芯片的安装结构包括：形成有电极的第一表面; 至少一个具有与第一表面相对的第二表面的IC芯片58; 布线基板40，其上安装有IC芯片，并且具有连接到IC芯片的电极的布线;保护部件66，其附接到布线基板并具有露出IC芯片的第二表面的孔部; 以及位于保护部件的开口部的能够与IC芯片的第二面接触的良好的导热性树脂部件68。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2003115568A MOUNTING STRUCTURE OF IC CHIP AND DISPLAY 审中-公开
公开(公告)号：JP2003115568A
公开(公告)日：2003-04-18
申请号：JP2002197621
申请日：2002-07-05
申请人： FUJITSU HITACHI PLASMA DISPLAY
发明人： KAWADA TOYOSHI , INOUE KOICHI , SANO YUJI
IPC分类号： H05K7/20 , G02F1/13 , H01L23/057 , H01L23/12 , H01L23/36 , H01L23/40 , H01L23/538
摘要： PROBLEM TO BE SOLVED: To obtain a mounting structure of IC chip and a display in which an IC chip is mounted, in flip-chip structure, on a wiring board while being protected not to be exposed to the outside and heat generated from the IC chip can be dissipated effectively. SOLUTION: The mounting structure of an IC chip comprises at least one IC chip 58 having a first surface on which an electrode is formed and a second surface opposite to the first surface, a wiring board 40 mounting the IC chip and having wiring being connected with the electrodes of the IC chip, a protective member 66 being fixed to the wiring board and having an opening for exposing the second surface of the IC chip, and a resin member 68 of good thermal conductivity disposed at the opening of the protective member such that it can touch the second surface of the IC chip.

4. 发明专利

JP2001352022A HEAT-DISSIPATING MOUNTING STRUCTURE FOR DRIVER IC 失效
公开(公告)号：JP2001352022A
公开(公告)日：2001-12-21
申请号：JP2000171996
申请日：2000-06-05
申请人： FUJITSU HITACHI PLASMA DISPLAY
发明人： INOUE KOICHI , KAWADA TOKISHI , SANO YUJI , OSAWA MICHITAKA
IPC分类号： H05K7/20 , G09F9/00 , H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a heat-dissipating mounting structure, with which heat generated by a driver IC for the scan and the address of a plasma display can be made to escape effectively. SOLUTION: The driver IC is brought into contact with a heat conductive sheet via a heat conductive chassis, and the heat of the driver IC is dissipated. In this case, the driver IC is pressed to the heat conductive sheet and the heat conductive chassis via an elastic member.

5. 发明专利

JP2007194651A Plasma display device and flat display unit 有权
标题翻译：等离子体显示装置和平板显示单元
公开(公告)号：JP2007194651A
公开(公告)日：2007-08-02
申请号：JP2007043122
申请日：2007-02-23
申请人： Fujitsu Hitachi Plasma Display Ltd , 富士通日立プラズマディスプレイ株式会社
发明人： KAWADA TOYOSHI , INOUE KOICHI , SANO YUJI
IPC分类号： H01L23/36 , G09F9/00 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure of IC chip and a display unit such that an IC chip is mounted on a wiring board in a flip chip structure, the IC chip is protected without exposing outside, and the heat generated by the IC chip can be effectively radiated. SOLUTION: The mounting structure of IC chip comprises at least one IC chip 58 which has a first surface formed with electrodes and a second surface facing the first surface, the wiring board 40 which is mounted with the IC chip and has wiring connected with the electrodes of the IC chip, a protection member 66 which is attached to the wiring board and has the opening for exposing the second surface of the IC chip, and a resin member 68 having a high thermal conductivity which is located in the opening of the protection member and is accessible to the second surface of the IC chip. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供IC芯片和显示单元的安装结构，使得IC芯片以倒装芯片结构安装在布线板上，IC芯片被保护而不暴露在外部，并且产生的热量由IC芯片可以有效辐射。解决方案：IC芯片的安装结构包括至少一个IC芯片58，其具有形成有电极的第一表面和面向第一表面的第二表面，布线板40安装有IC芯片并且具有布线连接与IC芯片的电极连接，安装在布线板上并具有用于露出IC芯片的第二表面的开口的保护构件66和位于开口处的热导率高的树脂构件68 该保护元件可被IC芯片的第二表面接近。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2007110161A Mounting structure for ic chip and display device 有权
标题翻译： IC芯片和显示设备的安装结构
公开(公告)号：JP2007110161A
公开(公告)日：2007-04-26
申请号：JP2007001118
申请日：2007-01-09
申请人： Fujitsu Hitachi Plasma Display Ltd , 富士通日立プラズマディスプレイ株式会社
发明人： KAWADA TOYOSHI , INOUE KOICHI , SANO YUJI
IPC分类号： H01L23/40
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To mount an IC chip on a wiring board in a flip chip structure, and to protect the IC chip without exposing it to the outside, and to validly radiate heat generated by the IC chip concerning the mounting structure of the IC chip and a display device. SOLUTION: This IC chip mounting structure has at least one IC chip 58 having a first surface formed with an electrode and a second surface opposed to the first surface, a wiring board 40 mounted with the IC chip having wiring connected to the electrode of the IC chip, a protective member 66 attached to the wiring board having an opening from which the second surface of the IC chip is exposed and an improved heat conductive resin member 68 arranged in the opening of the protective member so as to be brought into contact with the second surface of the IC chip. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：以倒装芯片结构将IC芯片安装在布线板上，并且保护IC芯片而不暴露于外部，并且有效地辐射由IC芯片产生的关于安装结构的热量的IC芯片和显示装置。解决方案：该IC芯片安装结构具有至少一个具有形成有电极的第一表面和与第一表面相对的第二表面的IC芯片58，安装有具有连接到电极的布线的IC芯片的布线板40 IC芯片的安装在IC芯片的第二面露出的开口的布线板上的保护构件66以及布置在保护构件的开口内的改进的导热树脂构件68被引入与IC芯片的第二表面接触。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2007214581A Plasma display apparatus and flat display apparatus 有权
标题翻译：等离子显示设备和平面显示设备
公开(公告)号：JP2007214581A
公开(公告)日：2007-08-23
申请号：JP2007043121
申请日：2007-02-23
申请人： Fujitsu Hitachi Plasma Display Ltd , 富士通日立プラズマディスプレイ株式会社
发明人： KAWADA TOYOSHI , INOUE KOICHI , SANO YUJI
IPC分类号： H01L23/36 , G09F9/00 , H01L21/60 , H05K7/20 , H05K9/00
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure of an IC chip and a display apparatus, with the IC chip mounted on a wiring substrate with a flip chip structure, the IC chip being protected without being exposed to outside, and capable of effectively releasing heat generated in the IC chip. SOLUTION: A mounting structure of the IC chip includes: a first surface on which an electrode is formed; at least one IC chip 58 having a second surface facing the first surface; a wiring board 40 mounting the IC while having wiring connected to the electrode of the IC chip; a protective member 66 attached to the wiring board and having an opening part to expose the surface of the second surface of the IC chip; and a good thermal conductive resin member 68 which is disposed in the opening part of the protective member and can be brought into contact with the second surface of the IC chip. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供IC芯片和显示装置的安装结构，将IC芯片安装在具有倒装芯片结构的布线基板上，IC芯片被保护而不暴露于外部，并且能够有效地释放IC芯片产生的热量。解决方案：IC芯片的安装结构包括：形成有电极的第一表面; 至少一个IC芯片58具有面向第一表面的第二表面; 布线板40，其安装IC，同时具有连接到IC芯片的电极的布线; 保护构件66，其附接到布线板并且具有露出IC芯片的第二表面的开口部; 以及良好的导热性树脂部件68，其设置在保护部件的开口部，能够与IC芯片的第二面接触。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2002175044A CAPACITIVE LOAD DRIVE CIRCUIT AND PLASMA DISPLAY DEVICE USING THE SAME 失效
公开(公告)号：JP2002175044A
公开(公告)日：2002-06-21
申请号：JP2000393510
申请日：2000-12-25
申请人： FUJITSU HITACHI PLASMA DISPLAY
发明人： SANO YUJI , KAWADA TOYOSHI , INOUE KOICHI , TAKAGI AKIHIRO , KISHI TOMOKATSU
IPC分类号： H04N5/66 , G09G3/20 , G09G3/282 , G09G3/288 , G09G3/296 , G09G3/298 , H01J11/26 , G09G3/28
摘要： PROBLEM TO BE SOLVED: To provide a capacitive load drive circuit, capable of suppressing increase in power consumption. SOLUTION: This capacitive load drive circuit 3 includes a configuration connecting a drive power source 1 with an output terminal via a drive element 6, and is constructed so as to insert an electric power dispersion 2 means between the driving power source 1 and the drive element 6, or insert a resistive impedance in series with respect to the output terminal.

9. 发明专利

JP2002014625A MOUNTING STRUCTURE OF DRIVER MODULE FOR PLASMA DISPLAY PANEL DEVICE 失效
公开(公告)号：JP2002014625A
公开(公告)日：2002-01-18
申请号：JP2000198357
申请日：2000-06-30
申请人： FUJITSU HITACHI PLASMA DISPLAY , FUJI ELECTRIC CO LTD
发明人： INOUE KOICHI , KAWADA TOYOSHI , SANO YUJI , OSAWA MICHITAKA , HIROHASHI OSAMU
IPC分类号： G09F9/00 , H01J11/46 , H01J11/48 , H04N5/66
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure of driver module for plasma display panel device in which the connection of a driver module for scanning and addressing a plasma display device is made a simple structure. SOLUTION: Three connection parts are filled with the same insulating resin 19 to simplify the mounting structure and to decrease the number of kinds of materials to be used. Above-mentioned three connection parts are the part between a flexible wiring board 18 and a driver IC 17, the part between the connecting pad on the wiring end of the flexible wiring board 18 and the connecting pad on the back panel 12 of the plasma display panel, and the part between the connecting pad on the wiring end of the flexible wiring board 18 and the connecting pad of a bus substrate 15 which links a driving circuit board.

10. 发明专利

JP2001358412A CIRCUIT BOARD AND PLASMA DISPLAY USING THE SAME 失效
公开(公告)号：JP2001358412A
公开(公告)日：2001-12-26
申请号：JP2000179363
申请日：2000-06-09
申请人： HITACHI LTD , FUJITSU HITACHI PLASMA DISPLAY
发明人： NAKAMURA TAKAYOSHI , AKIYAMA NOBORU , SAITO RYUICHI , OSAWA MICHITAKA , ONOZAWA MAKOTO , INOUE KOICHI
IPC分类号： H01J11/20 , H01J11/46 , H01L25/07 , H01L25/18 , H04N5/66 , H05K1/02 , H01J11/02
摘要： PROBLEM TO BE SOLVED: To provide a plasma display device wherein voltage margin in a display part is ensured, difference of wiring inductance in each path is reduced and luminance unevenness is eliminated. SOLUTION: A wiring wherein inductance value per unit length is large is made to have a folded structure. Folded parts are made to adjoin each other in such a manner that interval between the tip and the end of the folded part of the wiring is at most 10 mm. To a wiring whose inductance value is large, an eddy current pattern is formed in other layer.

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