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    • 1. 发明专利
    • Plasma display
    • 等离子显示
    • JP2007294960A
    • 2007-11-08
    • JP2007106660
    • 2007-04-16
    • Fujitsu Hitachi Plasma Display Ltd富士通日立プラズマディスプレイ株式会社
    • INOUE KOICHIKAWADA TOYOSHISANO YUJIOSAWA MICHITAKA
    • H05K7/20G09F9/00
    • PROBLEM TO BE SOLVED: To provide implementation structure for heat dissipation of driver IC with which heat generated in driver ICs of a scan and an address of a plasma display can be effectively conducted outside.
      SOLUTION: The implementation structure for heat dissipation comprises: a thermally conductive chassis 103; a driver IC 301 having a circuit forming surface and a circuit non-forming surface; a thermally conductive member 306 arranged between the thermally conductive chassis 103 and the circuit non-forming surface of the driver IC 301; a wiring board 304 one surface of which has wiring connected to a circuit forming surface of the driver IC 301; and a resilient member 308 which pushes another surface of the wiring board 304. The heat generated in the driver IC 301 is dissipated through the thermally conductive member 306 and the thermally conductive chassis 103.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供驱动器IC的散热的实施结构,通过该驱动器IC的驱动IC中产生的热量和等离子体显示器的地址可以在外部有效地进行。 解决方案:散热的实施结构包括:导热底盘103; 具有电路形成表面和电路非成形表面的驱动器IC 301; 布置在导热底盘103和驱动器IC301的电路非成形表面之间的导热构件306; 布线板304,其一面具有连接到驱动器IC 301的电路形成表面的布线; 以及弹性构件308,其推动布线板304的另一表面。驱动器IC 301中产生的热量通过导热构件306和导热底盘103消散。(C)2008,JPO和INPIT