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    • 2. 发明专利
    • POWER REGENERATIVE DEVICE
    • JPH06169579A
    • 1994-06-14
    • JP34311992
    • 1992-11-30
    • FUJI ELECTRIC CO LTD
    • TOGO MITSUHIKOTAKUBO HIROSHI
    • H02J5/00H02M7/48H02M7/797
    • PURPOSE:To reduce the switching loss and the heat generation at the limited operation of a power regenerative device, and lighten the device, and cut down the cost. CONSTITUTION:This relates to a power regenerator which has a converter 103 and an electrolytic capacitor 104, and regenerates power in an AC power source by switching a semiconductor element 101. This is provided with a detector 105, which detects the regenerated current from the converter 103 to an AC power source 200, and a comparator 106, which outputs a reset signal A by comparing the detected value of the detector 105 with the set value from a limited operation setter 107. Furthermore, this is equipped with a driver 110, which generates a drive signal for igniting the semiconductor 101 one time per period of the AC power source 200, a divider 111, which divides the period of a drive signal into plural sections and outputs it, and a latch part 108, which outputs a switching signal being generated by latching the output signal of the divider 111 and resetting it in every section.
    • 5. 发明专利
    • TRANSISTOR MODULE FOR POWER CONVERTER
    • JPH03108749A
    • 1991-05-08
    • JP28403489
    • 1989-10-31
    • FUJI ELECTRIC CO LTD
    • KOBAYASHI SHINICHIHOSEN TORUSUZUKI TATATOMITAKUBO HIROSHI
    • H01L25/07H01L25/18H02M1/00H02M1/08H02M7/537
    • PURPOSE:To enable reduction in wiring inductance for connection of a transistor and an asymmetric device and high dissipation of heat generated from the asymmetric device by placing both devices in a container, and by fixing an electrode of each device to a connection conductor on the container's bottom plate. CONSTITUTION:A transistor 41 and an asymmetric device 43 of small forward- voltage drop and high reverse-voltage drop are placed in a container 11-13. An electrode of each device 41, 43 is fixed to a connection conductor on a container's bottom plate 11, and its other electrodes are connected to the other connection conductors 31, 33, and 34 via wires 5, and the conductors 31-34 are led out of the container's parts 11-13 (bottom plate, side wall, and upper cap) to form outer terminals 61-64 (emitter, collector, base and cathode), respectively. For example, copper-made connection conductors 31-34 are fixed on the copper- made container's bottom plate 11 via an insulating substrate 2. The transistor chip 41, diode chip 42, and a constant voltage diode chip 43 are fixed on the connection conductor 32 by the bottom collector electrode, bottom cathode electrode, and bottom anode electrode, respectively.
    • 7. 发明专利
    • POWER CONVERSION DEVICE TRANSISTOR MODULE
    • JPH03145755A
    • 1991-06-20
    • JP28402789
    • 1989-10-31
    • FUJI ELECTRIC CO LTD
    • OGAWA SHOGOYOSHIDA MASAKAZUTAKUBO HIROSHI
    • H01L25/07H01L25/18H02M1/00H02M1/08H02M7/537
    • PURPOSE:To make transistors uniform and large in surge absorbing effect by a method wherein a pair of a transistor board and an asymmetrical element board is fixed onto a connection conductor on the base plate of a case making their electrodes face downward, and electrodes provided to the other sides of the element boards are connected to another conductor. CONSTITUTION:Connection conductors 31, 32, 33, and 34 are fixed onto a base plate 11 of a case through the intermediary of an insulating board 2. The conductor 32 is separated into a left and a right part, the collector electrodes on the undersides of transistor chips 41A and 41B, the cathode electrodes on the diode chips 42A and 42B, and the anode electrodes on the underside of voltage regulation diode chips 43A and 43B are fixed to the separated parts of the conductor 32 respectively. The emitter electrodes on the upsides of the transistor chips 41A and 41B, the anode electrodes on the upsides of the diode chips 42A and 42B, and the cathode electrodes on the upsides of the voltage regulation diode chips 43A and 43B are connected to the conductors 31, 33, and 34 respectively with metal fine wires 5.
    • 8. 发明专利
    • Semiconductor power module
    • 半导体功率模块
    • JP2013179362A
    • 2013-09-09
    • JP2013124928
    • 2013-06-13
    • Fuji Electric Co Ltd富士電機株式会社
    • FUJITA KENJITAKUBO HIROSHI
    • H01L25/07H01L25/18
    • H01L2224/36H01L2224/40H01L2224/40095H01L2224/40225H01L2224/48091H01L2224/48137H01L2924/00014H01L2924/1305H01L2924/13055H01L2924/13091H01L2924/15787H01L2924/19107H01L2924/00H01L2224/37099H01L2924/00012H01L2224/84
    • PROBLEM TO BE SOLVED: To provide a semiconductor power module that reduces floating inductance in a chip mounting portion without changing a heat radiation structure of a semiconductor chip.SOLUTION: A semiconductor power module 111 includes: a first insulation substrate 4 where a first direct current wiring pattern 1 and an alternating current wiring pattern 3 are joined on the same plane; a second direct current wiring pattern 2 which is located on the first insulation substrate 4 and is placed close to the first direct current wiring pattern 1; a first connection conductor 7 electrically connecting a semiconductor chip 11d mounted on the first direct current wiring pattern 1 with the alternating current wiring pattern 3; and a second connection conductor 8 electrically connecting a semiconductor chip 31s mounted on the alternating current wiring pattern 3 with the second direct current wiring pattern 2. The first connection conductor 7 is joined to one plane of a second insulation substrate 9 and the second connection conductor 8 is joined to the other plane of the second insulation substrate 9.
    • 要解决的问题:提供一种减少芯片安装部分中的浮动电感而不改变半导体芯片的散热结构的半导体功率模块。解决方案:半导体功率模块111包括:第一绝缘基板4,其中第一直流 布线图案1和交流布线图案3在同一平面上接合; 位于第一绝缘基板4上并靠近第一直流布线图案1放置的第二直流布线图案2; 电连接安装在第一直流布线图案1上的半导体芯片11d与交流布线图案3的第一连接导体7; 以及将安装在交流布线图案3上的半导体芯片31s与第二直流布线图案2电连接的第二连接导体8.第一连接导体7接合到第二绝缘基板9的一个平面,第二连接导体 8连接到第二绝缘基板9的另一平面。
    • 9. 发明专利
    • DRIVE CIRCUIT OF SELF-QUENCHING-TYPE SEMICONDUCTOR DEVICE
    • JPH1032976A
    • 1998-02-03
    • JP18567696
    • 1996-07-16
    • FUJI ELECTRIC CO LTD
    • TAKUBO HIROSHI
    • H02J1/00G05F1/10H02M1/08
    • PROBLEM TO BE SOLVED: To suppress di/dt and dV/di while preventing the increase in time delay of the switching in a voltage-controlled-type self-quenching-type semiconductor device such as an IGBT(Insulation Gate Bipolar Transistor). SOLUTION: A switching circuit 6 tums on a transistor 8 (10) based on the ON (OFF) signal of an ON/OFF signal 101 and applies a power supply 15 (16) to the gate of an IGBT 25 via a low-value gate resistor 12 (14). Then, the gate capacity of the IGBT is rapidly charged (discharged) and at the same time VGB increases (decreases), and current Ic begins to increase (decrease) with a small delay time. At this point, a voltage 106 is generated at an inductance 36 being connected between an auxiliary emitter terminal Es and a main emitter terminal Em of the IGBT 25, thus activating a one-short circuit 32 (33). A switching circuit 6 turns off the transistors 8 (10) and 7 (9) due to the one-shot output 102 (103) at this point, switches a gate resistance to 11 (13) with a larger value and relaxes the rising (trailing) speed of Ic.