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1. 发明专利

JP2007298388A Method of manufacturing membrane/electrode junction body for measuring ion conductivity by membrane-thickness-directional four-terminal method 有权
标题翻译：用膜厚度方向四端测量离子电导率膜/电极结体的方法
公开(公告)号：JP2007298388A
公开(公告)日：2007-11-15
申请号：JP2006126506
申请日：2006-04-28
申请人： Espec Corp , National Institute Of Advanced Industrial & Technology , エスペック株式会社 , 独立行政法人産業技術総合研究所
发明人： BA JUKA , TANAKA HIROKAZU , SHIROMA JUN , YASUDA KAZUAKI
IPC分类号： G01N27/406 , H01M8/04 , H01M8/10
CPC分类号： Y02P70/56
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a membrane/electrode junction body used for measuring an ion conductivity, capable of obtaining an accurate measured value irrespective of a wire size of a voltage electrode, and capable of maintaining excellent reproducibility and stability. SOLUTION: In this method of manufacturing the membrane/electrode junction body of the present invention including two stages of hot-press treatments, current electrode membranes 26, 27 are manufactured by embedding voltage membranes 23, 24 respectively into current introduction membranes 21, 22, in the first stage hot-press treatment, and a test membrane 25 is hot-pressed under the condition sandwiched with the current electrode membranes 26, 27 manufactured in the first stage hot-press treatment, in the second stage hot-press treatment. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于测量离子传导性的膜/电极接合体的制造方法，能够获得与电压电极的线尺寸无关的精确测量值，并且能够保持优异的再现性和稳定性。解决方案：在本发明的包括两段热压处理的膜/电极接合体的制造方法中，通过将电压膜23,24分别嵌入电流导入膜21中来制造电流电极膜26,27 ，22，第一阶段热压处理中，在与第一阶段热压处理中制造的当前电极膜26,27夹持的状态下，对第二阶段热压机进行热压治疗。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2010238864A Method for evaluating contamination in semiconductor device manufacturing process 审中-公开
标题翻译：用于评估半导体器件制造工艺中的污染的方法
公开(公告)号：JP2010238864A
公开(公告)日：2010-10-21
申请号：JP2009084391
申请日：2009-03-31
申请人： Espec Corp , エスペック株式会社
发明人： TANAHASHI NORISATO , TANAKA HIROKAZU , AKAMATSU KENSUKE , KUBOTA YASUFUMI
IPC分类号： H01L21/66
摘要： PROBLEM TO BE SOLVED: To evaluate a degree of generation of contaminant fine particles in a semiconductor device manufacturing process, without modifying a manufacturing apparatus.
SOLUTION: A contamination evaluating method includes: a first measuring step ST2 for measuring the characteristic values relating to a shape and a distribution of contaminant fine particles on the surface of a work on a stage, prior to a predetermined step in the semiconductor device manufacturing process; a second measuring step ST3 for measuring the characteristic values relating to a shape and a distribution of contaminant fine particles on the surface of the work passing the predetermined step; and an evaluating step ST4 for evaluating a degree of generation of contaminant fine particles in a predetermined step on the basis of measuring results in the first measuring step ST2 and the second measuring step ST3.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了评估半导体器件制造工艺中的污染物微粒的产生程度，而不改变制造装置。污染评估方法包括：第一测量步骤ST2，用于在半导体中的预定步骤之前测量与工作台上的工件的表面上的污染物微粒的形状和分布有关的特征值设备制造过程; 第二测量步骤ST3，用于测量与通过预定步骤的工件表面上的污染物微粒的形状和分布有关的特征值; 以及基于第一测量步骤ST2和第二测量步骤ST3中的测量结果来评估预定步骤中的污染物微粒的产生程度的评估步骤ST4。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010107493A Apparatus and method for measuring dew shape and distribution 有权
标题翻译：用于测量DEW形状和分布的装置和方法
公开(公告)号：JP2010107493A
公开(公告)日：2010-05-13
申请号：JP2009084467
申请日：2009-03-31
申请人： Espec Corp , Tokyo Univ Of Agriculture & Technology , エスペック株式会社 , 国立大学法人東京農工大学
发明人： TANAHASHI NORISATO , TANAKA HIROKAZU , AKAMATSU KENSUKE , KUBOTA YASUFUMI , UMEDA TSUNEHIRO
IPC分类号： G01B5/20 , G01B5/008
摘要： PROBLEM TO BE SOLVED: To precisely measure the shape and distribution of dew with dew condensation generated on a sample.
SOLUTION: An apparatus 10 for measuring includes: a sample base 16; a probe 18; an excitation part 20 oscillating a tip portion of the probe 18; a determination part determining contact or proximity of the tip portion of the probe 18 with or to dew or a sample W according to the oscillation of the tip portion of the probe 18; a displacement mechanism 22 changing a relative position of the probe 18 to the sample base 16; a relative displacement derivation part measuring a relative displacement of the probe 18 to the sample base 16; a cooling mechanism 48 cooling the surface of the sample to be a dew point or lower; and a measurement portion measuring the shape and distribution of dew generated on the surface of the sample cooled by the cooling mechanism 48 based on the presence/absence of the contact or proximity by the determination part and the relative displacement derived by the relative displacement derivation part.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：精确测量样品上产生的结露的露水形状和分布。解决方案：用于测量的装置10包括：样品基底16; 探头18; 激励部20，其振动探针18的前端部; 确定部件，根据探头18的前端部的振动，确定探针18的前端部与露水部分或试样W的接触或接近; 将探针18相对于样品基体16的相对位置变更的位移机构22; 相对位移导数部分，测量探针18与样品基底16的相对位移; 将样品的表面冷却为露点或更低的冷却机构48; 以及测量部分，测量由冷却机构48冷却的样品表面上产生的露水的形状和分布，基于由确定部件的接触或接近的存在/不存在以及由相对位移导数部分导出的相对位移。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2008200626A Dehumidifying apparatus 有权
标题翻译：除湿装置
公开(公告)号：JP2008200626A
公开(公告)日：2008-09-04
申请号：JP2007040814
申请日：2007-02-21
申请人： Espec Corp , エスペック株式会社
发明人： SAKAMI SHINICHIRO , SAKANE HIROKI , HIRATA TAKUYA , TANAKA HIROKAZU
IPC分类号： B01D53/26
摘要： PROBLEM TO BE SOLVED: To provide a dehumidifying apparatus 10 operable with low power and having high dehumidification efficiency. SOLUTION: The dehumidifying apparatus comprises a main body part 22 which can keep a work fluid sealed and cause a heat pipe phenomenon, a heat insulation part 14 fitted externally with the main body part 22 at a position between the tip end part 22a of the main body part 22 where the liquid-phase work fluid is evaporated and a base side part 22b of the main body part 22 where the gas-phase work fluid is condensed, and a Peltier element heat absorption side 24a for condensing the gas-phase work fluid in the base side part 22b of the main body part 22. Air is dehumidified in the tip end part 22a of the main body part 22. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种以低功率操作且具有高除湿效率的除湿装置10。解决方案：除湿装置包括：主体部分22，其可以保持工作流体密封并引起热管现象;隔热部分14，其在主体部分22的外部装配在前端部分22a 其中液相工作流体蒸发的主体部分22和气相工作流体冷凝的主体部分22的基部侧部分22b和用于冷凝气相工作流体的珀耳帖元件吸热侧24a，主体部22的基部侧部22b中的相位工作流体。主体部22的前端部22a中的空气除湿。（C）2008，JPO＆INPIT

5. 发明专利

JP2008166474A Environmental testing device 有权
标题翻译：环境测试设备
公开(公告)号：JP2008166474A
公开(公告)日：2008-07-17
申请号：JP2006354098
申请日：2006-12-28
申请人： Espec Corp , エスペック株式会社
发明人： SHIMADA TETSUYA , TANAKA HIROKAZU
IPC分类号： H05K9/00 , G01R29/08 , G01R31/26
摘要： PROBLEM TO BE SOLVED: To accurately measure unnecessary radiation waves with decreased energy loss when the environmental temperature and humidity of an object to be tested are made to the predetermined conditions.
SOLUTION: An environmental testing device 1 includes a case 12 having an air-conditioned chamber 25 with a temperature and humidity regulating means housed, and a cover 15 comprising a testing chamber 14 with the object 9 to be tested adjacent to the air-conditioned chamber 25 housed. Through-holes 51, 52 with the air-conditioned chamber 25 and the testing chamber 14 communicated are formed in the case 12. The through-holes 51, 52 are respectively covered by metallic meshes 53, 54 and the case 12 has an electromagnetc shield structure. The cover 15 has an electromagnetic transparency capable of measuring the unnecessary radiation waves of the object 9 to be tested in the testing chamber 14.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：当要测试的对象的环境温度和湿度达到预定条件时，精确地测量具有减少的能量损失的不必要的辐射波。环境检测装置1包括具有容纳有温度和湿度调节装置的空调室25的壳体12和包括测试室14的盖15，其中待测物体9邻近空气调节室25。在壳体12中形成有连通有空调室25和测试室14的通孔51,52。通孔51,52分别被金属网53,54覆盖，壳体12具有电磁屏蔽结构体。盖15具有能够测量待测物体9在测试室14中不必要的辐射波的电磁透镜。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007240331A Environment testing machine 有权
标题翻译：环境试验机
公开(公告)号：JP2007240331A
公开(公告)日：2007-09-20
申请号：JP2006063262
申请日：2006-03-08
申请人： Espec Corp , エスペック株式会社
发明人： TANAKA HIROKAZU
IPC分类号： G01N17/00 , G01R31/26 , H02J9/06
摘要： PROBLEM TO BE SOLVED: To provide an improved environment testing machine constituted so as to prevent the damage of a sample caused by power failure even if the electricity is cut off during test operation. SOLUTION: The environment testing machine is constituted so as not only to set the atmospheric state of the sample M to a testing environment using a commercial power supply 13 but also to perform the environmental test of the sample M in the set high temperature and high humidity testing environment and provided with a power failure detection means for detecting power failure and a control unit 18 which has a backup power supply 15 and a protection control means 23 for controlling the atmospheric state of the sample M using the backup power supply 15 and operates the protection control means 23 accompanied by the detection of power failure due to the power failure detection means. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种改进的环境试验机，其构成为即使在测试操作期间断电，也可以防止由电源故障造成的样品的损坏。
解决方案：环境试验机不仅将样品M的大气状态设置为使用商用电源13的测试环境，而且还在设定的高温下进行样品M的环境试验和高湿度测试环境，并且具有用于检测断电的电源故障检测装置和具有备用电源15的控制单元18和用于使用备用电源15控制样品M的大气状态的保护控制装置23 并且伴随着由于电源故障检测装置的电源故障的检测而操作保护控制装置23。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2007212320A Accelerated surface deterioration test method and device 有权
标题翻译：加速表面检测测试方法和设备
公开(公告)号：JP2007212320A
公开(公告)日：2007-08-23
申请号：JP2006033242
申请日：2006-02-10
申请人： Espec Corp , エスペック株式会社
发明人： SHIMADA TETSUYA , TANAKA HIROKAZU
IPC分类号： G01N17/00
摘要： PROBLEM TO BE SOLVED: To provide an accelerated surface deterioration test method capable of reproducing the surface deterioration sufficiently in a short time, and a accelerated surface deterioration test device capable of performing the test method with a simple device configuration. SOLUTION: The test device 1 is capable of spraying a mixed mist formed by mixing the liquid and gas sprayed directly to the sample W arranged on the sample mounting part 2 from the spray nozzle 10. The test device 1 is capable of regulating amount of mist to be sprayed from the spray nozzle 10 or the mixed ratio of the liquid and gas in the mist by regulating the opening rate of the flow rate regulation valves 16 and 17. Further more the test device 1 is capable of testing the surface degradation promotion test while heating the sample W by heating with the heating means 5. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够在短时间内充分地再现表面劣化的加速表面劣化试验方法，以及能够以简单的装置结构进行试验方法的加速表面劣化试验装置。解决方案：测试装置1能够喷射通过将喷射的液体和气体直接喷射到从喷嘴10排列在样品安装部分2上的样品W而形成的混合雾。测试装置1能够调节通过调节流量调节阀16和17的打开速度，从喷嘴10喷射的雾量或雾中的液体和气体的混合比。此外，测试装置1能够测试表面通过加热装置5加热来加热样品W时的降解促进试验。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2006086386A Material applicable to solder joint and its manufacturing method 审中-公开
标题翻译：适用于焊接接头的材料及其制造方法
公开(公告)号：JP2006086386A
公开(公告)日：2006-03-30
申请号：JP2004270630
申请日：2004-09-17
申请人： Espec Corp , エスペック株式会社
发明人： NAKAGAWA YASUTOSHI , TANAKA HIROKAZU
IPC分类号： H01L21/60 , H05K3/34
CPC分类号： Y02P70/613
摘要： PROBLEM TO BE SOLVED: To provide a material applicable to solder joint which suppresses deterioration of electrical and mechanical characteristics of a joined portion under an environment of high temperature and high humidity, and to provide its manufacturing method. SOLUTION: The material M applicable to solder joint is provided by forming a zinc antioxidant layer 2 including copper and tin on a conductor 1 including copper, and the zinc antioxidant layer 2 is formed by plating the conductor 1 with the tin through hot-dip plating, electrolytic plating or the like. A thickness of the zinc antioxidant layer 2 is 0.5 μm to 20 μm. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供适用于抑制高温高湿环境下的接合部的电气机械特性劣化的焊点的材料，并提供其制造方法。解决方案：通过在包含铜的导体1上形成包含铜和锡的锌抗氧化剂层2来提供适用于焊接接头的材料M，并且通过热镀覆导体1与锡形成锌抗氧化层2 电镀，电解电镀等。抗氧化锌层2的厚度为0.5μm〜20μm。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2010107494A Device and method for measuring condensation core 有权
标题翻译：用于测量凝结核的装置和方法
公开(公告)号：JP2010107494A
公开(公告)日：2010-05-13
申请号：JP2009084468
申请日：2009-03-31
申请人： Espec Corp , Tokyo Univ Of Agriculture & Technology , エスペック株式会社 , 国立大学法人東京農工大学
发明人： TANAHASHI NORISATO , TANAKA HIROKAZU , AKAMATSU KENSUKE , KUBOTA YASUFUMI , UMEDA TSUNEHIRO
IPC分类号： G01N15/00 , G01N1/28 , H01J37/28
摘要： PROBLEM TO BE SOLVED: To measure the size of an adhesive on a sample surface which may become a condensation core.
SOLUTION: This condensation core measuring device includes: a cooling mechanism 48 for generating condensation on the sample surface; and a derivation processing part for deriving a growing degree of dew generated on the sample surface by the cooling mechanism 48, and deriving the adhesive size based on the derived growing degree. The derivation processing part derives the growing degree relative to a plurality of drops of dew on the sample surface, and derives the adhesive size by performing statistical processing by removing the dew having a growing degree over a prescribed threshold to a growing degree of the dew having the smallest growing degree. The growing degree of the dew is determined based on a changing rate of a particle size of the dew on the sample surface measured at each prescribed time.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：测量可能成为冷凝芯的样品表面上的粘合剂的尺寸。解决方案：该冷凝芯测量装置包括：用于在样品表面上产生冷凝的冷却机构48; 以及用于导出由冷却机构48在样品表面产生的生长程度的衍生处理部件，并且基于衍生的生长程度导出粘合剂尺寸。衍生处理部分相对于样品表面上的多个露水滴导致生长程度，并且通过进行统计处理来获得粘合剂尺寸，通过将具有超过规定阈值的生长程度的露水去除至具有最小的增长程度。基于在每个规定时间测量的样品表面的露点的粒径的变化率，确定露点的生长程度。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2010038639A Reliability evaluation method of semiconductor device, and reliability evaluation device of semiconductor device 有权
标题翻译：半导体器件的可靠性评估方法和半导体器件的可靠性评估器件
公开(公告)号：JP2010038639A
公开(公告)日：2010-02-18
申请号：JP2008199918
申请日：2008-08-01
申请人： Espec Corp , エスペック株式会社
发明人： NAKAMURA MAKOTO , TANAKA HIROKAZU
IPC分类号： G01R31/26 , G01R27/02
摘要： PROBLEM TO BE SOLVED: To provide a reliability evaluation method of a semiconductor device capable of shortening a test period for reliability evaluation of the semiconductor device by detecting early an ion migration phenomenon. SOLUTION: This reliability evaluation method of the semiconductor device 1 includes an insulation resistance measuring process for measuring an insulation resistance between a cathode electrode 2 and an anode electrode 3 in the semiconductor device 1 by an insulation resistance meter 13 and a conductor resistance meter 14 in a semiconductor reliability evaluation device 11, the first determination process for determining whether or not a measured insulation resistance value is higher than an insulation resistance limit setting value set beforehand, a conductor resistance measuring process for measuring a conductor resistance of the anode electrode 3 in the semiconductor device 1 corresponding to a determination result in the first determination process, and the second determination process for determining whether or not a measured conductor resistance value is lower than a conductor resistance limit setting value set beforehand. In the method, output for evaluating reliability of the semiconductor device 1 is performed corresponding to a determination result in the second determination process. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以通过早期检测离子迁移现象来缩短半导体器件的可靠性评估的测试周期的半导体器件的可靠性评估方法。解决方案：该半导体器件1的可靠性评估方法包括绝缘电阻测量过程，用于通过绝缘电阻计13测量半导体器件1中的阴极电极2和阳极电极3之间的绝缘电阻和导体电阻半导体可靠性评估装置11中的仪表14，用于确定测量的绝缘电阻值是否高于预先设定的绝缘电阻极限设定值的第一确定处理，用于测量阳极电极的导体电阻的导体电阻测量处理对应于第一确定处理的确定结果的半导体器件1中的第三确定处理和用于确定测量的导体电阻值是否低于预先设定的导体电阻极限设定值的第二确定处理。在该方法中，对应于第二确定处理中的确定结果执行用于评估半导体器件1的可靠性的输出。版权所有（C）2010，JPO＆INPIT

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