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    • 1. 发明专利
    • Device and method for measuring condensation core
    • 用于测量凝结核的装置和方法
    • JP2010107494A
    • 2010-05-13
    • JP2009084468
    • 2009-03-31
    • Espec CorpTokyo Univ Of Agriculture & Technologyエスペック株式会社国立大学法人東京農工大学
    • TANAHASHI NORISATOTANAKA HIROKAZUAKAMATSU KENSUKEKUBOTA YASUFUMIUMEDA TSUNEHIRO
    • G01N15/00G01N1/28H01J37/28
    • PROBLEM TO BE SOLVED: To measure the size of an adhesive on a sample surface which may become a condensation core.
      SOLUTION: This condensation core measuring device includes: a cooling mechanism 48 for generating condensation on the sample surface; and a derivation processing part for deriving a growing degree of dew generated on the sample surface by the cooling mechanism 48, and deriving the adhesive size based on the derived growing degree. The derivation processing part derives the growing degree relative to a plurality of drops of dew on the sample surface, and derives the adhesive size by performing statistical processing by removing the dew having a growing degree over a prescribed threshold to a growing degree of the dew having the smallest growing degree. The growing degree of the dew is determined based on a changing rate of a particle size of the dew on the sample surface measured at each prescribed time.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:测量可能成为冷凝芯的样品表面上的粘合剂的尺寸。 解决方案:该冷凝芯测量装置包括:用于在样品表面上产生冷凝的冷却机构48; 以及用于导出由冷却机构48在样品表面产生的生长程度的衍生处理部件,并且基于衍生的生长程度导出粘合剂尺寸。 衍生处理部分相对于样品表面上的多个露水滴导致生长程度,并且通过进行统计处理来获得粘合剂尺寸,通过将具有超过规定阈值的生长程度的露水去除至具有 最小的增长程度。 基于在每个规定时间测量的样品表面的露点的粒径的变化率,确定露点的生长程度。 版权所有(C)2010,JPO&INPIT
    • 2. 发明专利
    • Inspection device of display device, driving signal supply device, and inspection system of display device
    • 显示装置的检查装置,驱动信号提供装置和显示装置的检查系统
    • JP2003042959A
    • 2003-02-13
    • JP2001232789
    • 2001-07-31
    • Espec Corpエスペック株式会社
    • KUBOTA YASUFUMI
    • G01R31/30G01M11/00G01N21/84G01R31/00G01R31/26G01R31/28H01L21/66
    • PROBLEM TO BE SOLVED: To surely supply a simplified inspection signal, such as solid images and analyzing signal such as a cross cursor, respectively for visual inspection of a display device.
      SOLUTION: In a burn-in device 1, a plurality of FPD modules D are stored in a chamber 20 capable of controlling an internal environment, and a driving signal is inputted into each FPD module D to present the display state. A connector 24 for inputting the analytical signal from an external analyzing signal supply device 51, and an electronic circuit 23 for selecting either the simplified inspection signal generated by a simplified inspection signal generator 22 or the analytical signal inputted via the connector 24 and inputting the signal into the FPD module D are provided in each FPD module D. Hereby, more detailed inspection can be made, by supplying only the FPD module D, where a defect is discovered by using the simplified inspecting signal with the analytical signal.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:分别为显示装置的目视检查提供简单的检查信号,例如实心图像和分析信号(例如十字光标)。 解决方案:在老化装置1中,将多个FPD模块D存储在能够控制内部环境的室20中,并且将驱动信号输入到每个FPD模块D中以呈现显示状态。 用于输入来自外部分析信号供给装置51的分析信号的连接器24和用于选择由简化检查信号发生器22产生的简化检查信号的电子电路23或经由连接器24输入的分析信号,并输入信号 在FPD模块D中设置FPD模块D.因此,可以仅通过仅使用具有解析信号的简化检查信号发现缺陷的FPD模块D进行更详细的检查。
    • 3. 发明专利
    • Method for evaluating contamination in semiconductor device manufacturing process
    • 用于评估半导体器件制造工艺中的污染的方法
    • JP2010238864A
    • 2010-10-21
    • JP2009084391
    • 2009-03-31
    • Espec Corpエスペック株式会社
    • TANAHASHI NORISATOTANAKA HIROKAZUAKAMATSU KENSUKEKUBOTA YASUFUMI
    • H01L21/66
    • PROBLEM TO BE SOLVED: To evaluate a degree of generation of contaminant fine particles in a semiconductor device manufacturing process, without modifying a manufacturing apparatus.
      SOLUTION: A contamination evaluating method includes: a first measuring step ST2 for measuring the characteristic values relating to a shape and a distribution of contaminant fine particles on the surface of a work on a stage, prior to a predetermined step in the semiconductor device manufacturing process; a second measuring step ST3 for measuring the characteristic values relating to a shape and a distribution of contaminant fine particles on the surface of the work passing the predetermined step; and an evaluating step ST4 for evaluating a degree of generation of contaminant fine particles in a predetermined step on the basis of measuring results in the first measuring step ST2 and the second measuring step ST3.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了评估半导体器件制造工艺中的污染物微粒的产生程度,而不改变制造装置。 污染评估方法包括:第一测量步骤ST2,用于在半导体中的预定步骤之前测量与工作台上的工件的表面上的污染物微粒的形状和分布有关的特征值 设备制造过程; 第二测量步骤ST3,用于测量与通过预定步骤的工件表面上的污染物微粒的形状和分布有关的特征值; 以及基于第一测量步骤ST2和第二测量步骤ST3中的测量结果来评估预定步骤中的污染物微粒的产生程度的评估步骤ST4。 版权所有(C)2011,JPO&INPIT
    • 4. 发明专利
    • Apparatus and method for measuring dew shape and distribution
    • 用于测量DEW形状和分布的装置和方法
    • JP2010107493A
    • 2010-05-13
    • JP2009084467
    • 2009-03-31
    • Espec CorpTokyo Univ Of Agriculture & Technologyエスペック株式会社国立大学法人東京農工大学
    • TANAHASHI NORISATOTANAKA HIROKAZUAKAMATSU KENSUKEKUBOTA YASUFUMIUMEDA TSUNEHIRO
    • G01B5/20G01B5/008
    • PROBLEM TO BE SOLVED: To precisely measure the shape and distribution of dew with dew condensation generated on a sample.
      SOLUTION: An apparatus 10 for measuring includes: a sample base 16; a probe 18; an excitation part 20 oscillating a tip portion of the probe 18; a determination part determining contact or proximity of the tip portion of the probe 18 with or to dew or a sample W according to the oscillation of the tip portion of the probe 18; a displacement mechanism 22 changing a relative position of the probe 18 to the sample base 16; a relative displacement derivation part measuring a relative displacement of the probe 18 to the sample base 16; a cooling mechanism 48 cooling the surface of the sample to be a dew point or lower; and a measurement portion measuring the shape and distribution of dew generated on the surface of the sample cooled by the cooling mechanism 48 based on the presence/absence of the contact or proximity by the determination part and the relative displacement derived by the relative displacement derivation part.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:精确测量样品上产生的结露的露水形状和分布。 解决方案:用于测量的装置10包括:样品基底16; 探头18; 激励部20,其振动探针18的前端部; 确定部件,根据探头18的前端部的振动,确定探针18的前端部与露水部分或试样W的接触或接近; 将探针18相对于样品基体16的相对位置变更的位移机构22; 相对位移导数部分,测量探针18与样品基底16的相对位移; 将样品的表面冷却为露点或更低的冷却机构48; 以及测量部分,测量由冷却机构48冷却的样品表面上产生的露水的形状和分布,基于由确定部件的接触或接近的存在/不存在以及由相对位移导数部分导出的相对位移 。 版权所有(C)2010,JPO&INPIT
    • 5. 发明专利
    • Plate heater
    • 板式加热器
    • JP2003045617A
    • 2003-02-14
    • JP2001231714
    • 2001-07-31
    • Espec Corpエスペック株式会社
    • KUBOTA YASUFUMIHIRATA TSUTOMUAKAMATSU KENSUKEOKA TETSUYA
    • H05B3/20H05B3/02H05B3/68
    • PROBLEM TO BE SOLVED: To further equalize thermal conductivity of plate materials for heat transfer in respect of continuity structure to a heater line and support structure when a plurality of plate heaters are used.
      SOLUTION: In this plate heater formed by laminating plate type heating body 2 and the plate material 1 for heat transfer, the heating body 2 is formed by arranging totally four combinations of two respectively transverse and longitudinal rows of heating sections 2a, 2b formed by heater lines 4 spread over the plate material 1 for heat transfer. All of negative electrode side line ends t of a pair of line ends t, t of the heater lines 4 are connected with a single continuity section 7 arranged on one end of the plate material 1 for heat transfer, and all of the other positive electrode side line ends t of the heater lines 4 are also arranged on one end of the plate material 1 for heat transfer. The continuity section 7 is extended toward the end of the other side of one end of the plate material 1 for heat transfer as a power line 5.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:当使用多个板式加热器时,为了进一步均衡连续性结构的板材的导热性与加热线和支撑结构的均匀性。 解决方案:在通过层叠板式加热体2和用于传热的板材1形成的板式加热器中,加热体2通过布置由加热器形成的两个分别横向和纵向的加热部分2a,2b的两组组合而形成 线4铺展在板材1上用于传热。 加热线4的一对线端部t,t的负极侧线端部t的全部与配置在板材1的一端的单个导通部7进行热传递连接,其他所有正极 加热线4的侧线端部t也布置在板材1的一端,用于传热。 连续性部分7延伸到用于传热的板材1的一端的另一侧的端部作为电力线5。
    • 7. 发明专利
    • DISPLAY PANEL STORING RACK
    • JP2002108240A
    • 2002-04-10
    • JP2000297198
    • 2000-09-28
    • TABAI ESPEC CORP
    • KUBOTA YASUFUMI
    • G02F1/13G09F9/00
    • PROBLEM TO BE SOLVED: To facilitate the visual inspection of display panels from a small one to a large one. SOLUTION: A display panel storing rack has racks 4 (41 to 45) where liquid crystal modules 3 to which cables 1 and 2 are connected are loaded and supported for multiple stages, angle adjusting rods 5, a work stand 6 and the like. The racks 42 and 44 and the angle adjusting rods 5 can move in the direction of X1-X2. The liquid crystal modules which are visually inspected can be switched from the small liquid crystal module 31 to the large module only by work for retreating the racks 42 to 44 in the direction of X2. The standing angle of the module can be adjusted and work such as the connection of the cable can be performed in a state where the module is laid. Consequently, a series of visual inspection work on the modules from the small one to the large one is facilitated, work time is shortened and safety at the time of work can be secured.
    • 8. 发明专利
    • ANALOG VOLTAGE GENERATING CIRCUIT
    • JPH02184117A
    • 1990-07-18
    • JP30651688
    • 1988-12-02
    • TABAI ESPEC CORP
    • KUBOTA YASUFUMI
    • H03M1/66H03M1/08
    • PURPOSE:To prevent an overshoot when a difference from an object value is large by inputting one of negative and positive reference voltages of an input reference voltage section to an integration circuit so that the object value stored in an object value storage means and an output voltage of the integration circuit are coincident. CONSTITUTION:The circuit consists of a reference voltage generating section 3 outputting a negative or a positive reference voltage, an integration circuit 2 holding an output voltage when the output is interrupted, an A/D converter 1 converting its output voltage into a digital data, an object value storage means 51 storing an object value, and a correction means 50 inputting one of the reference voltages to the integration circuit 2 by a time operated based on a difference between the object value and the digital data. Then the circuit is controlled so that the voltage held in the integration circuit 2 is coincident with the object value. Thus, the set voltage is surely stabilized and the analog voltage generating circuit with simple constitution is obtained.