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    • 2. 发明专利
    • Electroprocessing method and substrate treatment method
    • 电镀方法和基板处理方法
    • JP2007051374A
    • 2007-03-01
    • JP2006219820
    • 2006-08-11
    • Ebara Corp株式会社荏原製作所
    • KUMEGAWA MASAYUKIKIMURA NORIOFUKUNAGA YUKIOMUTSUHIRA KATSUYUKIDELIGIANNI HARIKLIACOOPER EMANUEL IVEREECKEN PHILIPPE M
    • C25F7/00C25F3/30H01L21/3205H01L21/3213
    • B23H5/08
    • PROBLEM TO BE SOLVED: To provide an electroprocessing method which is capable of leveling the surface of a metallic film on a substrate with fine irregularities at a low processing pressure and capable of processing the metallic film at a uniform processing rate over the entire surface of the metallic film, in the formation of wirings on the substrate by the damascene process. SOLUTION: The electroprocessing method comprises: arranging an electricity supply electrode 31 and a processing electrode 32 on a table 12; arranging an insulator 36 between the electricity supply electrode 31 and the processing electrode 32; bringing the substrate W into contact with the insulator 36 in a manner that the metallic film 6 is opposed against the electricity supply electrode 31 and the processing electrode 32; supplying first and second electrolyte solutions respectively into between the electricity supply electrode 31 and the substrate W and into between the processing electrode 32 and the substrate W in a state electrically insulated by the insulator 36; applying an electric voltage between the electricity supply electrode 31 and the processing electrode 32; and relatively moving a workpiece carrier 11 and the table 12 to perform the electroprocessing of the metallic film 6 on the substrate W. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种电处理方法,其能够在低处理压力下使精细的不规则性在基板上的金属膜的表面平整,并且能够以整体上均匀的加工速率处理金属膜 金属膜的表面,通过镶嵌工艺在衬底上形成布线。 电解处理方法包括:将电源电极31和处理电极32布置在工作台12上; 在供电电极31和处理电极32之间布置绝缘体36; 使基板W与绝缘体36接触,使得金属膜6与供电电极31和处理电极32相对; 在由绝缘体36电绝缘的状态下,将第一和第二电解质溶液分别供给到供电电极31和基板W之间,并进入处理电极32和基板W之间; 在供电电极31和处理电极32之间施加电压; 并且相对移动工件载体11和工作台12以执行金属膜6在基板W上的电处理。版权所有(C)2007,JPO&INPIT
    • 3. 发明专利
    • Electrochemical machining device
    • 电化学加工设备
    • JP2003305615A
    • 2003-10-28
    • JP2002112487
    • 2002-04-15
    • Ebara Corp株式会社荏原製作所
    • YASUDA HOZUMIOBATA ITSUKIKUMEGAWA MASAYUKINABEYA OSAMU
    • B23H3/04B23H3/10H01L21/3205
    • PROBLEM TO BE SOLVED: To provide an electrochemical machining device, capable of machining a conductive material provided on the surface of a board to be flat and further of removing (washing away) deposits from the surface of a workpiece like the board, while, for example, eliminating CMP treatment itself, or reducing the load of the CMP treatment to a minimum. SOLUTION: The electrochemical machining device comprises a machining electrode 84, a power supply electrode 86 for supplying power to the board W, a holding part 42 for holding the board W to be contacted with or approached to the machining electrode 84, ion exchangers 90, 92 arranged between the board W and the electrodes 84, 86, a power source 46 for applying voltage between the machining electrode 84 and the power supply electrode 86, a liquid supply part 62a for supplying a liquid between the board W and the electrodes 84, 86, and driving parts 56, 60 for relatively moving the board W held by the holding part 42 and the machining electrode 84. In the holding part 42, a conductive dummy member 98 for keeping the area where the board W faces the machining electrode 84 while relatively moving constant, is arranged at the other periphery of the board W. COPYRIGHT: (C)2004,JPO
    • 要解决的问题:为了提供一种电化学加工装置,能够将设置在板的表面上的导电材料加工成平坦的部分,并且进一步从诸如板的工件表面去除(洗涤)沉积物, 同时,例如,消除CMP处理本身,或将CMP处理的负载降至最低。 解决方案:电化学加工装置包括加工电极84,用于向板W供电的供电电极86,用于保持与加工电极84接触或接近的板W的保持部42,离子 布置在电路板W和电极84,86之间的交换器90,92,用于在加工电极84和电源电极86之间施加电压的电源46,用于在板W和电源86之间供应液体的液体供应部分62a 电极84,86以及用于相对移动由保持部42和加工电极84保持的板W的驱动部56,60。在保持部42中,具有用于保持基板W朝向的区域的导电性虚拟构件98 加工电极84相对移动恒定,布置在电路板W的另一个周边。版权所有(C)2004,JPO
    • 4. 发明专利
    • Electrode structure and electrolytic processing device
    • 电极结构和电解处理装置
    • JP2007284795A
    • 2007-11-01
    • JP2007122822
    • 2007-05-07
    • Ebara Corp株式会社荏原製作所
    • OBATA ITSUKISHIRAKASHI MICHIHIKOKUMEGAWA MASAYUKISAITO TAKAYUKITAIMA YASUSHISUZUKI TSUKURUYAMADA KAORUMAKITA YUJI
    • C25F7/00B23H3/04H01L21/3063H01L21/3205H01L21/3213
    • PROBLEM TO BE SOLVED: To provide an electrode structure used for an electrolytic processing device which, while omitting a CMP treatment entirely or reducing a load on a CMP treatment to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. SOLUTION: The electrode structure brought into close to or contacted with a workpiece, and subjecting the surface of the workpiece to processing includes: a disk-shaped electrode part 48 made of an insulator; a plurality of processing electrodes 50 provided at the face facing to the workpiece in the electrode part 48; and a plurality of feeding electrodes 52 provided at the face facing to the workpiece in the electrode part 48. The processing electrodes 50 and the feeding electrodes 52 are mutually adjacently arranged via insulators 82a, are provided from the center of the electrode part 48 toward the outer circumference, and are also provided toward the circumferential direction. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种用于电解处理装置的电极结构,其尽可能地完全省略CMP处理或减少CMP处理的负载,但可以处理和平坦化形成的导电材料 或者可以去除(清洁)附着在诸如基板的工件的表面上的外来物质。 解决方案:使工件接近或接触的电极结构,以及使工件的表面经受处理包括:由绝缘体制成的盘形电极部分48; 多个处理电极50,设置在电极部分48的面对工件的面上; 以及设置在电极部分48的面向工件的面的多个供电电极52.处理电极50和馈电电极52经由绝缘体82a相互相邻地布置,从电极部分48的中心朝向 外周面也朝向周向设置。 版权所有(C)2008,JPO&INPIT
    • 5. 发明专利
    • Device and method of electrochemical machining
    • 电化学加工设备及方法
    • JP2004160558A
    • 2004-06-10
    • JP2002325901
    • 2002-11-08
    • Ebara Corp株式会社荏原製作所
    • OBATA ITSUKIKUMEGAWA MASAYUKINABEYA OSAMU
    • B23H3/10C25F3/00
    • PROBLEM TO BE SOLVED: To provide a method and device of electrochemical machining wherein change in electric conductivity of fluid caused by a contaminant such as a product generated in the electrochemical machining is restrained, then good planation is maintained. SOLUTION: There are provided: a machining electrode 42 to freely come close to a substrate W; a power feeding electrode 44 to feed power to the substrate W; a holding part 22 to hold the substrate W; a power source 26 to apply a voltage between the machining electrode 42 and the power feeding electrode 44; a fluid supplying part 50 to supply the fluid between the substrate W and at least either the machining electrode 42 or the power feeding electrode 44; a sensor 80 to measure the electric conductivity of the fluid; and a controller 84 to change machining conditions based on the electric conductivity measured with the sensor 80. COPYRIGHT: (C)2004,JPO
    • 要解决的问题:提供一种电化学加工的方法和装置,其中抑制了由诸如在电化学加工中产生的产品的污染物引起的流体的电导率的变化,因此保持良好的平面化。 解决方案:提供:自由靠近基板W的加工电极42; 供电电极44,用于向基板W供电; 用于保持基板W的保持部22; 电源26,用于在加工电极42和供电电极44之间施加电压; 流体供给部50,用于在基板W与加工用电极42或供电电极44的至少一方供给流体; 用于测量流体的电导率的传感器80; 以及基于由传感器80测量的电导率来改变加工条件的控制器84。版权所有(C)2004,JPO
    • 6. 发明专利
    • Electrolytic working method and apparatus
    • JP2004043952A
    • 2004-02-12
    • JP2003011660
    • 2003-01-20
    • Ebara Corp株式会社荏原製作所
    • KUMEGAWA MASAYUKIYASUDA HOZUMIOBATA ITSUKI
    • B23H3/00C25F3/00C25F3/30C25F7/00H01L21/3205
    • PROBLEM TO BE SOLVED: To provide an electrolytic working apparatus by which an electroconductive material provided on the surface of a substrate is flatly worked, and further, the material stuck to the surface of the object to be worked such as a substrate can be subjected to removing (cleaning) while, e.g., CMP (Chemical Mechanical Polishing) treatment itself is obviated, or the loading of the CMP treatment is reduced.
      SOLUTION: The apparatus is provided with a working electrode 84 having a diameter larger than that of a substrate W, a power feeding electrode 86 feeding power to the substrate W, a retaining part 42 bringing the substrate W into contact with the working electrode 84, ion exchangers 90 and 92 arranged among the substrate W, the working electrode 84 and the power feeding electrodes 86, a power source 46 applying voltage between the working electrode 84 and the power feeding electrode 86, a liquid feeding part 84a feeding a liquid among the substrate W, the working electrode 84 and the power feeding electrode 86, and driving parts 56 and 60 relatively moving the substrate W and the working electrode 84 in a state where the center of the driving of the working electrode 84 is located on the side inner than the outside diameter of the substrate W.
      COPYRIGHT: (C)2004,JPO
    • 10. 发明专利
    • ELECTROLYTIC MACHINING DEVICE AND METHOD
    • JP2003266245A
    • 2003-09-24
    • JP2002067393
    • 2002-03-12
    • EBARA CORP
    • SHIRAKASHI MICHIHIKOKUMEGAWA MASAYUKIYASUDA HOZUMIOBATA ITSUKI
    • B23H3/02C25F3/00C25F7/00
    • PROBLEM TO BE SOLVED: To provide an electrolytic machining device and method capable of forming a target shape with a high precision form by precision machining a workpiece comprising conductive material. SOLUTION: This device comprises a holding part 30 to detachably hold the workpiece W, a machining electrode 32 movable to be close to the workpiece W as held by the holding part 30, a feed electrode 34 to feed to the workpiece W held by the holding part 30, an ion exchanger disposed at least either between the workpiece W and the machining electrode 32 or between the workpiece W and the feed electrode 34, a fluid feed part 70 to feed fluid between the workpiece W where the ion exchanger 40 exists and at least either the machining electrode 32 or the feed electrode 34, a power source 68 to control at least either of a voltage and a current to be supplied to the machining electrode 32 and the feed electrode 34, drive parts 42, 54, 60, and 78 to relatively move the workpiece W held by the holding part 30 and the machining electrode 32, and a numerical control part 72 to numerically control the drive parts 42, 54, 60, 78 and the power source 68. COPYRIGHT: (C)2003,JPO