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1. 发明专利

JP2013184213A Laser beam machining method and laser beam machining apparatus 有权
标题翻译：激光束加工方法和激光束加工装置
公开(公告)号：JP2013184213A
公开(公告)日：2013-09-19
申请号：JP2012053616
申请日：2012-03-09
申请人： Disco Corp , 株式会社ディスコ
发明人： MORIKAZU YOJI
IPC分类号： B23K26/00 , B23K26/38
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining apparatus which, in forming a laser beam machined hole in a workpiece including a first member formed of a first material and a second member formed of a second material connected to each other, the hole being extended from the first member to the second member, can suppress the adherence of fine particles of the second material for the second member formation on the inner wall of the laser beam machined hole.SOLUTION: A laser beam machining method for forming a laser beam machined hole in a workpiece including a first member formed of a first material and a second member formed of a second material connected to each other, the hole being extended from the first member to the second member, the method includes detecting the wavelength of plasma generated by irradiating the first member and the second member with a laser beam and continuing the irradiation with pulsed laser beams having a first output when only plasma beams having the wavelength of the first member are detected, or conducting irradiation with pulsed laser beams having a second output higher than the first output, when plasma beams having the wavelength of the second member are detected, by predetermined shots and then stopping the irradiation.
摘要翻译：要解决的问题：提供一种激光束加工方法和激光束加工装置，其在工件中形成激光加工孔，所述工件包括由第一材料形成的第一部件和由连接到第二材料的第二材料形成的第二部件彼此相对，从第一构件延伸到第二构件的孔可以抑制激光加工孔的内壁上用于第二构件形成的第二材料的细颗粒的附着。解决方案：激光束加工方法用于在工件上形成激光加工孔，所述工件包括由第一材料形成的第一构件和由彼此连接的第二材料形成的第二构件，所述孔从所述第一构件延伸到所述第二构件，所述方法包括检测通过用激光束照射第一构件和第二构件而产生的等离子体的波长，并且继续照射具有先出的脉冲激光束当仅通过预定的射击检测到具有第一构件的波长的等离子体束时，或者在具有比第一输出高的第二输出的脉冲激光束进行照射的情况下，当检测到具有第二构件的波长的等离子体束时，停止照射

2. 发明专利

JP2013163190A Laser beam machining apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2013163190A
公开(公告)日：2013-08-22
申请号：JP2012026265
申请日：2012-02-09
申请人： Disco Corp , 株式会社ディスコ
发明人： MORIKAZU YOJI
IPC分类号： B23K26/00 , B23K26/38
CPC分类号： B23K26/032 , B23K26/0622 , B23K26/386 , B23K26/389 , B23K26/40 , B23K2203/172
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of forming a laser beam machining hole which reaches from a first member to a second member without melting the second member on a workpiece in which the first member and the second member are connected.SOLUTION: A laser beam machining apparatus is provided with a plasma detection means 9 and a control means. The plasma detection means 9 is provided with a beam splitter 92 which diverges plasma light to a first route and a second route, a first bandpass filter 93 which is disposed at the first route and passes only plasma wavelength emitted by the first material, a first photo-detector 94, a second bandpass filter 96 which is disposed at the second route and passes only plasma wavelength emitted by the second material, and a second photo-detector 97. The control means stops irradiation of a pulse laser beam when light intensity outputted from the first photo-detector 94 becomes lower and light intensity outputted from the second photo-detector 97 rises and exceeds a peak value.
摘要翻译：要解决的问题：提供一种激光束加工装置，能够形成从第一部件到第二部件到达第二部件的激光加工孔，而不会使第二部件熔化在第一部件和第二部件连接的工件上。解决方案：激光束加工装置具有等离子体检测装置9和控制装置。等离子体检测装置9设置有分束器92，其将等离子体光发散到第一路线和第二路径，第一带通滤波器93设置在第一路径并且仅通过由第一材料发射的等离子体波长，第一光检测器94，第二带通滤波器96，其设置在第二路径并且仅通过由第二材料发射的等离子体波长和第二光检测器97.当光强度输出时，控制装置停止照射脉冲激光束从第一光检测器94变低，从第二光检测器97输出的光强度上升并超过峰值。

3. 发明专利

JP2013111630A Laser processing apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2013111630A
公开(公告)日：2013-06-10
申请号：JP2011261578
申请日：2011-11-30
申请人： Disco Corp , 株式会社ディスコ
发明人： MORIKAZU YOJI
IPC分类号： B23K26/00 , H01S3/00
CPC分类号： B23K26/00 , B23K26/073 , B23K2201/40
摘要： PROBLEM TO BE SOLVED: To provide a laser processing apparatus having a parallelism adjusting function which can easily adjust the parallelism of laser beam oscillated by a laser oscillator.SOLUTION: The laser processing apparatus includes a beam diameter adjusting unit 64 provided between a laser oscillator 62 for pulse laser beam and a focusing unit 63, an optical path length changing mirror 65 for changing an optical path length by directing a laser beam having passed to the focusing unit, a mirror positioning unit 66 positioning the laser beam at an operation position for guiding the laser beam to the focusing unit 63 and a non-operation position for guiding the laser beam to a detection path, an imaging unit 69 detecting the beam diameter of the laser beam directed to the detection path, an optical path length changing unit 70 changing the optical path length of the imaging unit 69, and a controller controlling the imaging unit 69, the beam diameter adjusting unit 64, and the optical path length changing unit 70. The controller operates to move the imaging unit 69 to two positions where different optical path lengths are provided, detect the beam diameters of the laser beam at the two positions, and controls the beam diameter adjusting unit 64 according to the two beam diameters detected above so that the two beam diameters have a predetermined relation.
摘要翻译：要解决的问题：提供一种具有平行度调节功能的激光加工装置，其可以容易地调节由激光振荡器振荡的激光束的平行度。解决方案：激光加工设备包括设置在用于脉冲激光束的激光振荡器62和聚焦单元63之间的光束直径调节单元64，用于通过引导激光束来改变光程长度的光程长度变换镜65 已经传递到聚焦单元的镜像定位单元66将激光束定位在用于将激光束引导到聚焦单元63的操作位置和用于将激光束引导到检测路径的非操作位置，成像单元69 检测指向检测路径的激光束的光束直径，改变成像单元69的光路长度的光程长度改变单元70，以及控制成像单元69，光束直径调节单元64和光路长度改变单元70.控制器操作以将成像单元69移动到提供不同光程长度的两个位置，检测光路直径激光束在两个位置处，并且根据上述两个光束直径控制光束直径调节单元64，使得两个光束直径具有预定的关系。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2013193105A Laser machining apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2013193105A
公开(公告)日：2013-09-30
申请号：JP2012062365
申请日：2012-03-19
申请人： Disco Corp , 株式会社ディスコ
发明人： MORIKAZU YOJI
IPC分类号： B23K26/00 , B23K26/38 , H01L21/3205 , H01L21/768 , H01L23/14 , H01L23/522
摘要： PROBLEM TO BE SOLVED: To provide a laser machining apparatus capable of efficiently forming a laser machined hole that reaches a second member from a first member in a workpiece in which the first member formed by a first material and the second member formed by a second material are connected.SOLUTION: A plasma detecting means 9 includes a bandpass filter 93 which allows only the wavelength of the plasma emitted from the first member to pass and a photo detector 94 which receives light having passed through the bandpass filter and outputs a light intensity signal to a control means, and the control means calculates an average value by adding a predetermined number of light intensity signals output from the photo detector 94 each time pulse laser beams are irradiated when a laser beam irradiation means activates and performs laser machining to reach the second member from the first member of the workpiece by irradiating the workpiece with the pulse laser beams, and controls the laser beam irradiation means so that irradiation of the pulse laser beams is stopped when the average value drops to a predetermined value.
摘要翻译：要解决的问题：提供一种激光加工装置，其能够从工件中的第一构件有效地形成到达第二构件的激光加工孔，其中由第一材料形成的第一构件和由第二材料形成的第二构件等离子体检测装置9包括带通滤波器93，其仅允许从第一构件发射的等离子体的波长通过;光电检测器94，其接收已经通过带通滤波器的光，并输出光强度信号控制装置，并且当激光束照射装置激活并且执行激光加工以到达第二个时，每次照射脉冲激光束时，通过添加从光电检测器94输出的预定数量的光强度信号来计算平均值通过用脉冲激光束照射工件，并且控制激光器b从工件的第一部件成型电子照射装置使得当平均值下降到预定值时停止脉冲激光束的照射。

5. 发明专利

JP2013193090A Laser processing apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2013193090A
公开(公告)日：2013-09-30
申请号：JP2012060018
申请日：2012-03-16
申请人： Disco Corp , 株式会社ディスコ
发明人： NOMARU KEIJI , WATANABE GORO , MORIKAZU YOJI
IPC分类号： B23K26/06 , H01L21/301
CPC分类号： B23K26/38 , B23K26/0652 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K2203/50
摘要： PROBLEM TO BE SOLVED: To provide a laser processing apparatus that prevents an optical system from being damaged.SOLUTION: A laser processing apparatus includes a workpiece holding unit for holding a workpiece and a laser beam applying unit for applying a laser beam to the workpiece held by the workpiece holding unit. The laser beam applying unit includes a laser beam oscillator for oscillating a laser beam, a focusing unit for focusing the laser beam oscillated by the laser oscillator onto the workpiece held by the workpiece holding unit, and an optical system provided between the laser beam oscillator and the focusing unit for transmitting the laser beam oscillated by the laser oscillator. A wavelength converting mechanism is provided between the optical system and the focusing unit to convert the wavelength of the laser beam oscillated by the laser oscillator into a short wavelength.
摘要翻译：要解决的问题：提供一种防止光学系统损坏的激光加工装置。解决方案：激光加工装置包括用于保持工件的工件保持单元和用于将激光束施加到被保持工件的激光束施加单元通过工件夹持单元。激光束施加单元包括用于振荡激光束的激光束振荡器，用于将由激光振荡器振荡的激光束聚焦到由工件保持单元保持的工件上的聚焦单元，以及设置在激光束振荡器和用于发射由激光振荡器振荡的激光束的聚焦单元。在光学系统和聚焦单元之间提供波长转换机构，以将由激光振荡器振荡的激光束的波长转换成短波长。

6. 发明专利

JP2013119117A Laser machining apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2013119117A
公开(公告)日：2013-06-17
申请号：JP2011269753
申请日：2011-12-09
申请人： Disco Corp , 株式会社ディスコ
发明人： MORIKAZU YOJI
IPC分类号： B23K26/04 , B23K26/00 , B23K26/073 , H01S3/00
摘要： PROBLEM TO BE SOLVED: To provide a laser machining apparatus having a parallelism adjusting function that can easily adjust the parallelism of laser beams oscillated from a laser beam oscillator.SOLUTION: The laser machining apparatus includes: a beam diameter adjusting means disposed between a pulse laser beam oscillator and a condenser; an optical path conversion mirror for converting an optical path of passing laser beams toward the condenser; a mirror positioning means for positioning the mirror into an acting position of guiding the laser beams to the condenser and into a non-acting position of guiding the laser beams to a detecting optical path; a beam diameter detecting mechanism for obtaining the beam diameter of the laser beams guided to the detecting optical path; an optical path length changing means for changing the optical path length of the beam diameter detecting mechanism; and a control means. The control means operates the optical path length changing means to position the beam diameter detecting mechanism into two parts different in optical path length, and operates the beam diameter detecting mechanism in the two parts to respectively detect the beam diameters of the laser beams guided to the detecting optical path, and controls the beam diameter adjusting means such that the two detected beam diameters are in a predetermined relationship.
摘要翻译：要解决的问题：提供一种具有平行度调节功能的激光加工装置，其可以容易地调节从激光束振荡器振荡的激光束的平行度。解决方案：激光加工设备包括：设置在脉冲激光束振荡器和冷凝器之间的光束直径调节装置; 光路转换镜，用于将通过的激光束的光路转换成冷凝器; 反射镜定位装置，用于将反射镜定位到将激光束引导到冷凝器并且进入将激光束引导到检测光路的非作用位置的作用位置; 用于获得被引导到检测光路的激光束的光束直径的光束直径检测机构; 光路长度改变装置，用于改变光束直径检测机构的光路长度; 和控制装置。控制装置操作光路长度改变装置，以将光束直径检测机构定位成光路长度不同的两个部分，并且在两部分中操作光束直径检测机构，以分别检测被引导到的光束直径检测机构的光束直径检测光路，并且控制光束直径调节装置，使得两个被检测的光束直径处于预定的关系。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013107128A Optical device wafer-processing method 有权
标题翻译：光学设备的加工方法
公开(公告)号：JP2013107128A
公开(公告)日：2013-06-06
申请号：JP2011256378
申请日：2011-11-24
申请人： Disco Corp , 株式会社ディスコ
发明人： MORIKAZU YOJI
IPC分类号： B23K26/00 , B23K26/38 , B23K26/40
CPC分类号： H01L33/0095 , B23K26/0057 , B23K26/0624 , H01S5/0217 , H01S5/32341
摘要： PROBLEM TO BE SOLVED: To provide an optical device wafer-processing method which can transport an epitaxy substrate from a transfer substrate without dropping off the epitaxy substrate after applying a laser beam to the buffer layer to thereby break the buffer layer.SOLUTION: This invention relates to an optical device wafer-processing method, namely, a processing method for breaking a buffer layer 13 of an optical device wafer 10 where an optical device layer 12 is bonded to a transfer substrate 15 through a bonding metal layer. The optical device wafer processing method includes: a wafer holding step of holding a transfer substrate side bonded to the optical device wafer on a chuck table 36 of a laser processing apparatus; and a buffer layer breaking step of applying a pulsed laser beam having a wavelength having transmissivity to the epitaxy substrate and having absorptivity to the buffer layer from an epitaxy substrate 11 side to the buffer layer, thereby breaking the buffer layer, wherein the buffer layer breaking step includes a first laser beam applying step of completely breaking the buffer layer corresponding to the optical device area and a second laser beam applying step of incompletely breaking the buffer layer corresponding to the peripheral marginal area.
摘要翻译：要解决的问题：提供一种可以在将激光束施加到缓冲层之后不从外延基板脱落而从转移衬底输送外延衬底从而破坏缓冲层的光学器件晶片处理方法。光学器件晶片处理方法本发明涉及一种光学器件晶片处理方法，即一种用于断开光学器件晶片10的缓冲层13的处理方法，其中光学器件层12通过接合结合到转移衬底15上金属层。光学元件晶片处理方法包括：将激光加工装置的卡盘台36上保持与光学元件晶片接合的转印基板侧的晶片保持工序; 以及缓冲层断裂步骤，将具有透射率的脉冲激光束施加到所述外延基板并且具有从外延基板11侧到所述缓冲层的所述缓冲层的吸收性，从而破坏所述缓冲层，其中所述缓冲层断裂步骤包括完全破坏对应于光学器件区域的缓冲层的第一激光束施加步骤和不完全地破坏对应于周边边缘区域的缓冲层的第二激光束施加步骤。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2011241108A Method for dividing glass plate 有权
标题翻译：玻璃板分割方法
公开(公告)号：JP2011241108A
公开(公告)日：2011-12-01
申请号：JP2010113194
申请日：2010-05-17
申请人： Disco Corp , 株式会社ディスコ
发明人： KOYANAGI OSAMU , MORIKAZU YOJI
IPC分类号： C03B33/02 , B28D1/24 , B28D5/00 , C03B33/09
摘要： PROBLEM TO BE SOLVED: To provide a method for dividing a glass plate, by which a glass plate having a reinforcing layer formed thereon is divided along a set division scheduled line without deteriorating the quality of the glass plate.SOLUTION: The method for dividing the glass plate 2 having the reinforcing layer 21 formed thereon comprises cutting the glass plate 2 along a set division scheduled line by a cutting blade 623. The method includes: a reinforcing layer removing process for removing the reinforcing layer 21 in areas exceeding the thickness of the cutting blade 623 along the division scheduled line by irradiating the reinforcing layer 21 formed on the surface of the glass plate 2 with a laser beam along the set division scheduled line; and a cutting process comprising positioning the cutting blade 623 on the areas 23 where the reinforcing layer 21 of the glass plate 2 subjected to the reinforcing layer removing process is removed, and relatively moving the cutting blade 623 and the glass plate 2 while rotating the cutting blade 623 to cut the glass plate 2 along the division scheduled line where the reinforcing layer 21 is removed.
摘要翻译：要解决的问题：提供一种分割玻璃板的方法，通过该方法，在其上形成有加强层的玻璃板沿着设定的分配预定线分割，而不会降低玻璃板的质量。解决方案：用于分割其上形成有加强层21的玻璃板2的方法包括：通过切割刀片623沿着设定的分割预定线切割玻璃板2.该方法包括：加强层去除工艺，通过沿着设定的划分线照射形成在玻璃板2的表面上的增强层21的激光束，沿着分割预定线的区域超过切割刀片623的厚度的区域中的加强层21; 以及切割工序，其将切割刀片623定位在去除了加强层去除工序的玻璃板2的加强层21的区域23上，同时使切割刀623和玻璃板2同时旋转切割刀片623沿着去除增强层21的分割预定线切割玻璃板2。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2013198905A Laser beam machining device 审中-公开
标题翻译：激光加工设备
公开(公告)号：JP2013198905A
公开(公告)日：2013-10-03
申请号：JP2012066823
申请日：2012-03-23
申请人： Disco Corp , 株式会社ディスコ
发明人： MORIKAZU YOJI , NOMARU KEIJI , NEHASHI KOICHI
IPC分类号： B23K26/00 , B23K26/38
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of efficiently forming a laser beam machined hole reaching from a first member to a second member in a workpiece with the first member made of a first material and the second member made of a second material connected.SOLUTION: A control means includes a storage means storing the intensity of light output from a photodetector 94 on the occasion of irradiation with pulse laser beams, and when operating a laser beam irradiation means to irradiate a workpiece with pulse laser beams to perform laser beam machining reaching from a first member to a second member of the workpiece, subtracts the intensity of last preceding light stored in the storage means from the intensity of the light output from the photodetector 94 on the occasion of pulse laser beam irradiation to calculate a difference, determines whether a calculated value is plus or minus, and controls the laser beam irradiation means so as to stop the pulse laser beam irradiation when a predetermined number of minus values is consecutive.
摘要翻译：要解决的问题：提供一种激光束加工装置，其能够利用由第一材料制成的第一构件和由第二材料制成的第二构件，有效地形成从工件的第一构件到第二构件到达的激光加工孔材料连接。解决方案：控制装置包括存储装置，其存储在照射脉冲激光束时从光电检测器94输出的光的强度，并且当操作激光束照射装置以用脉冲激光束照射工件以执行从工件的第一部件到第二部件的激光加工，在脉冲激光束照射下，从光电检测器94输出的光的强度，减去存储装置中存储的最后一个光的强度，计算出确定计算值是正负还是控制激光束照射装置以停止脉冲激光当预定数量的负值连续时的光束照射。

10. 发明专利

JP2013173160A Laser beam machining method and laser beam machining apparatus 有权
标题翻译：激光束加工方法和激光束加工装置
公开(公告)号：JP2013173160A
公开(公告)日：2013-09-05
申请号：JP2012038889
申请日：2012-02-24
申请人： Disco Corp , 株式会社ディスコ
发明人： MORIKAZU YOJI
IPC分类号： B23K26/00 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining apparatus, by which a workpiece can be cut completely without cutting a protecting member, to which a workpiece is stuck, along a division scheduling line that is formed on the workpiece even when there is a variation in the thickness of a workpiece such as a wafer, and also, by which a laminate that is laminated on a substrate can be surely cut.SOLUTION: In a laser beam machining method, a laser beam machining groove is formed on a workpiece by emitting the laser beam onto the workpiece at a plurality of times, the wavelength of plasma which is generated by emitting the laser beam onto the workpiece is detected, and when only a plasma beam having a first wavelength is detected, the emission of the laser beam is continued, and when a plasma beam having a second wavelength is detected, the emission of the laser beam is stopped after the emission of the laser beam is continued to the terminal of the laser beam machining groove that is being machined.
摘要翻译：要解决的问题：为了提供一种激光束加工方法和激光束加工装置，通过该激光束加工方法，能够完全切割工件，而不会沿着形成在工件上的分割调度线切割被卡住的工件的保护部件即使当诸如晶片的工件的厚度发生变化时，也可以可靠地切割层叠在基板上的层叠体。解决方案：在激光束加工方法中，激光束加工凹槽通过多次将激光束发射到工件上而形成在工件上，检测通过将激光束发射到工件上而产生的等离子体的波长，并且当仅检测到具有第一波长的等离子体束时，激光束的发射继续进行，并且当检测到具有第二波长的等离子体束时，激光束的发射在激光束的发射继续到正在加工的激光加工槽。

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