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1. 发明专利

JP2013248624A Laser processing equipment 审中-公开
标题翻译：激光加工设备
公开(公告)号：JP2013248624A
公开(公告)日：2013-12-12
申请号：JP2012122899
申请日：2012-05-30
申请人： Disco Corp , 株式会社ディスコ
发明人： NOMARU KEIJI
IPC分类号： B23K26/08 , B23K26/00 , B23K26/04
CPC分类号： B23K26/0665 , B23K26/0626 , B23K26/0648 , B23K26/082 , B23K26/0853 , B23K26/0869
摘要： PROBLEM TO BE SOLVED: To provide a laser machining apparatus which can deflect the axis of a laser beam instantly to an X axis direction and a Y axis direction.SOLUTION: A laser machining apparatus includes a workpiece holding means for holding a workpiece, and a laser beam irradiation means having a laser oscillating means 511 for laser beam machining of the workpiece held in the workpiece holding means and having a condenser which condenses the laser beam. The laser beam irradiation means is equipped with the laser oscillating means and a condenser which condenses the laser beam and irradiates it to the workpiece, the condenser is equipped with first and second condenser lenses arrayed in series in an optical axis direction of the laser beam, and is further equipped with a first moving means 56 which moves the first condenser lens 54 in a first direction crossing at right angle to the optical axis, a second moving means 57 which moves the second condenser lens in a second direction crossing at right angle to the first direction, and a power supplying means 7 which supplies power to a first driving source 563 of the first moving means and a second driving source 573 of the second moving means.
摘要翻译：要解决的问题：提供一种能够将激光束的轴线立即偏转到X轴方向和Y轴方向的激光加工装置。解决方案：激光加工装置包括用于保持工件的工件保持装置和激光束照射装置具有激光振荡装置511，用于激光束加工保持在工件保持装置中的工件，并具有冷凝激光束的冷凝器。激光束照射装置配备有激光振荡装置和冷凝器，其将激光束冷凝并将其照射到工件，冷凝器配备有沿激光束的光轴方向串联排列的第一和第二聚光透镜，并且还配备有第一移动装置56，该第一移动装置56使第一聚光透镜54沿与光轴成直角交叉的第一方向移动;第二移动装置57，其将第二聚光透镜沿与第二方向成直角相交; 第一方向，以及向第一移动装置的第一驱动源563供给电力的供电装置7和第二移动装置的第二驱动源573。

2. 发明专利

JP2013240869A Cutting apparatus with cutting tool 有权
标题翻译：切割设备与切割工具
公开(公告)号：JP2013240869A
公开(公告)日：2013-12-05
申请号：JP2012116410
申请日：2012-05-22
申请人： Disco Corp , 株式会社ディスコ
发明人： SAKAMOTO TAKESHI
IPC分类号： B23Q11/00 , B23D5/02 , B23Q11/10
摘要： PROBLEM TO BE SOLVED: To provide a cutting apparatus with a cutting tool capable of reducing a risk of adhering cut waste to an upper face of a workpiece and scratching of the upper face by removing the cut waste from the upper face of the workpiece.SOLUTION: A cutting apparatus with a cutting tool for cutting a workpiece is provided with: a chuck table for holding a workpiece; a cutting means with the cutting tool including a cutting tool wheel composed of a cutting tool shank including a cutting edge cutting the workpiece held by the chuck table, and a wheel base mounted with the cutting tool shank, a spindle to which the cutting tool wheel is mounted and a drive source for rotating the spindle; and a cleaning liquid supply means for supplying a cleaning liquid to the workpiece cut by the cutting means with the cutting tool. The cleaning liquid supply means includes: a cleaning liquid supply source; a cleaning liquid supply passage connected to the cleaning liquid supply source to penetrate a center of the spindle and formed in an inside of the wheel base; and a cleaning liquid jetting port communicating with the cleaning liquid supply passage formed on a rotating locus of the cutting tool shank.
摘要翻译：要解决的问题：提供一种具有切削工具的切削装置，该切削工具能够通过从工件的上表面去除切割废料来降低将切割废料附着到工件的上表面并刮擦上表面的风险。具有用于切割工件的切割工具的切割装置设置有：用于保持工件的卡盘台; 切割装置，包括切割工具轮，该切割工具轮由切割工具柄组成，切割工具柄包括切割由夹盘支撑的工件的切割刃和安装有切割工具柄的轮基座;切割工具轮安装有用于旋转主轴的驱动源; 以及清洁液供给装置，用于通过切割工具向由切割装置切割的工件供应清洁液体。清洗液供给装置包括：清洗液供给源; 清洗液供给通路，与清洗液供给源连接，贯通主轴的中心并形成在车轮基座的内侧; 以及与形成在切削工具柄的旋转轨迹上的清洗液供给通道连通的清洗液喷射口。

3. 发明专利

JP2013233618A Method of mounting flange 有权
标题翻译：法兰安装方法
公开(公告)号：JP2013233618A
公开(公告)日：2013-11-21
申请号：JP2012107479
申请日：2012-05-09
申请人： Disco Corp , 株式会社ディスコ
发明人： IGARASHI MOTOAKI
IPC分类号： B24B45/00 , B24B27/06
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting a flange capable of reducing the corrected amount of an end face of a flange after the flange with a corrected end face is re-mounted on a spindle.SOLUTION: A method of mounting a flange includes a flange mounting step of mounting a flange (74) on a tapered portion (711a) at the distal end of a spindle (711), an end face correcting step of correcting an end face (741a) of the flange, a mounting direction marking step of forming marks (711c, 743) for indicating a mounting direction at the distal end of the spindle and on the flange before or after the end face correction step, and a flange re-mounting step of re-mounting the flange with a corrected end face on the tapered portion at the distal end of the spindle, while the mark at the distal end of the spindle is aligned with the mark on the flange, after the flange with a corrected end face is removed from the spindle.
摘要翻译：要解决的问题：提供一种安装凸缘的方法，该凸缘能够将具有经修正的端面的凸缘后的法兰的端面的校正量减少到主轴上。安装法兰的方法包括将凸缘（74）安装在主轴（711）的前端的锥形部（711a）上的法兰安装工序，修正凸缘的端面（741a）的端面修正工序，安装方向在端面校正步骤之前或之后形成用于指示主轴远端和法兰上的安装方向的标记（711c，743）的标记步骤，以及将凸缘重新安装到凸缘的凸缘重新安装步骤在主轴的远端处的锥形部分上的校正端面与主轴的被修正的端面的凸缘从主轴上移除之后，在主轴的远端处的标记与凸缘上的标记对准。

4. 发明专利

JP2013230477A Laser machining apparatus and laser machining method 审中-公开
标题翻译：激光加工设备和激光加工方法
公开(公告)号：JP2013230477A
公开(公告)日：2013-11-14
申请号：JP2012102507
申请日：2012-04-27
申请人： Disco Corp , 株式会社ディスコ
发明人： OGOSE NOBUMORI
IPC分类号： B23K26/00 , B23K26/38 , B23K26/40 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a laser machining apparatus and a laser machining method capable of applying uniform laser machining without depending on a laser irradiation surface state of a workpiece.SOLUTION: A laser machining apparatus is for applying laser machining to a workpiece, and includes a laser beam irradiation means that includes a chuck table for holding the workpiece, a laser oscillator, and a machining head having a condensing lens for collecting laser beam oscillated from the laser oscillator, a reflection light quantity detection means that detects the reflection light quantity of the laser beam irradiated to the workpiece held on the chuck table from the laser beam irradiation means, and an output adjusting means that adjusts the output of the laser beam oscillated from the laser oscillator based on the reflection light quantity detected by the reflection light quantity detection means.
摘要翻译：要解决的问题：提供能够在不依赖于工件的激光照射面状态的情况下进行均匀激光加工的激光加工装置和激光加工方法。解决方案：激光加工装置用于对工件进行激光加工，包括激光束照射装置，其包括用于保持工件的卡盘台，激光振荡器和具有用于收集从激光振荡器振荡的激光束的聚光透镜的加工头;反射光量检测装置，其检测反射光量从激光束照射装置照射到保持在卡盘台上的工件的激光束;以及输出调节装置，其根据由反射光量检测的反射光量调节从激光振荡器振荡的激光束的输出检测手段。

5. 发明专利

JP2013226607A Chuck table and machining device having the same 有权
标题翻译：具有相同功能的表和加工装置
公开(公告)号：JP2013226607A
公开(公告)日：2013-11-07
申请号：JP2012098649
申请日：2012-04-24
申请人： Disco Corp , 株式会社ディスコ
发明人： NOMIYA SUSUMU
IPC分类号： B23Q3/08 , B24B41/06
摘要： PROBLEM TO BE SOLVED: To suction-hold a plate-like workpiece to a holding surface without changing a chuck table when suction-holding the plate-like workpiece of a different shape.SOLUTION: A chuck table 1 includes a first suction part 2, second suction parts 3a, 3b, and a third suction part 4. These suction parts have a first communicating hole 6, second communicating holes 7, and a third communicating hole 8 respectively. A machining device 100 having the chuck table 1 includes first piping 11, second piping 12 and third piping 13 for connecting the respective communicating holes to a suction source 9, and a first valve 110, a second valve 120 and a third valve 130 disposed at the respective piping. The opened/closed state of these valves is switched to change the area of a holding surface to which a plate-like workpiece is suction-held. Even the plate-like workpiece of a different shape can thereby be suction-held to the chuck table 1 without needing to change the chuck table 1.
摘要翻译：要解决的问题：在吸附保持不同形状的板状工件时，将板状工件吸附到保持表面而不改变卡盘台。解决方案：卡盘台1包括第一吸入部分2，第二吸入部3a，3b和第三吸引部4.这些吸引部具有第一连通孔6，第二连通孔7和第三连通孔8。具有卡盘台1的加工装置100包括用于将各个连通孔连接到吸入源9的第一管道11，第二管道12和第三管道13，以及设置在其上的第一阀110，第二阀120和第三阀130 各自的管道。这些阀的打开/关闭状态被切换以改变被夹持板状工件的保持表面的面积。即使不同形状的板状工件也可以被吸引到卡盘台1而不需要改变卡盘台1。

6. 发明专利

JP2013215868A Chuck table 有权
标题翻译： CHUCK TABLE
公开(公告)号：JP2013215868A
公开(公告)日：2013-10-24
申请号：JP2012090866
申请日：2012-04-12
申请人： Disco Corp , 株式会社ディスコ
发明人： KATAOKA MASAMICHI
IPC分类号： B23Q3/08 , B23Q11/00
摘要： PROBLEM TO BE SOLVED: To provide a chuck table capable of preventing intrusion of machining water which includes machining chips, underneath a plate-like workpiece.SOLUTION: A chuck table includes: a holding part 11 having a holding surface 12 which sucks a plate-like workpiece; a base part 13 supporting the holding part 11; a water sealing surface 2a formed on an outer peripheral side of the holding part 11 in an upper surface of the base part 13; and a water supply part 3a which supplies water above the water sealing surface 2a. The holding surface 12 is formed into a similar figure to the plate-like workpiece W to be held and smaller in area than the plate-like workpiece W. The water sealing surface 2a is formed at a position lower than the holding surface 12, and has the same width as a width between an outer peripheral edge 12a of the holding surface 12 and an outer peripheral edge Wc of the plate-like workpiece W placed on the holding surface 12, coinciding the center of the workpiece W with the center of the holding surface 12. Water supplied from the water supply part 3a is filled between a lower surface Wb of the plate-like workpiece W held by the holding part 11 and the water sealing surface 2a to form a water sealing part 1a. Since the water sealing part 1a seals a clearance between the lower surface Wb of the plate-like workpiece W and the holding surface 12, intrusion of the machining water into the clearance can be prevented, and adhesion of machining chips to the lower surface Wb of the plate-like workpiece can be prevented.
摘要翻译：要解决的问题：提供一种卡盘台，其能够防止在板状工件下方包括加工切屑的加工水的侵入。解决方案：卡盘台包括：保持部11，其具有保持板12，像工件; 支撑保持部11的基部13; 在基部13的上表面上形成在保持部11的外周侧的水封面2a; 以及在水封面2a上方供水的供水部3a。保持面12形成为与被保持的板状工件W类似，并且面积比板状工件W小。水封面2a形成在比保持面12低的位置，具有与保持表面12的外周边缘12a和放置在保持表面12上的板状工件W的外周缘Wc之间的宽度相同的宽度，与工件W的中心重合从供水部3a供给的水被填充在由保持部11保持的板状工件W的下表面Wb与水密封面2a之间，形成水封部1a。由于水封部1a密封板状工件W的下表面Wb与保持面12之间的间隙，因此能够防止加工用水进入间隙的侵入，并且加工芯片与下表面Wb的附着可以防止板状工件。

7. 发明专利

JP2013193105A Laser machining apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2013193105A
公开(公告)日：2013-09-30
申请号：JP2012062365
申请日：2012-03-19
申请人： Disco Corp , 株式会社ディスコ
发明人： MORIKAZU YOJI
IPC分类号： B23K26/00 , B23K26/38 , H01L21/3205 , H01L21/768 , H01L23/14 , H01L23/522
摘要： PROBLEM TO BE SOLVED: To provide a laser machining apparatus capable of efficiently forming a laser machined hole that reaches a second member from a first member in a workpiece in which the first member formed by a first material and the second member formed by a second material are connected.SOLUTION: A plasma detecting means 9 includes a bandpass filter 93 which allows only the wavelength of the plasma emitted from the first member to pass and a photo detector 94 which receives light having passed through the bandpass filter and outputs a light intensity signal to a control means, and the control means calculates an average value by adding a predetermined number of light intensity signals output from the photo detector 94 each time pulse laser beams are irradiated when a laser beam irradiation means activates and performs laser machining to reach the second member from the first member of the workpiece by irradiating the workpiece with the pulse laser beams, and controls the laser beam irradiation means so that irradiation of the pulse laser beams is stopped when the average value drops to a predetermined value.
摘要翻译：要解决的问题：提供一种激光加工装置，其能够从工件中的第一构件有效地形成到达第二构件的激光加工孔，其中由第一材料形成的第一构件和由第二材料形成的第二构件等离子体检测装置9包括带通滤波器93，其仅允许从第一构件发射的等离子体的波长通过;光电检测器94，其接收已经通过带通滤波器的光，并输出光强度信号控制装置，并且当激光束照射装置激活并且执行激光加工以到达第二个时，每次照射脉冲激光束时，通过添加从光电检测器94输出的预定数量的光强度信号来计算平均值通过用脉冲激光束照射工件，并且控制激光器b从工件的第一部件成型电子照射装置使得当平均值下降到预定值时停止脉冲激光束的照射。

8. 发明专利

JP2013193090A Laser processing apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2013193090A
公开(公告)日：2013-09-30
申请号：JP2012060018
申请日：2012-03-16
申请人： Disco Corp , 株式会社ディスコ
发明人： NOMARU KEIJI , WATANABE GORO , MORIKAZU YOJI
IPC分类号： B23K26/06 , H01L21/301
CPC分类号： B23K26/38 , B23K26/0652 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K2203/50
摘要： PROBLEM TO BE SOLVED: To provide a laser processing apparatus that prevents an optical system from being damaged.SOLUTION: A laser processing apparatus includes a workpiece holding unit for holding a workpiece and a laser beam applying unit for applying a laser beam to the workpiece held by the workpiece holding unit. The laser beam applying unit includes a laser beam oscillator for oscillating a laser beam, a focusing unit for focusing the laser beam oscillated by the laser oscillator onto the workpiece held by the workpiece holding unit, and an optical system provided between the laser beam oscillator and the focusing unit for transmitting the laser beam oscillated by the laser oscillator. A wavelength converting mechanism is provided between the optical system and the focusing unit to convert the wavelength of the laser beam oscillated by the laser oscillator into a short wavelength.
摘要翻译：要解决的问题：提供一种防止光学系统损坏的激光加工装置。解决方案：激光加工装置包括用于保持工件的工件保持单元和用于将激光束施加到被保持工件的激光束施加单元通过工件夹持单元。激光束施加单元包括用于振荡激光束的激光束振荡器，用于将由激光振荡器振荡的激光束聚焦到由工件保持单元保持的工件上的聚焦单元，以及设置在激光束振荡器和用于发射由激光振荡器振荡的激光束的聚焦单元。在光学系统和聚焦单元之间提供波长转换机构，以将由激光振荡器振荡的激光束的波长转换成短波长。

9. 发明专利

JP2013188836A Method for determining right and wrong of holding table 有权
标题翻译：用于确定保持表的正确和错误的方法
公开(公告)号：JP2013188836A
公开(公告)日：2013-09-26
申请号：JP2012057004
申请日：2012-03-14
申请人： Disco Corp , 株式会社ディスコ
发明人： SATO KICHIZO
IPC分类号： B23Q17/00 , B23Q3/08 , B24B41/06
摘要： PROBLEM TO BE SOLVED: To determine whether a workpiece holding force on a holding face is lowered by staying of processing dust caused by processing onto the holding face of a holding table and being sucked.SOLUTION: In a processing apparatus provided with: a holding table 2 having a holding face 20a sucking and holding a plate-like workpiece; a first pipe 23 communicated with the holding face 20a; a second pipe 24 connected to the first pipe 23 and communicated with a suction source 27 via a suction valve 26; a third pipe 25 connected to the second pipe 24 and communicated with a fluid supply source 29 via a supply valve 28; and a pressure gage 50 measuring the pressure in the first pipe 23, the right and wrong of the holding table 2 is determined, in a state of holding nothing on the holding face 20a, depending on whether the pressure of the first pipe 23 when a suction force or a fluid jetting force is applied to the holding face 20a is within a normal pressure range deeming the holding face 20a to be normal, or is within a defective pressure range deeming the holding face 20a to be defective.
摘要翻译：要解决的问题：通过将由加工引起的加工灰尘停留在保持台的保持面上并被吸住来确定保持面上的工件保持力是否下降。解决方案：在具有：保持台 2具有吸附并保持板状工件的保持面20a; 与保持面20a连通的第一管23; 连接到第一管23并通过吸入阀26与抽吸源27连通的第二管24; 连接到第二管24并通过供给阀28与流体供给源29连通的第三管25; 以及测量第一管23中的压力的压力计50，根据第一管23的压力是否在保持面20a上的压力时，确定保持台2的右侧和右侧不正确的状态吸持力或流体喷射力被施加到保持面20a处于将保持面20a正常的正常压力范围内，或者在认为保持面20a有缺陷的缺陷压力范围内。

10. 发明专利

JP2013188755A Laser machining method 有权
标题翻译：激光加工方法
公开(公告)号：JP2013188755A
公开(公告)日：2013-09-26
申请号：JP2012054536
申请日：2012-03-12
申请人： Disco Corp , 株式会社ディスコ
发明人： MANTANI KAZUYA
IPC分类号： B23K26/18 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a laser machining method for preventing welding of a tape and damage to a holding table, even on the occurrence of such situations that a laser beam is applied to the periphery of an outer peripheral edge across an outer peripheral edge of a workpiece.SOLUTION: A laser machining method includes a guard member arrangement step of forming a guard portion, which surrounds a workpiece, by arranging a guard member, which interferes with an entry of a laser beam, along an outer peripheral edge of the workpiece on a tape on the outer peripheral side of the workpiece, at least before implementation of a laser machining step. In the laser machining step, laser machining ranging from one end of an outer periphery of the workpiece to the other end thereof is applied, and the laser beam applied to a position to protrude to the outer peripheral side of the workpiece is absorbed by the guard portion.
摘要翻译：要解决的问题：为了提供一种用于防止带的焊接和损坏保持台的激光加工方法，即使在发生激光束被施加到外周边缘的周边的情况下，的激光加工方法。激光加工方法包括：防护部件布置步骤，其形成围绕工件的防护部分，通过布置妨碍激光束入口的防护部件沿着所述防护部件的外周边缘至少在实施激光加工步骤之前，工件在工件的外周侧的带上。在激光加工步骤中，施加从工件的外周的一端到另一端的激光加工，并且施加到突出到工件的外周侧的位置的激光束被防护件吸收一部分。

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