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1. 发明专利

JP2004087467A Thermal fuse for resistive circuit substrate 有权
公开(公告)号：JP2004087467A
公开(公告)日：2004-03-18
申请号：JP2003173651
申请日：2003-06-18
申请人： Denso Corp , Fujikura Ltd , 株式会社デンソー , 株式会社フジクラ
发明人： EGUCHI KATSUO , SUZUKI TAKAO , ITO MASANORI , MIYAZAWA KAZUHIRO , NAMIKAWA AKITO
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To prevent fuse solder from sliding off from a board to lose a fuse function in an abnormality when a large current flows and a resistive circuit abruptly generates heat.
SOLUTION: A base body 17 that works as a bridge for a resistive circuit 2 is provided on an procelain enamel substrate 1 as a fuse base 16, and aside from this, nonconductive bases 18 through which a current does not flow are provided at, for example, four corners of an area where solder is placed. A solder fuse 7 is placed such that the base body 17 and the nonconductive base 18 are covered, and thereby a thermal fuse 14 is formed. Even in the case that a large current flows in the abnormality of motor lock or the like, and the base body 17 in addition to the resistive circuit abruptly generates heat, and thus a contacting interface between the solder and the base body 17 melts, the nonconductive base 18, through which current does not flow since a temperature rise is delayed in the base 18 compared with the base body 17 through which the current flows, acts to keep the solder 7, and prevents slide-off from the substrate.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2004079307A Temperature fuse of resistor circuit board 审中-公开
公开(公告)号：JP2004079307A
公开(公告)日：2004-03-11
申请号：JP2002236733
申请日：2002-08-14
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： URUGA KENICHI , YAGI SHIGEKI , EGUCHI KATSUO , ITO MASANORI
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To prevent a fuse solder from slipping off a board to lose a fuse function at the abnormal time when a large current flows.
SOLUTION: A fuse base provided on an enamel board 1 is divided by a groove 20 that runs from one side edge on one end side of the fuse base in a lengthwise direction to the opposite side edge on the other end side, to generate a peninsular part 16c where a current is hard to flow. A solder fuse 7 is so provided as to cover a fuse base 16 to constitute a temperature fuse 14. Even if a surface of the solder that contacts a wide area 16d melts when the wide area 16d where a current is easy to flow of the fuse base 16 heats significantly after a large current flows into a resistor circuit at an abnormal case, such as a motor locks, the peninsular part 16c where a current is hard to flow is slower in temperature rising than the wide area 16d where a current is easy to flow, to retain the solder 7, thus preventing it from slipping off the board.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2003332015A Manufacturing method of enamel circuit board with insertion terminal part 审中-公开
标题翻译：具有插入端子的电机电路板的制造方法
公开(公告)号：JP2003332015A
公开(公告)日：2003-11-21
申请号：JP2002133588
申请日：2002-05-09
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： HATADA MICHINORI , EGUCHI KATSUO , ITO MASANORI
IPC分类号： H01R43/00 , H05K3/12 , H05K3/40 , H01R12/16
摘要： PROBLEM TO BE SOLVED: To smoothly detach and attach an enamel circuit board with an insertion terminal part from and to a socket. SOLUTION: A conductor circuit 3 is formed by screen-printing conductive paste on the enamel substrate 2 and baking, and terminal parts 3a, 3b of the conductor circuit 3 are made as the insertion terminal parts 4, 5 to equipment sockets 6, 7 to form the enamel circuit board 1 with the insertion terminal part. In screen-printing the conductive paste on the enamel substrate 2, viscosity of the conductive paste to be used is adjusted to 80-150 Pa.s. A surface of a terminal part conductor (the terminal parts 3a, 3b of the conductor circuit 3) can be smooth, and the insertion terminal parts 4, 5 of the enamel circuit board 1 with the insertion terminal part can be smoothly detached and attached from and to the sockets 6, 7. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：平滑地将插入端子部件的搪瓷电路板与插座连接并附接到插座。解决方案：导体电路3通过在搪瓷基板2上进行丝网印刷导电浆料并进行烘烤而形成，导体电路3的端子部分3a，3b作为插入端子部分4,5被制成设备插座6 7，以形成具有插入端子部分的搪瓷电路板1。在搪瓷基板2上的导电糊的丝网印刷中，使用的导电糊的粘度调整为80〜150Pa·s。端子部导体（导体电路3的端子部3a，3b）的表面可以是平滑的，并且具有插入端子部分的搪瓷电路板1的插入端子部分4,5可以平滑地分离并且从以及插座6,7。（C）2004，JPO

4. 发明专利

JP2013062443A Flat plate-shaped cooler 审中-公开
标题翻译：平板式冷却器
公开(公告)号：JP2013062443A
公开(公告)日：2013-04-04
申请号：JP2011201074
申请日：2011-09-14
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： EGUCHI KATSUO , SAITO YUJI , TAKAHASHI MAKOTO , TAHARA YUICHIRO
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a flat plate-shaped cooler which improves heat exchange efficiency by making cooling fluid generate a turbulent flow.SOLUTION: A flat plate-shaped cooler 1 is formed to have a flat plate shape as a whole and has a flow passage 2 which is formed therein and allows cooling fluid to flow therethrough. Interposition parts 3 extending in a direction intersecting with a flowing direction of the cooling fluid to make the cooling fluid generate a turbulent flow are disposed inside the flow passage 2. Due to the generation of the turbulent flow of the cooling fluid inside the flow passage, heat exchange efficiency between the cooling fluid and a wall face within the flow passage is improved, and the flat plate-shaped cooler 1 has high cooling capacity without increasing a flow rate and a length or a cross section of the flow passage. In other words, the size of the flat plate-shaped cooler 1 can be reduced. Since the interposition parts 3 can be mounted by pressing them into the flow passage 2, the flat plate-shaped cooler 1 has a simplified structure and thus is highly manufacturable.
摘要翻译：要解决的问题：提供一种平板式冷却器，其通过使冷却液产生湍流而提高热交换效率。解决方案：平板形冷却器1整体形成为平板形状，并且其中形成有流动通道2，并允许冷却流体流过其中。在与冷却流体的流动方向相交的方向上延伸以使冷却流体产生湍流的位置部分3设置在流路2的内部。由于流路内部的冷却流体的紊流的产生，冷却流体与流路内的壁面之间的热交换效率提高，平板状冷却器1具有高的冷却能力，而不增加流路的流量和流路的长度或截面。换句话说，可以减小平板状冷却器1的尺寸。由于可以通过将插入部3压入流路2来安装插入部3，所以平板状冷却器1具有简单的结构，因此是高度可制造的。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2004079295A Temperature fuse of resistor circuit board 审中-公开
公开(公告)号：JP2004079295A
公开(公告)日：2004-03-11
申请号：JP2002236081
申请日：2002-08-13
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： URUGA KENICHI , YAGI SHIGEKI , EGUCHI KATSUO , ITO MASANORI
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To prevent a fuse solder from slipping off a board to lose a fuse function at the abnormal time when a large current flows into a resistor circuit.
SOLUTION: A fuse base 16 is provided in the middle of a resistor circuit 2 on an enamel board 1, and a fuse solder 7 is provided on the fuse base 16, constituting a temperature fuse 14. The fuse base 16 for installing the fuse solder 7 is composed of an assembly of multiple fine bases 17 distributed continuously in plane with fine gaps at a discontinuous part formed on the resistor circuit 2. In such abnormal time as a large current flows into the resistor circuit 2, no large current flows into the assembly of the fine bases 17 itself to discourage temperature rising of the fine bases 17. Thus, melting of such solder part 7 as contacts the fine base 17 is delayed to retain the solder, preventing it from slipping off the board.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2004079294A Temperature fuse of resistor circuit board 审中-公开
公开(公告)号：JP2004079294A
公开(公告)日：2004-03-11
申请号：JP2002236080
申请日：2002-08-13
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： URUGA KENICHI , YAGI SHIGEKI , EGUCHI KATSUO , ITO MASANORI
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To prevent a fuse solder from slipping off a board to lose a fuse function at the abnormal time when a large current flows.
SOLUTION: A base body 17 that bridges a resistor circuit 2 is provided on a enamel board 1 as a fuse base 16. Inside of it, an inner independent base 18 to which no current directly flows (though flows through a solder) is provided away from the base body 17. A solder fuse 7 is so provided as to cover the base body 17 and the inner independent base 18, constituting a temperature fuse 14. Even if a surface of a solder 7 that contacts the base body 17 melts after the base body 17 heats up significantly at such abnormal time when a large current flows into the resistor circuit 2, the inner independent base 18 where no current directly flows is slower in temperature rising than the base body 17 where a current directly flows to retain the solder 7, preventing it from slipping off the board.
COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2005116487A Thermal fuse for resistance circuit board 审中-公开
标题翻译：电阻电路板的保险丝
公开(公告)号：JP2005116487A
公开(公告)日：2005-04-28
申请号：JP2003352894
申请日：2003-10-10
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： EGUCHI KATSUO , YAGI SHIGEKI , ITO MASANORI , OKUYAMA HITOSHI
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To prevent a current by potential difference from flowing among a plurality of thermal fuses to deteriorate the thermal fuses and degrade the performance.
SOLUTION: This resistance circuit board has the plurality of thermal fuses 14 in a resistance circuit 2 formed on a substrate 1. A fuse base 6 of an electric conduction paste is formed to mediate between the resistance circuit 2. A cover glass 8 protecting the resistance circuit 2 is coated except for the thermal fuse part 14. Fuse solder 7 is placed on the fuse base 6, and an insulation film 15 of a synthetic resin is formed on the fuse solder 7. There is no possibility that the current by potential difference flows among the plurality of thermal fuses 14 even if an electrolyte medium is on the cover glass 8. There is no possibility that the fuse solder secularly deteriorates due to oxidization etc. either.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了防止多个热熔断器之间的电位差流过电流，导致热保险丝劣化并降低性能。解决方案：该电阻电路板在形成在基板1上的电阻电路2中具有多个热熔丝14.形成导电浆料的熔丝座6，以在电阻电路2之间进行介电。盖玻璃8 保护电阻电路2除了保险丝部分14之外被涂覆。保险丝焊料7放置在保险丝座6上，并且在熔丝焊料7上形成合成树脂的绝缘膜15.不可能存在电流即使电解质介质在盖玻璃8上，也可以通过多个热熔断器14之间的电位差流动。熔融焊料也不会由于氧化等而长时间劣化。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2004079306A Temperature fuse of resistor circuit board 审中-公开
标题翻译：电阻电路板温度保险丝
公开(公告)号：JP2004079306A
公开(公告)日：2004-03-11
申请号：JP2002236732
申请日：2002-08-14
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： URUGA KENICHI , YAGI SHIGEKI , EGUCHI KATSUO , ITO MASANORI
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To prevent a fuse solder from slipping off a board to lose a fuse function at the abnormal case when a large current flows.
SOLUTION: A base body 17 is provided with a half-separation base 18 which is connected to it only through a narrow connection part 17c for hardness of current flow. A solder fuse 7 is so provided as to cover the base body 17 and the half-separation base 18 to constitute a temperature fuse 14. Even if a surface of a solder 7 that contacts the base body 17 melts after the base body 17 heats up significantly at such abnormal time when a large current flows into the resistor circuit 2, the half-separation base 18 where a current is hard to flow is slower in temperature rising than the base body 17 where a current is easy to flow to retain the solder 7, thus preventing it from slipping off the board.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了防止在大电流流过的异常情况下，保险丝焊料从板上滑落而失去保险丝功能。解决方案：基体17设置有半分离基部18，半基部18仅通过窄连接部17c与电流的硬度连接。焊接保险丝7被设置为覆盖基体17和半分离基部18以构成温度保险丝14。即使在基体17加热之后接触基体17的焊料7的表面熔化在大电流流入电阻电路2的这种异常时，显着地在电流难以流动的半分离基座18的温度升高时比电流容易流动的基体17慢，以保持焊料 7，从而防止其从板上滑落。版权所有（C）2004，JPO

9. 发明专利

JP2002064171A COOLER FOR ELECTRONIC COMPONENTS 失效
公开(公告)号：JP2002064171A
公开(公告)日：2002-02-28
申请号：JP2000250247
申请日：2000-08-21
申请人： FUJIKURA LTD
发明人： MOCHIZUKI MASATAKA , MASUKO KOICHI , TAKAMIYA AKIHIRO , EGUCHI KATSUO
IPC分类号： H05K7/20 , H01L23/427 , H01L23/467
摘要： PROBLEM TO BE SOLVED: To provide a cooler for electronic components which allows the manufacturing man-hour to be reduced. SOLUTION: The cooler has radiation fins 9 for radiating heat produced by electronic components in the air to cool the electronic components. The electronic component 6 contacts a mount 7 provided on a part of a plate-like base 7 made of a heat conductive material. A large number of radiation fins 9 are mounted in the form of erection in a place apart from the mount 7 on the base 7 with their roots cast with the base 7. A motor-driven fan 10 is mounted on the base 7 for blowing air toward the fins 9.

10. 发明专利

JP2000039272A FIXING STRUCTURE OF HEAT PIPE 失效
公开(公告)号：JP2000039272A
公开(公告)日：2000-02-08
申请号：JP20998698
申请日：1998-07-24
申请人： FUJIKURA LTD
发明人： SAITO YUJI , MOCHIZUKI MASATAKA , MASUKO KOICHI , EGUCHI KATSUO , TAN NUYEN
IPC分类号： F28D15/02
摘要： PROBLEM TO BE SOLVED: To reduce the number of parts and the number of processes and hereby improve productivity, and further improve heat transfer efficiency as a whole between a heat pipe and a heat transfer plate. SOLUTION: A fixing structure for a heat pipe is adapted such that the heat pipe 5 where a condensible fluid is encapsulated as a working fluid in a degassed state in a closed container 7 is fixed freely to deliver heat in the state where it is extended along a heat transfer plate 4. The fixing structure is formed integrally with the heat transfer date 4 in the state where it is protruded from the surface of the heat transfer plate 4. There is further provided a holding piece with a tip end portion 15 coupled with the heat transfer plate 4 freely to derive heat. The heat pipe 5 is enclosed with the holding piece 13 from an external surface side and is fixed.

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