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    • 2. 发明专利
    • Air volume control module for air-conditioner of automobile
    • 用于汽车空调的空气体积控制模块
    • JP2005289243A
    • 2005-10-20
    • JP2004108657
    • 2004-04-01
    • Fujikura Ltd株式会社フジクラ
    • HATADA MICHINORIYAGI SHIGEKI
    • B60R16/02B60H1/00H01L23/36H01L23/58H05K7/20
    • H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a compact air volume control module for an air-conditioner of an automobile which need not any die, and manufactured at low cost. SOLUTION: A porcelain-clad substrate 27 is used for a circuit substrate 22, and a heat radiation plate 23 formed of a metallic plate is used for a heat radiation member to cool a power transistor 24 mounted on the circuit substrate 22. A base housing 25 has a connector mounting part 25b which is hollow and opened downwardly. The circuit substrate 22 is mounted on the base housing 25 so as to expose an upper portion thereof with the power transistor 24. The heat radiation plate 23 is mounted on the circuit substrate 22 so as to be brought into surface contact with the body part of the power transistor 24. Since a metallic plate is used for the heat radiation member, the air volume control module is compact compared with a heat sink having a plurality of fins, unnecessary for any die, and manufactured at low cost. The power transistor 24 is directly cooled with air, and excellent cooling effect can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种用于汽车空调的紧凑型空气量控制模块,其不需要任何模具,并且以低成本制造。 解决方案:将覆铜基板27用于电路基板22,并且将由金属板形成的散热板23用于散热构件以冷却安装在电路基板22上的功率晶体管24。 基座壳体25具有中空且向下开口的连接器安装部25b。 电路基板22安装在基座壳体25上,以便用功率晶体管24暴露其上部。散热板23安装在电路基板22上,以便与电路基板22的主体部分 功率晶体管24.由于金属板用于散热构件,与具有多个翅片的散热器相比,空气量控制模块是紧凑的,对于任何模具是不必要的,并且以低成本制造。 功率晶体管24被空气直接冷却,并且可以获得优异的冷却效果。 版权所有(C)2006,JPO&NCIPI
    • 5. 发明专利
    • Air volume control module for air-conditioner of automobile
    • 用于汽车空调的空气体积控制模块
    • JP2005289242A
    • 2005-10-20
    • JP2004108656
    • 2004-04-01
    • Fujikura Ltd株式会社フジクラ
    • YAGI SHIGEKIHATADA MICHINORI
    • B60R16/02B60H1/00H01L23/36H05K1/02H05K1/11H05K7/20
    • H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a compact air volume control module for an air-conditioner of an automobile which is reduced in air loss, and manufactured at low cost without the need for any die. SOLUTION: A heat radiation plate 23 formed of a metallic plate is used for a heat radiation member to cool a power transistor 24 mounted on a circuit substrate 22. A base housing 25 has a connector mounting part 25b which is hollow and opened downwardly. The heat radiation plate is mounted by inserting a lower portion of the heat radiation plate 23 in the base housing 25. The circuit substrate 22 is mounted on a lower portion of the heat radiation plate 23. A body part of the power transistor 24 is mounted on the heat radiation plate 23 in a surface contact state. A terminal 22 is formed on the circuit substrate 22 itself. Since the metallic plate is used for the heat radiation member, the air-striking area is reduced compared with that of a heat sink having a plurality of fins, and air loss is reduced. Further, the air volume control module is manufactured inexpensively and compactly. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种用于汽车空调的紧凑型空气量控制模块,其减少空气损失,并且以低成本制造而不需要任何模具。 解决方案:由金属板形成的散热板23用于散热构件以冷却安装在电路基板22上的功率晶体管24.基座壳体25具有中空且开放的连接器安装部分25b 向下。 散热板通过将散热板23的下部插入基座壳体25而安装。电路基板22安装在散热板23的下部。功率晶体管24的主体部分被安装 处于表面接触状态的散热板23上。 端子22形成在电路基板22本身上。 由于金属板用于散热构件,与具有多个翅片的散热片相比,打击区域减小,并且空气损失减少。 此外,空气量控制模块被廉价且紧凑地制造。 版权所有(C)2006,JPO&NCIPI
    • 6. 发明专利
    • Thermal fuse for resistance circuit board
    • 电阻电路板的保险丝
    • JP2005116487A
    • 2005-04-28
    • JP2003352894
    • 2003-10-10
    • Fujikura Ltd株式会社フジクラ
    • EGUCHI KATSUOYAGI SHIGEKIITO MASANORIOKUYAMA HITOSHI
    • H01H37/76
    • PROBLEM TO BE SOLVED: To prevent a current by potential difference from flowing among a plurality of thermal fuses to deteriorate the thermal fuses and degrade the performance.
      SOLUTION: This resistance circuit board has the plurality of thermal fuses 14 in a resistance circuit 2 formed on a substrate 1. A fuse base 6 of an electric conduction paste is formed to mediate between the resistance circuit 2. A cover glass 8 protecting the resistance circuit 2 is coated except for the thermal fuse part 14. Fuse solder 7 is placed on the fuse base 6, and an insulation film 15 of a synthetic resin is formed on the fuse solder 7. There is no possibility that the current by potential difference flows among the plurality of thermal fuses 14 even if an electrolyte medium is on the cover glass 8. There is no possibility that the fuse solder secularly deteriorates due to oxidization etc. either.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了防止多个热熔断器之间的电位差流过电流,导致热保险丝劣化并降低性能。 解决方案:该电阻电路板在形成在基板1上的电阻电路2中具有多个热熔丝14.形成导电浆料的熔丝座6,以在电阻电路2之间进行介电。盖玻璃8 保护电阻电路2除了保险丝部分14之外被涂覆。保险丝焊料7放置在保险丝座6上,并且在熔丝焊料7上形成合成树脂的绝缘膜15.不可能存在电流 即使电解质介质在盖玻璃8上,也可以通过多个热熔断器14之间的电位差流动。熔融焊料也不会由于氧化等而长时间劣化。 版权所有(C)2005,JPO&NCIPI
    • 7. 发明专利
    • Temperature fuse of resistor circuit board
    • 电阻电路板温度保险丝
    • JP2004079306A
    • 2004-03-11
    • JP2002236732
    • 2002-08-14
    • Fujikura Ltd株式会社フジクラ
    • URUGA KENICHIYAGI SHIGEKIEGUCHI KATSUOITO MASANORI
    • H01H37/76
    • PROBLEM TO BE SOLVED: To prevent a fuse solder from slipping off a board to lose a fuse function at the abnormal case when a large current flows.
      SOLUTION: A base body 17 is provided with a half-separation base 18 which is connected to it only through a narrow connection part 17c for hardness of current flow. A solder fuse 7 is so provided as to cover the base body 17 and the half-separation base 18 to constitute a temperature fuse 14. Even if a surface of a solder 7 that contacts the base body 17 melts after the base body 17 heats up significantly at such abnormal time when a large current flows into the resistor circuit 2, the half-separation base 18 where a current is hard to flow is slower in temperature rising than the base body 17 where a current is easy to flow to retain the solder 7, thus preventing it from slipping off the board.
      COPYRIGHT: (C)2004,JPO
    • 要解决的问题:为了防止在大电流流过的异常情况下,保险丝焊料从板上滑落而失去保险丝功能。 解决方案:基体17设置有半分离基部18,半基部18仅通过窄连接部17c与电流的硬度连接。 焊接保险丝7被设置为覆盖基体17和半分离基部18以构成温度保险丝14。即使在基体17加热之后接触基体17的焊料7的表面熔化 在大电流流入电阻电路2的这种异常时,显着地在电流难以流动的半分离基座18的温度升高时比电流容易流动的基体17慢,以保持焊料 7,从而防止其从板上滑落。 版权所有(C)2004,JPO