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1. 发明专利

JP2011165871A Electronic device, and method of manufacturing the same 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：JP2011165871A
公开(公告)日：2011-08-25
申请号：JP2010026636
申请日：2010-02-09
申请人： Denso Corp , 株式会社デンソー
发明人： ISHINO HIROSHI , IZUMI TAKAO , TSURUTA KAZUHIRO , KATO NOBUYUKI
IPC分类号： H01L21/52 , H01L23/29 , H01L23/31
CPC分类号： H05K3/284 , H01L21/56 , H01L23/3135 , H01L24/32 , H01L24/83 , H01L2224/26175 , H01L2224/3201 , H01L2224/32014 , H01L2224/8384 , H01L2224/8392 , H01L2224/83951 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H05K2203/1316 , H05K2203/1322 , Y10T29/49117 , Y10T29/49144 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To appropriately improve strength of a metal conductor, in an electronic device composed by mechanically jointing an electronic component and a mating member to each other through a metal conductor formed of a porous noble metal.
SOLUTION: The electronic device includes an electronic component 10, a mating member 20 to be mechanically connected with the electronic component 10, and a metal conductor 30 interposed between the electronic component 10 and the mating member 20 to mechanically connect both the electronic component 10 and the mating member 20 with each other, and made of porous noble metal such as Ag having vacancies 33, wherein end faces 31 of the metal conductor 30 are exposed from ends of a space between the electronic component 10 and the mating member 20, and a reinforcing resin 60 such as polyimide mechanically reinforcing the metal conductor 30 is impregnated in the vacancies 33 of the metal conductor 30 toward the inside from the end face 31 side of the metal conductor 30.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了适当提高金属导体的强度，在通过由多孔贵金属形成的金属导体将电子部件与配合部件机械连接而构成的电子设备中。解决方案：电子设备包括电子部件10，与电子部件10机械连接的配合部件20以及介于电子部件10和配合部件20之间的金属导体30，以机械地连接电子部件组件10和配合构件20彼此之间，并由具有空位33的多孔贵金属如Ag形成，其中金属导体30的端面31从电子部件10和配合构件20之间的空间的端部露出并且金属导体30的空位33从金属导体30的端面31侧向内侧浸渍有增强金属导体30的机械强化的聚酰亚胺等增强树脂60。（C）2011 ，JPO＆INPIT

2. 发明专利

JP2008028065A Method for manufacturing ceramic substrate 有权
标题翻译：制造陶瓷基板的方法
公开(公告)号：JP2008028065A
公开(公告)日：2008-02-07
申请号：JP2006197750
申请日：2006-07-20
申请人： Denso Corp , 株式会社デンソー
发明人： ISHINO HIROSHI , ASAI YASUTOMI
IPC分类号： H05K3/00 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To achieve adequate division without increase in fluctuation of compression when the sheet material is burned or the occurrence of deterioration in connection reliability due to a Hume material when the laser processing is conducted without use of a diamond cutter, in the method for manufacturing a ceramic substrate in which a sheet material to form a substrate formed of ceramic is burned and the sheet material is divided in unit of the substrate via a groove for division.
SOLUTION: A first groove 110 is formed to a surface 101 constituted as a mounting surface of the ceramic substrate in the sheet material 100; and the baked sheet material 100 is pressed from the side of the first groove 110 after a second groove 120 is formed with the laser processing, in the depth deeper than the first groove 110 to an area opposing to the first groove 110 among the other surface 102 located in the opposite side of one surface 101, in the sheet material 100 after the sheet material has been baked, in view of dividing the sheet material 100 via the first and second grooves 110, 120.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了在不使用金刚石切割器进行激光加工时，在板材被烧伤时不会增加压缩波动或者由于休息材料导致的连接可靠性的劣化而实现充分的分割，在陶瓷基板的制造方法中，其中形成由陶瓷形成的基板的片材被燃烧，并且片材通过用于划分的凹槽以基板为单位被分割。解决方案：第一槽110形成在片材100中作为陶瓷基板的安装表面构成的表面101上; 并且在第二凹槽120形成激光加工之后，在比第一凹槽110更深的深度到与第一凹槽110相对的区域的另一表面中，从第一凹槽110的侧面按压烘烤的薄片材料100 考虑到通过第一和第二槽110,110分割片材100，在片材材料被烘烤之后的片材100中，位于一个表面101的相对侧的102。 2008年，日本特许厅和INPIT

3. 发明专利

JP2015056925A 電力変換装置有权
标题翻译：电源转换器件
公开(公告)号：JP2015056925A
公开(公告)日：2015-03-23
申请号：JP2013187550
申请日：2013-09-10
申请人：株式会社デンソー , Denso Corp
发明人： ISHINO HIROSHI , KANO YOSUKE , IKEGAME ATSUSHI
IPC分类号： H02M7/48
CPC分类号： H02M1/34 , H01L2224/05554 , H01L2224/371 , H01L2224/37147 , H01L2224/40137 , H01L2224/48247 , H01L2924/181 , H02M7/003 , H02M7/537 , H02M2001/348 , H05K7/209 , H01L2924/00012
摘要：【課題】サージ電圧の抑制、SW素子の高い放熱性、およびリンギングの抑制の3つを両立しうる電力変換装置を提供する。【解決手段】2つのSW素子の素子モジュール10H,10Lが、絶縁層20を介して、側面S1が同じ向きで平行になるようにして厚さ方向に積層されると共に、一方のSW素子の正端子(+)ともう一方のSW素子の負端子(−)が、それぞれ、厚さ方向において互いに重なるように配置されてなる電力変換装置100とする。【選択図】図2
摘要翻译：要解决的问题：提供能够实现浪涌电压抑制，SW元件的高散热和抑制振铃三种电力转换装置。解决方案：公开了一种功率转换装置100，其中元件模块10H，10L的两个SW元件通过绝缘层20沿厚度方向层叠，使得侧面S1具有相同的方向并且彼此平行，并且一个SW元件的正极端子（+）和负极端子（ - ）的正极端子其他SW元件分别在厚度方向上彼此重叠配置。

4. 发明专利

JP2014011338A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2014011338A
公开(公告)日：2014-01-20
申请号：JP2012147426
申请日：2012-06-29
申请人： Denso Corp , 株式会社デンソー
发明人： ISHINO HIROSHI , WATANABE TOMOKAZU
IPC分类号： H01L25/18 , H01L25/07 , H02M7/48
CPC分类号： H01L24/33 , H01L2224/36 , H01L2224/40 , H01L2224/40137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/12032 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2224/37099 , H01L2224/37599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of making inductance much lower.SOLUTION: A positive electrode terminal 13 and a negative electrode terminal 14 constituting one part of positive electrode side wiring and negative electrode side wiring sealed in a resin mold section 18 are made into a plate-like conductor 16 constituted by a parallel conductor. A short-circuit direction for connecting the positive electrode terminal 13 and the negative electrode terminal 14 is an opposite direction. Therefore, regarding the plate-like conductor 16, magnetic offset can be generated, so as to make inductance low. Then, in this structure, the plate-like conductor 16 constituted by the parallel conductor enters into the resin mold section 18. Therefore, an area to be a more parallel conductor can be increased, and an area for generating more magnetic offset can be increased, so as to make inductance much lower.
摘要翻译：要解决的问题：提供能够使电感低得多的半导体器件。解决方案：构成正极侧布线的一部分的正极端子13和负极端子14以及密封在树脂模制部18中的负极侧布线制成由平行导体构成的板状导体16。用于连接正极端子13和负极端子14的短路方向是相反的方向。因此，关于板状导体16，可以产生磁偏移，使电感变低。然后，在这种结构中，由平行导体构成的板状导体16进入树脂模制部分18.因此，可以增加作为更平行导体的区域，并且可以增加用于产生更多磁偏移的区域，以使电感更低。

5. 发明专利

JP2012104606A Electronic device and manufacturing method thereof 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2012104606A
公开(公告)日：2012-05-31
申请号：JP2010251120
申请日：2010-11-09
申请人： Denso Corp , 株式会社デンソー
发明人： ISHINO HIROSHI , KATO NOBUYUKI , WATANABE TOMOKAZU
IPC分类号： H01L21/56 , H01L23/34
CPC分类号： H01L24/33 , H01L2224/32245 , H01L2924/01322 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To properly reduce damage on electronic components during resin sealing, in an electronic device, in which a heat sink provided on an outer side on both ends of the electronic components is sealed with resin by a transfer mold method.SOLUTION: In an electronic device manufacturing method, an integrating member 110 provided with heat sinks 20, 30 on outer sides of both ends 11, 12 of an electronic component 10 is put in a mold 100, and sealed with a resin 40. A recess 1 continuously formed from an inner periphery of an outer surface 22 of a first heat sink 20 to an end surface 23 is provided on the outer surface 22. In a resin sealing step, the resin 40 flows not only between the inner surfaces 21, 31 of both of the heat sinks 20, 30, but also toward the outer surface 22 of the first heat sink 20, so that the recess 1 is filled with the resin 40.
摘要翻译：要解决的问题：为了适当地减少在树脂密封期间对电子部件的损坏，在电子设备中，通过转印模具法，用电子部件的两端的外侧设置的散热器用树脂密封。解决方案：在电子设备制造方法中，将在电子部件10的两端部11,12的外侧设置有散热器20,30的积分部件110放入模具100中，并用树脂40密封从第一散热器20的外表面22的内周向端面23连续形成的凹部1设置在外表面22上。在树脂密封工序中，树脂40不仅在内表面两个散热器20,30中的21，31，也朝向第一散热器20的外表面22，使得凹部1填充有树脂40.版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2009094202A Manufacturing method of ceramic wiring board 有权
标题翻译：陶瓷接线板的制造方法
公开(公告)号：JP2009094202A
公开(公告)日：2009-04-30
申请号：JP2007262030
申请日：2007-10-05
申请人： Denso Corp , 株式会社デンソー
发明人： NAKAMURA TOSHIHIRO , ISHINO HIROSHI , SAGAWA HARUHIDE
IPC分类号： H05K3/46 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To reduce the warp of a green sheet generated upon calcination by the difference of a contraction amount when calcining a metallization paste layer and the green sheet in a manufacturing method of a ceramic wiring board composed by calcining the green sheet comprising ceramic for which the metallization paste layer composed of metallization paste is printed on one surface.
SOLUTION: Printing is performed by changing the thickness of the metallization paste layer 15a within a surface so that the metallization paste layer 15a printed at the center part of one surface of the green sheets 11a-13a is thinner than the metallization paste layer 15a printed on the outer side of the center part.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过在通过煅烧绿色的陶瓷线路板的制造方法中煅烧金属化浆料层和生坯片时的收缩量的差异来减少煅烧时产生的生片的翘曲包括陶瓷的片，其中由金属化膏组成的金属化膏层印刷在一个表面上。解决方案：通过改变表面内的金属化浆料层15a的厚度来进行印刷，使得印刷在生片11a-13a的一个表面的中心部分的金属化浆料层15a比金属化浆料层薄 15a印在中心部分的外侧。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009088339A Electronic equipment 有权
标题翻译：电子设备
公开(公告)号：JP2009088339A
公开(公告)日：2009-04-23
申请号：JP2007257561
申请日：2007-10-01
申请人： Denso Corp , 株式会社デンソー
发明人： ISHINO HIROSHI
IPC分类号： H01L23/12 , H05K7/20
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/16153 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To reduce a protective resin present between a rear face of a substrate and a heat sink as much as possible in an electronic equipment in which electronic parts are mounted on a surface of the substrate, a thick film resister covered with the protective resin is mounted on the rear face and a heat sink is disposed in the rear face of the substrate. SOLUTION: In the rear face 12 of the substrate 10, a recess part 40, which is recessed deeper than the rear face 12, is disposed, the thick film resister 30 is stored in the recess part 40 and the protective resin 32 seals the thick film resister 30 in the recess part 40 and is retained in the recess part 40. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了在电子部件安装在基板的表面上的电子设备中尽可能地减少基板背面和散热器之间存在的保护树脂，可以使用厚膜电阻覆盖有保护树脂的背面安装有背面，散热器设置在基板的背面。解决方案：在基板10的后表面12中，设置有比后表面12更深的凹陷部40，将厚膜电极30储存在凹部40中，保护树脂32 在凹部40中密封厚膜电阻30，并且保持在凹部40中。（C）版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2014011339A Connection structure of semiconductor module and semiconductor module adopting the same 有权
标题翻译：半导体模块和半导体模块的连接结构
公开(公告)号：JP2014011339A
公开(公告)日：2014-01-20
申请号：JP2012147427
申请日：2012-06-29
申请人： Denso Corp , 株式会社デンソー
发明人： ISHINO HIROSHI , WATANABE TOMOKAZU
IPC分类号： H01L23/48 , H01L25/07 , H01L25/18 , H02M7/48
CPC分类号： H01L2924/30107 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a connection structure of a semiconductor module and a semiconductor module adopting the connection structure, capable of achieving a low inductance and enhancing the reliability of a connection place between a positive electrode terminal and a negative electrode terminal.SOLUTION: The following distances are arranged to be nearly equalized: the distance from resin 2 to a connection place between a positive electrode terminal 3 and a positive electrode side connection terminal 11; and the distance from the resin 2 to a connection place between a negative electrode terminal 4 and a negative electrode side connection terminal 12. As a result, when an oscillation is applied, the stress does not become large even if the oscillation is strong enough to bring about a repetitious, expanding, and contracting stress on each of the connection places, which would occur especially when mounted on a vehicle. That means, since the distances from the resin 2 to each of the connection places are nearly equalized, the expansion and contraction states are equalized, there is no gap between the expansion and contraction amounts, thus eliminating large stresses. Therefore, wire disconnection due to fatigue can be minimized. Consequently, a connection structure for a semiconductor module 1 is achieved so as to enhance the reliability of the connection place between the positive terminal 3 and the negative terminal 4 while lowering the inductance.
摘要翻译：要解决的问题：为了提供采用该连接结构的半导体模块和半导体模块的连接结构，能够实现低电感并提高正极端子和负极端子之间的连接位置的可靠性。解决方案：以下距离被布置成几乎相等：从树脂2到正极端子3和正极侧连接端子11之间的连接位置的距离; 以及从树脂2到负极端子4和负极侧连接端子12之间的连接位置的距离。结果，当施加振荡时，即使振动足够强，应力也不会变大在每个连接位置引起重复，扩大和压缩的压力，特别是在安装在车辆上时。这意味着由于树脂2到各连接处的距离几乎相等，所以膨胀和收缩状态相等，膨胀和收缩量之间没有间隙，从而消除了大的应力。因此，由于疲劳引起的断线可以最小化。因此，实现半导体模块1的连接结构，以便在降低电感的同时提高正极端子3和负极端子4之间的连接位置的可靠性。

9. 发明专利

JP2013021808A Bus bar and electric power conversion system having the same 有权
标题翻译： BUS BAR和电力转换系统
公开(公告)号：JP2013021808A
公开(公告)日：2013-01-31
申请号：JP2011152803
申请日：2011-07-11
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社 , Denso Corp , 株式会社デンソー
发明人： YAMADA YASUSHI , USUI MASANORI , KOJIMA TAKASHI , IMAI MAKOTO , ISHINO HIROSHI
IPC分类号： H02M7/48
摘要： PROBLEM TO BE SOLVED: To take proper measures against heat transmitted from a switching element to an external circuit element through a bus bar.SOLUTION: The bus bars 14P, 14N have a high-voltage bus bar 14P and a low-voltage bus bar 14N, respectively. At least either one of the high-voltage bus bar 14P and the low-voltage bus bar 14N includes reciprocating structure sections 34P, 34N reciprocating through an outside portion and an inside portion. The outside portion and the inside portion of the reciprocating structure sections 34P, 34N face each other at a predetermined interval.

10. 发明专利

JP2009149046A Manufacturing method for board 有权
标题翻译：板的制造方法
公开(公告)号：JP2009149046A
公开(公告)日：2009-07-09
申请号：JP2008075585
申请日：2008-03-24
申请人： Denso Corp , 株式会社デンソー
发明人： SAGAWA HARUHIDE , KOBAYASHI WATARU , NAKAMURA TOSHIHIRO , ISHINO HIROSHI , OTANI YUJI , IMADA SHINJI , ASAI YASUTOMI
IPC分类号： B28D5/00 , B26D3/00
摘要： PROBLEM TO BE SOLVED: To reduce poor dividing by making the application of a maximum bending stress to the end section of an aimed dividing groove easier in a manufacturing method of a board for manufacturing individualized boards by dividing the board by the dividing grooves.
SOLUTION: On one board face 101 of the board 100, a plurality of dividing grooves 10 which extend in X direction are formed in a manner to be arranged in Y direction which is orthogonal to X direction. Then, on both end sections which are separated in Y direction on the one board face 101 of the board 100, an area being closer to the end section being pushed up by a pin 220 from both end sections further in X direction is depressed by a depressing member 210. Under this state, the pushing up by the pin 220 is performed from the other board face 102 side of the board 100.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了通过将基板划分为分隔槽，在制造单独板的制造方法中，通过在目标分割槽的端部施加最大的弯曲应力来减少差的分割。解决方案：在板100的一个板面101上，以与X方向正交的Y方向布置在X方向上延伸的多个分割槽10。然后，在板100的一个基板面101上在Y方向上分离的两端部，通过销220从X方向的两端部向上方推压更靠近端部的区域被一个在这种状态下，由板220向上推动从板100的另一个板面102侧执行。（C）版权所有（C）2009，JPO＆INPIT

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