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1. 发明专利

JP2010029957A Milling cutter 有权
标题翻译：铣刀
公开(公告)号：JP2010029957A
公开(公告)日：2010-02-12
申请号：JP2008192143
申请日：2008-07-25
申请人： Denso Corp , 株式会社デンソー
发明人： AOYAMA KAZUHIRO , KUMAGAI TAKANARI , NAGATA MASAYUKI
IPC分类号： B23C5/06 , B23C5/24
摘要： PROBLEM TO BE SOLVED: To achieve two different cutting depths in one cutting operation.
SOLUTION: A milling cutter 11 includes a milling cutter body 12, first fixed cutting edges 13a and 13b, and second fixed cutting edges 14a and 14b. A distance R1 in a radial direction of each of the first cutting edges 13a and 13b from a rotational center line S of the milling cutter body 12 is longer than a distance R2 in a radial direction of each of the second cutting edges 14a and 14b from the rotational center line S of the milling cutter body 12. A protruding length H1 of each of the first cutting edges 13a and 13b from a machining-side surface 12d of the milling cutter body 12 is shorter than a protruding length H2 of each of the second cutting edges 14a and 14b from the machining-side surface 12d of the milling cutter body 12.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：在一个切割操作中实现两种不同的切割深度。解决方案：铣刀11包括铣刀主体12，第一固定切削刃13a和13b以及第二固定切削刃14a和14b。从铣刀主体12的旋转中心线S向每个第一切削刃13a，13b的径向方向的距离R1比第二切削刃14a，14b的径向的距离R2大铣刀本体12的旋转中心线S.来自铣刀主体12的加工侧面12d的每个第一切削刃13a，13b的突出长度H1比每个切削刃主体12的突出长度H2短第二切削刃14a和14b来自铣刀主体12的加工侧表面12d。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2010058102A Coating device 有权
标题翻译：涂装装置
公开(公告)号：JP2010058102A
公开(公告)日：2010-03-18
申请号：JP2008229620
申请日：2008-09-08
申请人： Denso Corp , 株式会社デンソー
发明人： AOYAMA KAZUHIRO , OKAZOE KAORU , WATASE TAKANORI , ISHIHARA YUKI
IPC分类号： B05C3/09
摘要： PROBLEM TO BE SOLVED: To curtail a time required for draining an object coated with a coating liquid with regard to a coating device in which the object is immersed in the coating liquid in a coating tank to be coated. SOLUTION: The coating liquid is supplied into a liquid storage chamber 17 in which a semiconductor device 5 to be coated is held to immerse the semiconductor device 5 in the coating liquid. Then, after the coating liquid is drawn out from the liquid storage chamber 17, air is ejected from an air feeding path 37, and the excess coating liquid adherent to the semiconductor device 5 and the coating liquid adherent to the inner surface of the liquid storage chamber 17 are discharged by the air, which is sucked from a multifunctional hole 22 by a suction device 31 and ejected through the air feeding path 37 and outside air sucked from a vent hole 32. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了减少将被涂物涂布在被涂物的涂布装置中所涂覆的物体所需的时间，在该涂布装置中，被涂物涂布在涂布罐中的涂布液中。解决方案：将涂布液供给到储存室17中，在该储液室17中保持要涂布的半导体装置5以将半导体装置5浸入涂布液中。然后，在从液体储存室17抽出涂布液之后，从空气供给路径37喷出空气，并且附着在半导体装置5上的过量涂布液和粘附于液体储存容器内表面的涂布液室17被空气排出，空气通过抽吸装置31从多功能孔22吸出，并通过空气供给路径37和从通气孔32吸入的外部空气排出。（C）2010，JPO＆INPIT

3. 发明专利

JP2007203145A Method and apparatus for applying resin 审中-公开
标题翻译：用于树脂的方法和装置
公开(公告)号：JP2007203145A
公开(公告)日：2007-08-16
申请号：JP2006022455
申请日：2006-01-31
申请人： Denso Corp , 株式会社デンソー
发明人： TORII MIKIHIRO , NAKAZAWA SHUSAKU , AOYAMA KAZUHIRO
IPC分类号： B05D1/18 , B05C3/09 , B05D3/00
CPC分类号： B05D1/18 , B05C3/09 , B05D7/22 , H01L21/6715
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for applying a resin, in each of which a coating material can thinly be applied uniformly to the object to be coated in a short time.
SOLUTION: The apparatus for applying the resin is provided with: an application tank 1 in which a work 10 is immersed; a supply tank 2 for supplying the coating material 9 to the application tank; and a withdrawing cylinder unit 3 for forcibly withdrawing the coating material from the work 10-immersed application tank and returning the withdrawn coating material to the supply tank. The withdrawing cylinder unit is provided with a speed adjusting unit 4 for adjusting a speed of the coating material to be withdrawn according to a shape of the work.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种施加树脂的方法和设备，其中每个涂层材料可以在短时间内均匀地均匀地施加到待涂覆的物体上。解决方案：用于涂布树脂的装置设置有：浸渍工件10的施加槽1; 供给罐2，用于将涂料9供给到应用罐; 以及一个撤回缸单元3，用于强制地从工作10浸渍的应用槽中取出涂层材料并将退回的涂层材料返回到供应罐。抽出气缸单元设置有速度调节单元4，用于根据工件的形状调节待抽出的涂层材料的速度。版权所有（C）2007，JPO＆INPIT

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