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1. 发明专利

JP2007264696A Noncontact data carrier and noncontact data carrier wiring substrate 有权
标题翻译：非连接数据载体和非连接数据载体接线基板
公开(公告)号：JP2007264696A
公开(公告)日：2007-10-11
申请号：JP2006084987
申请日：2006-03-27
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： KATSUHARA YASUHIKO
IPC分类号： G06K19/077 , G06K19/07 , H01P5/08 , H01Q1/38 , H01Q7/00 , H01Q9/14 , H04B5/02
摘要： PROBLEM TO BE SOLVED: To provide a noncontact data carrier wiring substrate capable of performing impedance adjustment or impedance selection of an antenna circuit, and a noncontact data carrier using the wiring substrate. SOLUTION: The data carrier comprises an IC chip disposed on one side of the wiring substrate with a pair of connecting terminals thereof being outside, and a plurality of connecting pads electrically connected to the antenna pattern, which are disposed on the IC chip-mounted side of the wiring substrate so as to connect with different parts of the antenna pattern, respectively. The antenna circuit is formed by connecting the connecting terminals of the IC chip with predetermined connecting pads of the antenna pattern by wire bonding, and/or further mutually connecting the predetermined connecting pads of the antenna pattern by wire-bonding. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供能够进行天线电路的阻抗调整或阻抗选择的非接触式数据载体布线基板，以及使用该布线基板的非接触式数据载体。解决方案：数据载体包括设置在布线基板的一侧的IC芯片，其一对连接端子在外部，以及多个连接到天线图案的连接焊盘，它们设置在IC芯片上配线基板的安装侧分别与天线图案的不同部分连接。通过引线接合将IC芯片的连接端子与天线图案的预定连接焊盘连接起来，和/或通过引线接合进一步相互连接天线图案的预定连接焊盘来形成天线电路。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2012090139A Communication module and mobile phone 审中-公开
标题翻译：通信模块和移动电话
公开(公告)号：JP2012090139A
公开(公告)日：2012-05-10
申请号：JP2010236134
申请日：2010-10-21
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： ARAKI NOBORU , TOYOSHI REIO , KATSUHARA YASUHIKO
IPC分类号： H04M1/02
摘要： PROBLEM TO BE SOLVED: To provide a communication module allowed to be provided to a hinge part for the folding that is a space outside a main board, and provide a mobile phone on which the communication module is mounted.SOLUTION: A communication module includes: a rigid body that has a cylindrical cavity; a conductive wire that is wound on the rigid body; a circuit board that is provided inside the cavity of the rigid body and includes a communication processing function part electrically connected to both ends of the conductive wire; and a lead wire part that extends from the circuit board and includes at least a conducting wire for supplying power to the circuit board. In addition, the communication module is mounted on a mobile phone.
摘要翻译：要解决的问题：提供允许提供给铰链部分以用于折叠的通信模块，该折叠是主板外部的空间，并且提供安装通信模块的移动电话。解决方案：通信模块包括：具有圆柱形腔的刚体; 缠绕在刚体上的导线; 电路板，其设置在所述刚体的空腔的内部，并且包括电连接到所述导线的两端的通信处理功能部; 以及从电路板延伸并且至少包括用于向电路板供电的导线的引线部。此外，通信模块安装在移动电话上。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2008176626A Non-contact data carrier and wiring board for non-contact data carrier 有权
标题翻译：非接触式数据载体和接线板用于非接触式数据载体
公开(公告)号：JP2008176626A
公开(公告)日：2008-07-31
申请号：JP2007010326
申请日：2007-01-19
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： YAMAGUCHI YUJI , ARAKI NOBORU , HIGUCHI TAKUYA , OKADA SHINICHI , KATSUHARA YASUHIKO
IPC分类号： G06K19/077 , G06K19/07 , H01Q1/22 , H01Q1/24 , H01Q1/38 , H01Q7/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To reduce the size and thickness of a non-contact data carrier reading data held therein without contact and a wiring board for the non-contact data carrier configuring the non-contact data carrier.
SOLUTION: The non-contact data carrier includes an IC chip storing data therein and having two terminals connectable to an antenna and the wiring board having the IC chip mounted therein. The wiring board has n or more wiring layers (n is an even number equal to or larger than 4), and a spiral antenna pattern is formed in each of n or more wiring layers, and vertical-direction conductors are disposed in connection to an inner peripheral end and an outer peripheral end of each spiral antenna pattern, and two terminals of the IC chip are connected to inner peripheral ends of spiral antenna patterns formed on both outermost layers out of the n or more wiring layers through the vertical-direction conductors.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了减小保持在其中的非接触式数据载体读取数据的无触点的尺寸和厚度以及用于构成非接触式数据载体的非接触数据载体的布线板。解决方案：非接触式数据载体包括存储数据的IC芯片，具有可连接到天线的两个端子和安装有IC芯片的布线板。布线基板具有n个以上的布线层（n为4以上的偶数），在n个以上的配线层的每一个上形成有螺旋形天线图案，并且垂直方向的导体与每个螺旋天线图案的内周端和外周端，并且IC芯片的两个端子通过垂直方向导体连接到形成在n个或更多布线层中的两个最外层上的螺旋天线图案的内周端。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007295177A Non-contact data carrier and wiring board therefor 有权
标题翻译：非接触式数据载体及其接线板
公开(公告)号：JP2007295177A
公开(公告)日：2007-11-08
申请号：JP2006119275
申请日：2006-04-24
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： YAMAGUCHI YUJI , ARAKI NOBORU , HIGUCHI TAKUYA , OKADA SHINICHI , KATSUHARA YASUHIKO
IPC分类号： H01Q1/38 , G06K19/07 , G06K19/077 , H01Q7/00 , H05K1/02 , H05K1/18 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a non-contact data carrier which includes a mounting structure for mounting itself on goods and capable of being reduced in size, and to provide a wiring board used for the same. SOLUTION: The non-contact data carrier includes a wiring board which has an antenna pattern and a through-hole cut nearly at its center; and an IC chip which is mounted on the wiring board, electrically connected to the antenna pattern, and capable of storing data. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种非接触式数据载体，其包括用于将自身安装在货物上并能够减小尺寸的安装结构，并提供用于其的布线板。解决方案：非接触数据载体包括具有天线图案和几乎在其中心切割的通孔的布线板; 以及IC芯片，其安装在布线板上，电连接到天线图案，并且能够存储数据。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2014167969A Electronic module and method for manufacturing electronic module 有权
标题翻译：电子模块和制造电子模块的方法
公开(公告)号：JP2014167969A
公开(公告)日：2014-09-11
申请号：JP2013039107
申请日：2013-02-28
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： KATSUHARA YASUHIKO
IPC分类号： H05K3/46 , H01L23/12 , H05K1/11 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To arrange wiring having a high aspect ratio and high density in a thickness direction of a substrate.SOLUTION: The electronic module comprises: a wiring board including component mounting lands on at least one of principal surfaces and substrate connecting lands on any one of the principal surfaces; components having terminal electrodes and mounted on the wiring board through the component mounting lands; and a substrate including lands to be connected electrically and mechanically connected through the substrate connecting lands on the wiring board on one principal surface and having conductive patterns extending from the lands to be connected to the other principal surface through the one principal surface and side wall surfaces. The method for manufacturing the electronic module comprises the step of electrically and mechanically connecting a substrate including lands to be connected on one principal surface and having conductive patterns extending from the lands to be connected to the other principal surface through the one principal surface and side wall surfaces, with a wiring board through substrate connecting lands using the lands to be connected.
摘要翻译：要解决的问题：在衬底的厚度方向布置具有高纵横比和高密度的布线。解决方案：电子模块包括：布线板，其包括在主表面中的至少一个上的部件安装焊盘和基板连接焊盘上的基板连接焊盘任何一个主要表面; 具有端子电极并且通过部件安装台面安装在布线板上的部件; 以及基板，其包括通过一个主表面上的布线板上的基板连接台电连接和机械连接的焊盘，并且具有通过一个主表面和侧壁表面从连接到另一主表面的焊盘延伸的导电图案。制造电子模块的方法包括以下步骤：电连接和机械地连接包括待连接在一个主表面上的焊盘的衬底，并且具有从焊盘延伸的导电图案，以通过一个主表面和侧壁连接到另一个主表面表面，通过基板连接焊盘的布线板，使用要连接的焊盘。

6. 发明专利

JP2011159799A Packaged semiconductor device, and method of manufacturing the same 有权
标题翻译：包装半导体器件及其制造方法
公开(公告)号：JP2011159799A
公开(公告)日：2011-08-18
申请号：JP2010020226
申请日：2010-02-01
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： KATSUHARA YASUHIKO , ARAKI NOBORU
IPC分类号： H01L23/12
CPC分类号： H01L2224/16225 , H01L2924/19105
摘要： PROBLEM TO BE SOLVED: To provide a packaged semiconductor device and a method of manufacturing the same, increasing the reliability in adhesion between a part of a resinous wiring board positioned under a bare semiconductor chip and a resin material for sealing the semiconductor chip.
SOLUTION: The packaged semiconductor device includes: the bare semiconductor chip having a functional surface and a back surface opposite to the functional surface; a metal bump disposed on the functional surface of the semiconductor chip; a wiring pattern including an electrically connecting pad in opposition to the metal bump; and the resinous wiring board having the wiring pattern as an inner wiring layer and the semiconductor chip embedded in such a way that the functional surface and the back surface of the semiconductor chip are adhered to the resin material and the resinous wiring board.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种封装的半导体器件及其制造方法，提高了位于裸半导体芯片下方的树脂布线板的一部分与用于密封半导体芯片的树脂材料之间的粘附可靠性。解决方案：封装半导体器件包括：具有功能表面的裸半导体芯片和与功能表面相对的后表面; 设置在所述半导体芯片的功能表面上的金属凸块; 包括与所述金属凸块相对的电连接垫的布线图案; 以及将布线图案作为内部布线层的树脂布线板和以半导体芯片的功能表面和背面粘附到树脂材料和树脂布线板的方式嵌入的半导体芯片。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010272692A Manufacturing information management method of printed wiring board, manufacturing information management system of printed wiring board 有权
标题翻译：印刷线路板制造信息管理方法，印刷线路板制造信息管理系统
公开(公告)号：JP2010272692A
公开(公告)日：2010-12-02
申请号：JP2009123284
申请日：2009-05-21
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： ARAKI NOBORU , OKUNO SHIGERU , INOUE MASAKUNI , SASAOKA KENJI , KUROKAWA JUNICHI , KATSUHARA YASUHIKO
IPC分类号： H05K13/04 , H05K1/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing information management method of a printed wiring board having large amount of information and capable of tracing information about manufacturing records or the like from a downstream and an upper stream of a manufacturing process, and a manufacturing information management system of the printed wiring board. SOLUTION: A panel IC tag 12 is provided on a panel frame 11 of a panel type substrate 10, a sheet IC tag 22 is provided on a sheet frame 21 of a sheet type substrate 20, and a tray IC tag 42 is provided on a tray 40 housing a unit substrate 30. When the sheet type substrate 20 is cut out from the panel type substrate 10, a panel information recorded in the panel IC tag 12 is written in the sheet IC tag 22, and a sheet tag ID of the sheet IC tag 22 is written in the panel IC tag. When the unit substrate 30 is cut out from the sheet type substrate 20, a tray tag ID of the tray IC tag 42 housing the unit substrate 30 is written in the sheet IC tag 22, and a sheet information recorded in the sheet IC tag is written in the tray IC tag 42. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有大量信息并且能够从制造过程的下游和上游跟踪关于制造记录等的信息的印刷线路板的制造信息管理方法，以及印刷电路板制造信息管理系统。解决方案：面板式IC标签12设置在面板型基板10的面板框架11上，片状IC标签22设置在片状基板20的薄片框架21上，托盘IC标签42为设置在容纳单元基板30的托盘40上。当从面板型基板10切出片状基板20时，将记录在面板IC标签12中的面板信息写入片状IC标签22，并将片材标签片状IC标签22的ID被写入面板IC标签。当从片状基板20切出单元基板30时，容纳单元基板30的托盘IC标签42的托盘标签ID被写入片材IC标签22中，并且记录在片材IC标签中的片材信息是写在托盘IC标签42中。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2014192235A Component built-in wiring board, method of manufacturing component built-in wiring board 有权
标题翻译：组件内置接线板，制造组件内置接线板的方法
公开(公告)号：JP2014192235A
公开(公告)日：2014-10-06
申请号：JP2013064531
申请日：2013-03-26
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： KATSUHARA YASUHIKO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To arrange a wiring in higher density in plate thickness direction, with a high aspect ratio.SOLUTION: There are provided a first insulating layer, a second insulating layer positioned in lamination on the first insulating layer, a wiring pattern of an inner layer containing a component connecting land and a substrate connecting land, pinched between the first insulating layer and the second insulating layer, a component which contains a terminal electrode and is electrically connected to the component connecting land of the wiring pattern and is embedded in the second insulating layer, a substrate in which a connected land which is electrically connected to the substrate connecting land of the wiring pattern and is embedded in the second insulating layer, being electrically conductive to the substrate connecting land through solder, is provided on one main surface, and, the conductive pattern is, from the connected land, extended as far as the other main surface through a side wall surface from one main surface, and an interlayer connection conductor provided on the conductive pattern which is on the other main surface of the substrate so as to penetrate a part of the second insulating layer in thickness direction.
摘要翻译：要解决的问题：以高的纵横比在板厚方向上布置更高密度的布线。解决方案：提供第一绝缘层，位于第一绝缘层上层压的第二绝缘层，布线图案包含部件连接焊盘的内层和夹在第一绝缘层和第二绝缘层之间的基板连接焊盘的部件，包含端子电极并与布线图案的部件连接焊盘电连接并嵌入第二绝缘层，其中与布线图案的基板连接焊盘电连接并嵌入第二绝缘层中的连接焊盘通过焊料与基板连接焊盘导电的基板设置在一个主体上表面，并且导电图案从连接的焊盘延伸到另一个主表面通过从一个主表面的侧壁表面和设置在导电图案上的层间连接导体，该导电图案位于基板的另一个主表面上，以便在厚度方向上穿透第二绝缘层的一部分。

9. 发明专利

JP2013125423A Plug unit and device incorporating plug unit 有权
标题翻译：电子单位和设备公司
公开(公告)号：JP2013125423A
公开(公告)日：2013-06-24
申请号：JP2011273993
申请日：2011-12-15
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： ARAKI NOBORU , KATSUHARA YASUHIKO
IPC分类号： G06K19/00 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a plug unit capable of achieving a harmony between interoperation with a reader/writer side and interoperation with a device side, and provide a device incorporating the same.SOLUTION: A plug unit comprises: a non-contact interface part; a wire interface part; a power introduction part 17 for receiving power supply from a device side; a power generation part 12 that uses wireless energy from a reader/writer 50 as an energy source; a memory part 14 that is connected to the power introduction part and the power generation part, and is capable of writing and reading data in a non-volatile manner; a memory control part 13 that is connected to the power introduction part and the power generation part, controls writing of data which is obtained through the non-contact interface or the wire interface and is to be written in the memory part, and controls reading of data from the memory part; a detection signal generation part 18 for generating an electromagnetic field detection signal as a signal showing that exposure to a radio wave from the reader/writer is in progress; and a generated power output part 19 for sending the power generated by the power generation part to the device.
摘要翻译：要解决的问题：提供一种能够实现与读取器/写入器侧的互操作和与设备侧的互操作之间的和谐的插头单元，并且提供包括该插头单元的装置。解决方案：插头单元包括：非接触接口部分; 电线接口部分; 用于从设备侧接收电力的电力引入部17; 使用来自读取器/写入器50的无线能量作为能量源的发电部件12; 连接到电力引入部分和发电部分的存储器部分14，并且能够以非易失性的方式写入和读取数据; 连接到电力引入部分和电力产生部分的存储器控制部分13控制通过非接触界面或有线接口获得并将被写入存储器部分的数据的写入，并且控制读取记忆部分的数据; 检测信号生成部18，用于产生电磁场检测信号作为表示曝光于来自读写器的无线电波的信号; 以及用于将由发电部生成的电力发送到该装置的发电电力输出部19。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2008258332A Printed circuit board, electronic device, manufacturing method of printed circuit board 有权
标题翻译：印刷电路板，电子设备，印刷电路板的制造方法
公开(公告)号：JP2008258332A
公开(公告)日：2008-10-23
申请号：JP2007097789
申请日：2007-04-03
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： KATSUHARA YASUHIKO , YAMAGUCHI YUJI
IPC分类号： H05K3/46 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board capable of controlling a manufacturing history before mounting components on the printed circuit board, its manufacturing method and an electronic device equipped with the printed circuit board. SOLUTION: The printed circuit board 1 is equipped with a plurality of unit substrates 10 with a wiring pattern formed on the main surface thereof, a frame body 11 which retains the plurality of unit substrates on the same plane, and a non-contact data carrier, having an IC chip for storing data and an antenna connected to the IC chip while being arranged so as to be insulated from the wiring pattern at a position in an inner layer of at least either one of the unit substrate 10 or the frame body 11 and which is capable of communicating with outside. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在将组件安装在印刷电路板上之前控制制造历史的印刷电路板，其制造方法和配备有印刷电路板的电子设备。解决方案：印刷电路板1配备有在其主表面上形成有布线图案的多个单元基板10，将多个单元基板保持在同一平面上的框体11，接触数据载体，具有用于存储数据的IC芯片和连接到IC芯片的天线，同时布置成在单元基板10或第二基板10的至少一个的内层中的布线图案处绝缘框体11，能够与外部连通。版权所有（C）2009，JPO＆INPIT

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