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1. 发明专利

JP2013008854A Manufacturing apparatus and manufacturing method of substrate sheet with conductive bumps and metal mask plate 审中-公开
标题翻译：带导电材料和金属掩模板的基板的制造装置和制造方法
公开(公告)号：JP2013008854A
公开(公告)日：2013-01-10
申请号：JP2011140784
申请日：2011-06-24
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： KOYAMA SHUJIN , UCHIUMI TSUTOMU , TSUCHIKO MASASHI , KUROKAWA JUNICHI , AMIE TAKASHI
IPC分类号： H05K3/40 , B41F15/08 , B41M1/12 , B41N1/24 , H05K3/12 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and a manufacturing method of a substrate sheet with conductive bumps and a metal mask plate which reduce the number of processes where a conductive paste is applied to a surface of the substrate sheet and shortens the manufacturing time of the substrate sheet with the conductive bumps.SOLUTION: In each through hole in a metal mask plate 32, an opening diameter at the side of a substrate sheet 10 placed on a printing surface table 30 is larger than an opening diameter at the squeegee 36 side.
摘要翻译：要解决的问题：提供一种具有导电凸块和金属掩模板的基片的制造装置和制造方法，其将导电糊剂施加到基片表面的工艺数量减少，并缩短具有导电凸块的基片的制造时间。解决方案：在金属掩模板32的每个通孔中，放置在印刷表台30上的基片10一侧的开口直径大于刮板36侧的开口直径。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011017625A Circuit board inspection method and circuit board inspection apparatus 有权
标题翻译：电路板检查方法和电路板检查装置
公开(公告)号：JP2011017625A
公开(公告)日：2011-01-27
申请号：JP2009162596
申请日：2009-07-09
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： OKUNO SHIGERU , SASAOKA KENJI , KUROKAWA JUNICHI
IPC分类号： G01R31/28 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To simplify the connection inspection of ICs by using a serial communication function possessed by the ICs.SOLUTION: A circuit board has two ICs mounted thereon, the ICs in which, in accordance with the inputting of a clock and predetermined serial data synchronized with the clock into a clock input terminal and a serial data input/output terminal, respectively, output a recognition signal from the serial data input/output terminal, and also has first and second wiring patterns for connecting the clock input terminals of the ICs and connecting the serial data input terminals of the ICs, respectively. With the circuit board as an inspecting object, first and second inspection needles are pressed against the circuit board with the first and second wiring patterns forced into continuity. The clock and first predetermined serial data are supplied to the first inspection needle and the second inspection needle, respectively. It is determined whether a first recognition signal has been detected by the second inspection needle, second predetermined serial data is then supplied to the second inspection needle with the clock maintained, and it is determined whether a second recognition signal has been detected by the second inspection signal.
摘要翻译：要解决的问题：通过使用IC拥有的串行通信功能简化IC的连接检查。解决方案：电路板上安装有两个IC，其中根据输入时钟和预定的串行与时钟同步的数据分别输入到时钟输入端子和串行数据输入/输出端子，输出来自串行数据输入/输出端子的识别信号，还具有第一和第二布线图案，用于连接 IC并分别连接IC的串行数据输入端子。将电路板作为检查对象，将第一和第二检查针压在电路板上，使第一和第二布线图形强制连续。时钟和第一预定串行数据分别提供给第一检查针和第二检查针。确定第二检查针是否检测到第一识别信号，然后在保持时钟的情况下将第二预定串行数据提供给第二检查针，并且确定是否通过第二检查检测到第二识别信号信号。

3. 发明专利

JP2010272692A Manufacturing information management method of printed wiring board, manufacturing information management system of printed wiring board 有权
标题翻译：印刷线路板制造信息管理方法，印刷线路板制造信息管理系统
公开(公告)号：JP2010272692A
公开(公告)日：2010-12-02
申请号：JP2009123284
申请日：2009-05-21
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： ARAKI NOBORU , OKUNO SHIGERU , INOUE MASAKUNI , SASAOKA KENJI , KUROKAWA JUNICHI , KATSUHARA YASUHIKO
IPC分类号： H05K13/04 , H05K1/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing information management method of a printed wiring board having large amount of information and capable of tracing information about manufacturing records or the like from a downstream and an upper stream of a manufacturing process, and a manufacturing information management system of the printed wiring board. SOLUTION: A panel IC tag 12 is provided on a panel frame 11 of a panel type substrate 10, a sheet IC tag 22 is provided on a sheet frame 21 of a sheet type substrate 20, and a tray IC tag 42 is provided on a tray 40 housing a unit substrate 30. When the sheet type substrate 20 is cut out from the panel type substrate 10, a panel information recorded in the panel IC tag 12 is written in the sheet IC tag 22, and a sheet tag ID of the sheet IC tag 22 is written in the panel IC tag. When the unit substrate 30 is cut out from the sheet type substrate 20, a tray tag ID of the tray IC tag 42 housing the unit substrate 30 is written in the sheet IC tag 22, and a sheet information recorded in the sheet IC tag is written in the tray IC tag 42. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有大量信息并且能够从制造过程的下游和上游跟踪关于制造记录等的信息的印刷线路板的制造信息管理方法，以及印刷电路板制造信息管理系统。解决方案：面板式IC标签12设置在面板型基板10的面板框架11上，片状IC标签22设置在片状基板20的薄片框架21上，托盘IC标签42为设置在容纳单元基板30的托盘40上。当从面板型基板10切出片状基板20时，将记录在面板IC标签12中的面板信息写入片状IC标签22，并将片材标签片状IC标签22的ID被写入面板IC标签。当从片状基板20切出单元基板30时，容纳单元基板30的托盘IC标签42的托盘标签ID被写入片材IC标签22中，并且记录在片材IC标签中的片材信息是写在托盘IC标签42中。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2009224576A Wiring board, and inspection method of wiring board 有权
标题翻译：接线板和接线板检查方法
公开(公告)号：JP2009224576A
公开(公告)日：2009-10-01
申请号：JP2008067774
申请日：2008-03-17
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： OKUNO SHIGERU , KUROKAWA JUNICHI , SASAOKA KENJI
IPC分类号： H05K1/02 , G01R31/02 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To simplify connection inspection of an electronic component mounted on a principal surface of an insulation board or in the inside thereof, in a wiring board having a wiring pattern on a principal surface of an insulation board or in the inside thereof. SOLUTION: This wiring board is provided with: the insulation board; a first land pattern formed on a principal surface of the insulation board or in the inside thereof for being connected to a first power terminal possessed by a first electronic component; a second land pattern formed on the principal surface of the insulation board and in the inside thereof for being connected to a second power terminal possessed by a second electronic component; a first power lead part arranged by being electrically connected to the first land pattern, and having at least a part present on the principal surface; and a second power lead part arranged by being electrically connected to the second land pattern, having a part present on the principal surface, and present by being electrically separated from the first power lead part. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了简化安装在绝缘板的主表面或其内部的电子部件的连接检查，在具有在绝缘板的主表面上的布线图案的布线板中或在在里面。
解决方案：该接线板配有：绝缘板; 形成在绝缘板的主表面上或其内部的第一焊盘图案，用于连接到由第一电子部件所具有的第一电源端子; 形成在所述绝缘板的主表面上并在其内部的第二焊盘图案，用于连接到由第二电子部件所具有的第二电源端子; 第一电源引线部分，通过电连接到第一焊盘图案布置，并且具有至少部分存在于主表面上; 以及第二电源引线部，其通过电连接到所述第二焊盘图案而布置，所述第二焊盘图案具有存在于所述主表面上的部分，并且通过与所述第一电源引线部分电隔离存在。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2013077842A Wiring board, and method of inspecting wiring board 审中-公开
标题翻译：接线板和检查接线板的方法
公开(公告)号：JP2013077842A
公开(公告)日：2013-04-25
申请号：JP2013006136
申请日：2013-01-17
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： OKUNO SHIGERU , KUROKAWA JUNICHI , SASAOKA KENJI
IPC分类号： H05K1/02 , G01R31/02 , G01R31/28 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To make inspection of connection of an electronic component mounted on a main surface of an insulating plate or inside thereof concise.SOLUTION: The wiring board includes: a first land pattern to be connected to a first power supply terminal that a first electronic component has; a second land pattern to be connected to a second power supply terminal that a second electronic component has; a third land pattern to be connected to one of terminals other than the first power supply terminal; a fourth land pattern to be connected to one of terminals other than the second power supply terminal; a wiring part provided to an insulating plate so as to electrically connect the third land pattern to the fourth land pattern; a first power supply lead part provided while electrically connected to the first land pattern and at least partially present on the main surface; and a second power supply lead part provided while electrically connected to the second land pattern, at least partially present on the main surface, and electrically separated from the first power supply lead part.
摘要翻译：要解决的问题：检查安装在绝缘板的主表面或其内部的电子部件的连接简洁。解决方案：接线板包括：与第一电子部件具有的第一电源端子连接的第一焊盘图案; 与第二电子部件具有的第二电源端子连接的第二焊盘图案; 与第一电源端子以外的端子之一连接的第三焊盘图案; 与第二电源端子以外的端子之一连接的第四焊盘图案; 布线部，设置在绝缘板上，以将第三焊盘图案电连接到第四焊盘图案; 第一电源引线部分，其电连接到所述第一焊盘图案并且至少部分地存在于所述主表面上; 以及第二电源引线部分，其被设置为电连接到第二焊盘图案，至少部分地存在于主表面上，并与第一电源引线部分电气分离。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2011038831A Tool for substrate inspection, and method for substrate inspection 有权
标题翻译：基板检查用工具，以及基板检查方法
公开(公告)号：JP2011038831A
公开(公告)日：2011-02-24
申请号：JP2009184669
申请日：2009-08-07
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： OKUNO SHIGERU , KUROKAWA JUNICHI
IPC分类号： G01R1/073 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To provide a tool for substrate inspection and a method for substrate inspection, in the inspection of the electrical connection of a wiring circuit arranged on a printed wiring board and the like, even when the substrate inspection tool of the specification, without a socket (socketless), capable of increasing the number of contact points between a probe and an electrode terminal, improving the electrical contact, stabilizing the inspection and increasing the reliability of the inspection.
SOLUTION: The basic constitution of the tool for substrate inspection includes an anisotropic conductive rubber sheet containing conductive particles disposed between the probe and the electrode terminal, and the basic method for the substrate inspection includes a step of electrically connecting between the probe and the electrode terminal via the anisotropic conductive rubber sheet.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供用于基板检查的工具和基板检查方法，在布置在印刷线路板等上的布线电路的电连接的检查中，即使当基板检查工具该规格没有插座（无插座），能够增加探针和电极端子之间的接触点数量，改善电接触，稳定检查和增加检查的可靠性。解决方案：用于基板检查的工具的基本结构包括包含设置在探针和电极端子之间的导电颗粒的各向异性导电橡胶片，并且用于基板检查的基本方法包括将探针和电极端子通过各向异性导电橡胶片。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2009283689A Method for manufacturing of component-incorporating wiring board, and component-incorporating wiring board 审中-公开
标题翻译：组件接线板的制造方法和组件接线板
公开(公告)号：JP2009283689A
公开(公告)日：2009-12-03
申请号：JP2008134359
申请日：2008-05-22
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： TERAUCHI TAKAYUKI , KUROKAWA JUNICHI , SHIROTA TAKAYUKI , NOGUCHI TAKESHI
IPC分类号： H05K3/46 , H01L23/12 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing of a component-incorporating wiring board having a resin filled around an incorporated electric/electronic component, and can improve mechanical and electrical reliability: and the component-incorporating wiring board.
SOLUTION: The electric/electronic component is electrically and mechanically connected to a wiring pattern provided for a first insulation layer; an opening is formed at a position, corresponding to the electric/electronic component, of a third insulation layer which should be laminated on the first insulation layer through a second insulation layer containing a reinforcing material and contains a reinforcing material; a prepreg to be used as the second insulation layer is laminated on the opened third insulation layer; a second opening having an area smaller than that of the above opening is formed at a position, overlapping the opening of the third insulation layer, of the prepreg possessed by a wiring board material after the lamination; the prepreg side of the wiring board material is arranged on the side of the first insulation layer having the wiring pattern to position the opening and the second opening corresponding to the electric/electronic component; and a fourth insulation layer is arranged and laminated on the third insulation layer to be integrated therewith.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有填充在并入的电气/电子部件周围的树脂的组件结合布线板的制造方法，并且可以提高机械和电气可靠性：以及部件结合布线板。解决方案：电气/电子部件电气和机械地连接到为第一绝缘层提供的布线图案; 在通过包含增强材料的第二绝缘层并且包含增强材料的层压在第一绝缘层上的第三绝缘层的对应于电气/电子部件的位置处形成开口; 将用作第二绝缘层的预浸料层压在打开的第三绝缘层上; 在叠层后由布线板材料所具有的预浸料坯的第三绝缘层的开口重叠的位置形成面积小于上述开口面积的第二开口部; 布线板材料的预浸料侧布置在具有布线图案的第一绝缘层的侧面上，以定位对应于电气/电子部件的开口和第二开口; 并且第四绝缘层被布置并层压在第三绝缘层上以与其一体化。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2014013252A Circuit board inspection method and circuit board inspection device 有权
标题翻译：电路板检查方法和电路板检查装置
公开(公告)号：JP2014013252A
公开(公告)日：2014-01-23
申请号：JP2013189511
申请日：2013-09-12
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： OKUNO SHIGERU , SASAOKA KENJI , KUROKAWA JUNICHI
IPC分类号： G01R31/28 , G01R31/02
摘要： PROBLEM TO BE SOLVED: To achieve a concise IC connection inspection by using the serial communication function of an IC.SOLUTION: Two ICs (one is EEPROM) are mounted. The IC outputs a recognition signal from a serial data input/output terminal as a clock is input to a clock input terminal and predetermined serial data synchronized with the clock is input to the serial data input/output terminal. Targetting a circuit board that includes first and second wiring patterns for connecting each clock input terminal and each serial data input/output terminal, electricity is conducted to the first and second wiring patterns to abut first and second inspection needles on the circuit board. A clock is supplied to the first inspection needle, and first predetermined serial data is supplied to the second inspection needle to determine whether a first recognition signal is detectable in the second inspection needle. Then, second predetermined serial data is supplied to the second inspection needle while the clock is maintained to determine whether a second recognition signal is detectable in the second inspection needle. Reading and writing are also tested.
摘要翻译：要解决的问题：通过使用IC的串行通信功能实现简洁的IC连接检查。解决方案：安装两个IC（一个是EEPROM）。当时钟被输入到时钟输入端子时，IC输出来自串行数据输入/输出端子的识别信号，并将与时钟同步的预定串行数据输入到串行数据输入/输出端子。针对包括用于连接每个时钟输入端子和每个串行数据输入/输出端子的第一和第二布线图案的电路板，电力被传导到第一和第二布线图案以抵靠电路板上的第一和第二检查针。向第一检查针提供时钟，并且将第一预定串行数据提供给第二检查针，以确定在第二检查针中是否可检测到第一识别信号。然后，第二预定串行数据被提供给第二检查针，同时保持时钟以确定在第二检查针中是否可检测到第二识别信号。阅读和写作也进行了测试。

9. 发明专利

JP2013008852A Manufacturing apparatus and manufacturing method of substrate sheet with conductive bumps 审中-公开
标题翻译：带导电性基片的基板的制造装置及制造方法
公开(公告)号：JP2013008852A
公开(公告)日：2013-01-10
申请号：JP2011140736
申请日：2011-06-24
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： UCHIUMI TSUTOMU , KOYAMA SHUJIN , TSUCHIKO MASASHI , KUROKAWA JUNICHI , AMIE TAKASHI
IPC分类号： H05K3/12 , B41F15/08 , B41F15/44 , B41N1/24
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and a manufacturing method of a substrate sheet with conductive bumps which reduce the number of processes where a conductive paste is applied to a surface of the substrate sheet and thereby shortening the manufacturing time of the substrate sheet with the conductive bumps.SOLUTION: A squeegee 36 (36a, 36b, 36c) of a squeegee unit has a shape that gradually narrows toward its tip. A conductive paste, transferred onto a substrate sheet 10 by the squeegee 36, contains 85 to 98% by weight of metal powder.

10. 发明专利

JP2013008848A Manufacturing apparatus and manufacturing method of substrate sheet with conductive bumps 审中-公开
标题翻译：带导电性基片的基板的制造装置及制造方法
公开(公告)号：JP2013008848A
公开(公告)日：2013-01-10
申请号：JP2011140688
申请日：2011-06-24
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： UCHIUMI TSUTOMU , KOYAMA SHUJIN , TSUCHIKO MASASHI , KUROKAWA JUNICHI , AMIE TAKASHI
IPC分类号： H05K3/12 , B41F15/08
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and a manufacturing method of a substrate sheet with conductive bumps which reduce the number of processes where a conductive paste is applied to a surface of the substrate sheet and thereby shortening the manufacturing time of the substrate sheet with the conductive bumps.SOLUTION: A conductive paste supply unit 60 includes: a housing part 62 housing a conductive paste 38 and provided with an opening 62a located at a bottom part; a pressing mechanism 64 pressing the conductive paste 38 housed in the housing part 62 and thereby pressing down the conductive paste 38 from an opening 62a provided at the bottom part of the housing part 62; and a driving part 69 moving the housing part 62 and the pressing mechanism 64. The conductive paste 38 housed in the housing part 62 of the conductive paste supply unit 60 contains 85 to 98% by weight of metal powder.
摘要翻译：要解决的问题：为了提供具有导电凸块的基板的制造装置和制造方法，该导电凸块减少了将导电浆料施加到基片的表面上的工艺数量，从而缩短了制造时间具有导电凸块的基片。导电浆料供给单元60包括：容纳导电浆料38的壳体部62，并且设置有位于底部的开口62a; 按压机构64，挤压容纳在壳体部分62中的导电浆料38，从而从设置在壳体部分62的底部的开口62a压下导电浆料38; 以及驱动部69，其移动壳体部62和按压机构64.容纳在导电浆料供给单元60的壳体部62中的导电浆料38含有85〜98重量％的金属粉末。版权所有（C）2013，JPO＆INPIT

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