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1. 发明专利

JP2002059365A METHOD OF DETECTING ORIGINAL POINT POSITION OF CONTACT IN CUTTING DEVICE 失效
公开(公告)号：JP2002059365A
公开(公告)日：2002-02-26
申请号：JP2000248711
申请日：2000-08-18
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： SEKIYA KAZUMA , SANDO HIDEYUKI , KAMIGAKI MASAYOSHI , DAII AKIJI
IPC分类号： B24B47/22 , B24B27/06 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a method to precisely detect the original point position of contact of a disc blade with a workpiece. SOLUTION: A slitted groove is formed on a surface of the workpiece held by a workpiece holding means by delivering the disc blade to slit it, and length of this slitted groove is measured. Thereafter, depth of the slitted groove is found from the length of the measured slitted groove and a radius of the disc blade, and the original point position of contact of the disc blade with the surface of the workpiece is found in accordance with the depth of this slitted groove and a slitting delivering position of the disc blade at the time of forming the slitted groove.

2. 发明专利

JP2001024003A CSP SUBSTRATE DIVIDING APPARATUS 失效
公开(公告)号：JP2001024003A
公开(公告)日：2001-01-26
申请号：JP19571999
申请日：1999-07-09
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： KAMIGAKI MASAYOSHI
IPC分类号： H01L21/677 , H01L21/301 , H01L21/50 , H01L21/68 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To enhance work efficiency of dividing a CSP substrate into pellets and loading the pellets on a transfer tray, and thereby to enhance productivity. SOLUTION: This apparatus comprises a fixture 14a for holding a CSP substrate 11, a fixture rack 15, a fixture carrying-out/carry-in table 36 that positions a carried-out fixture to a position where the CSP substrate is to be placed, a cassette placing table 12 on which a cassette 13 is placed, a CSP substrate carry-out means 53, a CSP substrate placing means 55 that places the CSP substrate to a fixture on the fixture carry-out/carry-in table, a first transfer means 60 that transfers the CSP substrate up to a work table 61, a dividing means 68 that divides the CSP substrate into pellets, a second transfer means 69 that transfers the CSP substrate from the work table to a cleaning table 70, a third transfer means 74 that transfers the CSP substrate from the cleaning table to a pellet pickup table 75, a reloading means 81 that picks up pellets and transfers to a transfer tray 86 which is positioned to be a pellet-reloading region 80, and a fourth transfer means 89 that transfers an empty fixture from the pellet pickup table to the fixture carry-out/carry-in table.

3. 发明专利

JPH11176772A PRECUT METHOD 失效
公开(公告)号：JPH11176772A
公开(公告)日：1999-07-02
申请号：JP33601197
申请日：1997-12-05
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： KAMIGAKI MASAYOSHI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To reduce a load applied on a rotary blade at a stage of starting cutting, by a method wherein a cut-in depth of the rotary blade is gradually increased and a precut substrate is cut and precutting is performed. SOLUTION: A rotary blade 1 is mounted on cubing means 2, and a precut substrate 7 chucked and held on a chuck table 6 is precut. In this method, a cut-in depth of the rotary blade is gradually increased, or a cut feeding speed is gradually accelerated. When the cut-in depth of the rotary blade 1 is gradually increased, when a cut-in depth of the rotary blade 1 at a time of actually cutting an object to be processed is D, a cut-in depth of the rotary blade 1 is gradually increased to D from shallower than D. At this time, a cut feeding speed of the rotary blade 1, namely a feeding speed of a turn table 6, is constant.

4. 发明专利

JP2002033295A ALIGNMENT METHOD AND ALIGNER 失效
公开(公告)号：JP2002033295A
公开(公告)日：2002-01-31
申请号：JP2000214552
申请日：2000-07-14
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： KAMIGAKI MASAYOSHI
IPC分类号： H01L21/301 , B23D59/00 , B28D5/00 , B28D5/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To enable effective cutting of high precision by performing alignment corresponding to the case, where parallel precision between streets is low and the street is waved, in alignment of the street to be cut of an object to be worked and a cutting blade in cutting equipment. SOLUTION: In an alignment method where the alignment of a street in a first direction or a street in a second direction and the cutting blade is performed, coordinate values for alignment patterns A, B, C, D, E, F, G, H for recognizing the first street S11 and the second street S12, which are isolated interposing at least one street and in the same direction, are detected. Linear functions f(x), g(x), related to the first street S11 and the second street S12, are obtained on the basis of the coordinate values. Corrected angles of the streets and the index amount of index sending-out are obtained from the slope and the Y intercept of the linear functions f(x), g(x).

5. 发明专利

JP2001023936A CSP SUBSTRATE SPLITTING DEVICE 失效
公开(公告)号：JP2001023936A
公开(公告)日：2001-01-26
申请号：JP19905599
申请日：1999-07-13
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： KAMIGAKI MASAYOSHI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To select appropriate jigs corresponding to CSP substrates, enabling usage of the jigs in the case, where the various CSP substrates are split by one split device and the split CSP substrates are used as individual pellets. SOLUTION: This device is a CSP substrate split device, provided with a decision means formed into a structure, where an identification mark 33 for identifying a jig 14a formed on the jig 14, for example, out of individual jigs, which are respectively mounted with each CSP substrate, in a state corresponding to the kinds of the CPS substrates 11, and when the jig 14a is carried out from a jig rack, whether the jig 14a is jig corresponding to the CSP substrate 11 to be splitted is decided on the basis of the mark.

6. 发明专利

JPH11121403A METHOD OF DETECTING CUT GROOVES 失效
公开(公告)号：JPH11121403A
公开(公告)日：1999-04-30
申请号：JP27880297
申请日：1997-10-13
申请人： DISCO ABRASIVE SYSTEMS LTD
发明人： KAMIGAKI MASAYOSHI
IPC分类号： H01L21/66 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To readily and surely detect a second cut groove, by bringing an optical detecting means into focus on the surface of a workpiece to detect a first cut groove, and then bringing the focus from the surface of the workpiece to the level of the depth of a cut made by a first blade to detect the second cut groove. SOLUTION: When detecting a groove by means of an optical detecting means 4, a step for detecting a first cut groove is conducted, in the first place, by bringing a focal point P to the surface of a workpiece 1. In this first cut groove detecting step, a depth X of a cut from the surface of the workpiece 1, is calculated and stored. In the second place, a step for detecting a second cut groove is carried out to detect a second cut groove 3. In this case, a focal point Q of the optical detection means 4 is brought, from the surface of the object 1, to the level of the depth X of the cut which has been made by a first blade. Specifically, focus is made on a bottom surface 2b of a first cut groove 2 to detect the positions of both edge portions 3a of the second cut groove 3. In this way, the second cut groove 3 can be readily and accurately detected.

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