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1. 发明专利

JP2007317781A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2007317781A
公开(公告)日：2007-12-06
申请号：JP2006144159
申请日：2006-05-24
申请人： Denso Corp , 株式会社デンソー
发明人： YAMADA MASAO , HIRAO YASUNOBU
IPC分类号： H01L23/50
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve heat dissipation efficiency without enlargement of an entire device. SOLUTION: A lead frame is equipped with a first die pad 8 for mounting a power MOSFET 3, and a second die pad 11 for mounting a control IC 4. The first die pad 8 is coupled with one of frames 6 of the lead frame via a relatively thick tie bar 9. When the power MOSFET 3 and the control IC 4 are molded with resin, the rear face of the first die pad 8 is left exposed. The tie bar 9 is bent in such a form that the rear face of the frame 6 coupled with it is positioned on the same plane as the rear face of the first die pad 8. When a semiconductor device 1 is attached to a heat sink 13, the rear face (exposed face) of the first die pad 8 and the rear face of the frame 6 are in heat-exchangeable contact with the heat sink 13. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提高散热效率，而不会扩大整个装置。引线框架配备有用于安装功率MOSFET 3的第一管芯焊盘8和用于安装控制IC4的第二管芯焊盘11.第一裸片焊盘8与第一裸片焊盘8中的一个引线框架通过相对较厚的连接杆9.当功率MOSFET 3和控制IC 4用树脂模制时，第一裸片焊盘8的后表面露出。连接杆9弯曲成与框架6的与其相连接的后表面位于与第一管芯焊盘8的后表面相同的平面上。当半导体器件1附接到散热器13 第一管芯焊盘8的背面（露出面）和框架6的背面与散热片13热交换接触。（C）2008，JPO＆INPIT

2. 发明专利

JP2010261380A Exhaust emission control device 审中-公开
标题翻译：排气排放控制装置
公开(公告)号：JP2010261380A
公开(公告)日：2010-11-18
申请号：JP2009113478
申请日：2009-05-08
申请人： Denso Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社デンソー
发明人： IWAMIYA HIROKI , YOKOYAMA SHINICHI , HIRAO YASUNOBU , YOSHIMURA SATOSHI , ITO MAKOTO , MATSUURA KOZO
IPC分类号： F01N3/22 , B01D53/86 , F01N3/24 , F01N3/36
CPC分类号： Y02A50/2322
摘要： PROBLEM TO BE SOLVED: To provide an exhaust emission control device for adjusting a flow rate of secondary air so that the temperature of an exhaust emission control catalyst reaches an active temperature thereof without causing addition and complication of a circuit. SOLUTION: When operation of an engine 10 is started, a control section 40 drives the only one pump 33 of two pumps 33 and 34 until exhaust emission control catalysts 23 and 24 reach the active temperature thereof. The exhaust emission control catalysts 23 and 24 are thereby prevented from being cooled by excessive secondary air, and the temperature thereof quickly rises. When the temperature of the exhaust emission control catalysts 23 and 24 exceeds the active temperature thereof, the control section 40 drives both the pumps 33 and 34. The exhaust emission control catalysts 23 and 24 are thereby maintained at the active temperature or more by the supplied air. The temperature of the exhaust emission control catalysts 23 and 24 can be easily estimated from the engine 10 and existing each part of a vehicle loaded with the engine 10, and the control section 40 only turns on/off power supply to the pumps 33 and 34. Consequently, a complicated circuit is unnecessary. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于调节二次空气的流量的废气排放控制装置，使得废气排放控制催化剂的温度达到其有效温度而不引起电路的添加和复杂化。解决方案：当发动机10的运转开始时，控制部分40驱动两个泵33和34的仅一个泵33，直到废气排放控制催化剂23和24达到其活动温度。由此，可以防止废气排放控制催化剂23,24被过多的二次风冷却，其温度迅速上升。当废气排放控制催化剂23和24的温度超过其活性温度时，控制部分40驱动泵33和34。废气排放控制催化剂23和24由此通过供应的空气。废气排放控制催化剂23和24的温度可以从发动机10和现有的装载发动机10的车辆的每个部分容易地估计，并且控制部分40仅打开/关闭对泵33和34的供电因此，不需要复杂的电路。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2001308565A ELECTRONIC CIRCUIT UNIT 失效
公开(公告)号：JP2001308565A
公开(公告)日：2001-11-02
申请号：JP2000117861
申请日：2000-04-19
申请人： DENSO CORP
发明人： HARADA YOSHIHARU , HIRAO YASUNOBU
IPC分类号： H05K7/20
摘要： PROBLEM TO BE SOLVED: To achieve a simple and inexpensive configuration by improving the adhesion property between a heat sink and an enclosure at a plurality of mounting parts and securing an improved heat radiation property when mounting the heat sink where large-power parts are mounted to the enclosure. SOLUTION: A printed circuit board 13 and a plurality of hybrid integrated circuits 14 are accommodated in an enclosure 12 made of aluminum die cast while they are mounted to a heat sink 24 to compose an electronic circuit unit(ECU) 11. The heat sink 24 is mounted to a mounting part 12b that is formed at three locations of the lower surface of the upper wall of the enclosure 12 while being thermally connected to the enclosure 12 by clamping a screw 26 from a lower portion. A plurality of grooves 33 for facilitating the deflection deformation of the enclosure 12 are formed at the outer surface side of the upper wall of the enclosure 12. These grooves 33 are formed while being extended nearly entirely on the upper surface of the enclosure 12 in forward and backward directions that orthogonally cross the left/right directions where the mounting part 12b forms a line by each two of them between mounting parts 12b at a position for avoiding the mounting part 12b.

4. 发明专利

JP2005327791A Semiconductor device and its packaging structure 审中-公开
标题翻译：半导体器件及其封装结构
公开(公告)号：JP2005327791A
公开(公告)日：2005-11-24
申请号：JP2004142287
申请日：2004-05-12
申请人： Denso Corp , 株式会社デンソー
发明人： OKITSU YOSUKE , HIRAO YASUNOBU
IPC分类号： H01L23/28 , H01L23/29 , H01L23/48
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To properly ensure electrical insulation between a semiconductor device and a cooling member without applying a special treatment or installing additional components between the semiconductor device and the cooling member when mounting the half-mold package type semiconductor device on the cooling member. SOLUTION: The semiconductor device 100 comprises a heatsink 10, a semiconductor element 20 mounted on one surface 10a of the heatsink 10, and a molding resin 50 which seals the heatsink 10 and the semiconductor element 20 so as to encapsulate them while exposing the other surface 10b of the heatsink 10 to the outside. On the other surface 10b side of the heatsink 10, the other surface 10b of the heatsink 10 recedes more than the surface 51 of the molding resin 50, causing the other surface 10b of the heatsink 10 to be located away from the cooling member 200. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了适当地确保半导体器件和冷却部件之间的电绝缘，而不是在将半模封装型半导体器件安装在半导体器件和冷却部件之间而在半导体器件和冷却部件之间进行特殊处理或安装附加部件冷却部件。解决方案：半导体器件100包括散热片10，安装在散热片10的一个表面10a上的半导体元件20和模制树脂50，其密封散热片10和半导体元件20，以便在暴露时封装它们散热器10的另一个表面10b到外部。在散热片10的另一个表面10b侧，散热片10的另一个表面10b比模制树脂50的表面51多一些，导致散热片10的另一个表面10b远离冷却件200。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2000294997A STRUCTURE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT 失效
公开(公告)号：JP2000294997A
公开(公告)日：2000-10-20
申请号：JP10031399
申请日：1999-04-07
申请人： DENSO CORP
发明人： NAGATANI TOSHIHIRO , HIRAO YASUNOBU
IPC分类号： H05K13/04 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To prevent a load from being applied to a pin connection part by displacement due to the exposion and shrinkage of each member after connection in the connection structure of electronic parts using an alignment member for aligning a plurality of pins for electrically connecting first and second members. SOLUTION: An aligning member 50 in the connection structure aligns a pin 20 at an outer peripheral part in the axial direction A, rotates it with the axial direction A as a reference for separating from the pin 20 and then is removed from the pin 20. In the aligning member 50, the ratio of the vertical and horizontal dimensional of a cross section for orthogonally crossing the axial direction A differs, a plurality of aligned grooves 51 for aligning the pin 20 to the side in the longitudinal dimensional direction in the cross section are formed. The grooves 51 are formed so that they become narrower from the side in the longitudinal dimension direction in the cross section as toward the center of the cross section.

6. 发明专利

JPH11229875A COOLING SYSTEM FOR VEHICLE 失效
公开(公告)号：JPH11229875A
公开(公告)日：1999-08-24
申请号：JP33615398
申请日：1998-11-26
申请人： DENSO CORP
发明人： KUWAYAMA MASATOSHI , HIRAO YASUNOBU , TAKEUCHI SHIGERU , ITO TAKAFUMI , YOSHIMURA SATOSHI
IPC分类号： F01P5/04 , F01P7/04 , H02P1/18
摘要： PROBLEM TO BE SOLVED: To overcome the problem of rush current by simplifying the structure of a cooling system for a vehicle controlled to have the revolution speed of the motor cooling fan set to a predetermined value. SOLUTION: If the relay switch is turned ON, the voltage of a battery 1 is applied to an integrating circuit 9. Then the output of the integrating circuit 9 is applied to a gate G of MOS transistor 8. The voltage applied to the gate slowly rises in the state of delayed rise-up by the integrating circuit 9 in accordance with the time constant. When the voltage applied to the gate reaches a threshold voltage of the MOS transistor 8, the MOS transistor 8 is turned ON. However, when the voltage applied to the gate is low, the train current flowing through the MOS transistor 8 is limited. As a result, the motor 2 is activated slowly to gradually increase the revolution speed.

7. 发明专利

JPH1155892A MOTOR-DRIVEN FAN APPARATUS, ATTACHMENT STRUCTURE OF CONNECTOR, AND INTERMEDIATE TERMINAL 失效
公开(公告)号：JPH1155892A
公开(公告)日：1999-02-26
申请号：JP14910298
申请日：1998-05-29
申请人： ASMO CO LTD , DENSO CORP
发明人： YAMAMOTO YOSHIJI , ISHIGURO HIDEO , YASUNOBU AKIYOSHI , SHINKAWA MASATOSHI , KATOU AKITADA , GOTO MASANOBU , SUGIURA JUNJI , HIRAO YASUNOBU
IPC分类号： F04D29/00 , H01R13/04 , H01R13/11 , H01R13/52 , H01R13/639 , H02K5/22
摘要： PROBLEM TO BE SOLVED: To provide a motor-driven fan apparatus wherein connectors having male terminals mutually can be connected with each other electrically easily. SOLUTION: A reception connector 7 has a male terminal 8 in a recessed portion 7a to provide it in a fan motor. A plug connector 11 has a male terminal 13 in a recessed portion 11a and can be inserted into the recessed portion 7a of the reception connector 7 to provide it in a controller. Both the ends of an intermediate terminal have female shapes for making insertable respectively both the male terminals 8, 13 thereinto to connect electrically the terminals 8, 13 with each other when inserting the plug connector 11 into the recessed portion 7a of the reception connector 7.

8. 发明专利

JPH10339292A ELECTRIC MOTOR FAN DEVICE 失效
公开(公告)号：JPH10339292A
公开(公告)日：1998-12-22
申请号：JP14677497
申请日：1997-06-04
申请人： DENSO CORP
发明人： GOTO MASANOBU , KATOU AKITADA , SUGIURA JUNJI , HIRAO YASUNOBU
IPC分类号： F01P1/06 , F01P5/04 , F04D29/00 , F04D29/58 , H02K5/18 , H02K9/02 , H02K9/06
摘要： PROBLEM TO BE SOLVED: To improve vibration proof character of a controller attached to a fan motor. SOLUTION: The electric motor fan device 2 comprises a fan motor 9 supported by a shroud 3 at a downstream side of a cooling wind W in a radiator 1, fan blade 13 which is coupled to the fan motor 9 and generates the cooling wind W by its rotation, and a controller 14 for controlling motor rotating speed in which a base part is fixed to an end face outer periphery of a downstream side of the motor 9 and a radiating part 24 of its tip side projects toward an outer periphery side of the motor 9. A tip side attaching piece 26 is provided at the tip of the controller 14, and the tip of the controller 14 is coupled to the shroud 3.

9. 发明专利

JP2002057478A ELECTRONIC DEVICE 失效
公开(公告)号：JP2002057478A
公开(公告)日：2002-02-22
申请号：JP2000240040
申请日：2000-08-08
申请人： DENSO CORP
发明人： IWAMIYA HIROKI , HIRAO YASUNOBU
IPC分类号： H05K7/20 , H01L23/40
摘要： PROBLEM TO BE SOLVED: To provide an electronic device for improved heat radiation. SOLUTION: A case 7 houses a ceramics board 3, on which a plurality of heating elements 2 and other parts 4 are mounted, a mother board 6 to which the ceramics board 3 is electrically connected, and a heat-radiating fin 5 to which the ceramics board 3 hits for radiating heat of the heating elements 2. A protruding part 7b is formed on one surface 7a of the case 7, with the tip part of the protruding part 7b being flat. A recessed part 5b is formed at the heat-radiating fin 5, at a position facing the protruding part 7b, and the bottom part of the recessed part 5b is flat. The entire surface of the protruding portion of the protruding part 7b hits the bottom part of the recessed part 5b. The interval of the mounted heating elements 2 is a distance for which temperature gradient due to electric power of 1 W is set at 0.1 deg.C/mm.

10. 发明专利

JP2000183576A HEAT RADIATOR OF ELECTRONIC DEVICE 失效
公开(公告)号：JP2000183576A
公开(公告)日：2000-06-30
申请号：JP36069298
申请日：1998-12-18
申请人： DENSO CORP
发明人： HARADA YOSHIHARU , IWAMIYA HIROKI , HIRAO YASUNOBU
IPC分类号： H05K7/20
摘要： PROBLEM TO BE SOLVED: To improve the cooling efficiency of electronic device without consuming power. SOLUTION: An enclosure 2 of an electronic control unit (ECU) 1 is provided with a heat radiator 3. The heat radiator 3 is composed by mounting a plate- shaped member 5, to a support 4 where a leg part 4a and a frame part 4b are integrated. In this case, when the ECU 1 is vibrated due to the vibration of a vehicle, the plate-shaped member 5 resonates in response to vibration in the direction of the arrow A and is rocked large. As a result, the plate-shaped member 5 generates a wind like a round fan, which is sent to the surface of the enclosure 2 for cooling the ECU 1.

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