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    • 3. 发明专利
    • CONDUCTIVE ADHESIVE
    • JPH10241461A
    • 1998-09-11
    • JP4393997
    • 1997-02-27
    • ASAHI CHEMICAL IND
    • SEO ATSUSHITANABE TSUNEAKI
    • C09J9/02C09J161/00C09J161/28C09J163/00C09J171/10C09J175/02C09J175/04H01B1/20H05K3/32
    • PROBLEM TO BE SOLVED: To enhance adhesion ability and working ability at the same time and increase conductivity by using a thermoplastic resin, a thermosetting rein, and a conductive filler, limiting the amount of the conductive filler to a specified range, and limiting the amount of the thermoplastic resin in the total resin of the thermoplastic resin and the thermosetting resin to a specified range. SOLUTION: A thermoplastic resin, a thermosetting resin, and a conductive filler are used, as the thermoplastic resin, a resin having hydrogen bonding ability in the structure is used, and the thermosetting resin is selected from the group comprising epoxy resin, phenol resin, polymide, polyurethane, melamine resin, and urea resin. As the conductive filler, conductive metal such as silver and gold is used. The amount of the conductive filler is limited to 70-95wt.%, and the amount of the thermoplastic resin in the total resin of the thermoplastic resin and the thermosetting resin is limited to 3-97wt.%. The conductivity and adhesion ability are satisfied at the same time, and by heating at a temperature of glass transition temperature or higher or treating with a solvent, an adhesive is easily made reusable.
    • 4. 发明专利
    • PRODUCTION OF POROUS SILICON DIOXIDE FILM
    • JPH10158011A
    • 1998-06-16
    • JP31366796
    • 1996-11-25
    • ASAHI CHEMICAL IND
    • IOKA TAKAAKITANABE TSUNEAKI
    • C04B38/06C01B33/12H01L21/316
    • PROBLEM TO BE SOLVED: To easily obtain a uniform porous silicon dioxide film adhering tightly to the substrate, free from cracks and not causing peeling by filmily coating the top of a surface-modified substrate with a soln. prepd. by mixing alkoxysilane with an amido bond-contg. org. polymer, water and a catalyst, carrying out hydrolysis and dehydration condensation and removing the org. polymer from the resultant dry gel. SOLUTION: The top of a substrate surface-treated with an adhesion improver such as a silane coupling agent is filmily coated with a soln. prepd. by mixing alkoxysilane with an amido bond-contg. org. polymer such as poly (N- vinylpyrrolidone) or a polyacrylamide deriv., water and a catalyst. The alkoxysilane is then subjected to hydrolysis and dehydration condensation and the org. polymer is removed from the resultant dry gel to obtain the objective porous silicon dioxide film. The org. polymer is easily removed from the dry gel film by heating at a temp. above the thermal decomposition temp. of the polymer for about 1-24hr.