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1. 发明专利

JP2000192000A ELECTRICALLY CONDUCTIVE ADHESIVE 失效
公开(公告)号：JP2000192000A
公开(公告)日：2000-07-11
申请号：JP37259698
申请日：1998-12-28
申请人： ASAHI CHEMICAL IND
发明人： SEO ATSUSHI , MORI MARIKO
IPC分类号： C09J9/02 , C09J11/04 , C09J161/10 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To obtain an electroconductive adhesive that has a sufficient adhesion strength and an electroconductivity with reduced fluctuation in its environmental properties by using a copper-including metal filler, an epoxy compound, a novolak type phenol resin, a low-molecular-weight phenol and a curing agent. SOLUTION: The objective electroconductive adhesive is prepared by mixing 10-80 wt.% of an epoxy compound, for example, a bisphenol-A type epoxy resin, 2-40 wt.% of a novolak type phenol resin, 5-50 wt.% of a low-molecular- weight polyphenol, for example, hydroquinone, in addition, a curing agent, for example, a microcapsule type epoxy curing agent to prepare an organic binder, then admixing a metal filler containing 50-100% of copper to the resultant organic binder in an amount of 40-95 wt.%.

2. 发明专利

JPH10241461A CONDUCTIVE ADHESIVE 失效
公开(公告)号：JPH10241461A
公开(公告)日：1998-09-11
申请号：JP4393997
申请日：1997-02-27
申请人： ASAHI CHEMICAL IND
发明人： SEO ATSUSHI , TANABE TSUNEAKI
IPC分类号： C09J9/02 , C09J161/00 , C09J161/28 , C09J163/00 , C09J171/10 , C09J175/02 , C09J175/04 , H01B1/20 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To enhance adhesion ability and working ability at the same time and increase conductivity by using a thermoplastic resin, a thermosetting rein, and a conductive filler, limiting the amount of the conductive filler to a specified range, and limiting the amount of the thermoplastic resin in the total resin of the thermoplastic resin and the thermosetting resin to a specified range. SOLUTION: A thermoplastic resin, a thermosetting resin, and a conductive filler are used, as the thermoplastic resin, a resin having hydrogen bonding ability in the structure is used, and the thermosetting resin is selected from the group comprising epoxy resin, phenol resin, polymide, polyurethane, melamine resin, and urea resin. As the conductive filler, conductive metal such as silver and gold is used. The amount of the conductive filler is limited to 70-95wt.%, and the amount of the thermoplastic resin in the total resin of the thermoplastic resin and the thermosetting resin is limited to 3-97wt.%. The conductivity and adhesion ability are satisfied at the same time, and by heating at a temperature of glass transition temperature or higher or treating with a solvent, an adhesive is easily made reusable.

3. 发明专利

JPH10265748A ELECTROCONDUCTIVE ADHESIVES 失效
公开(公告)号：JPH10265748A
公开(公告)日：1998-10-06
申请号：JP7371197
申请日：1997-03-26
申请人： ASAHI CHEMICAL IND
发明人： SEO ATSUSHI , TANABE TSUNEAKI
IPC分类号： C09J9/02 , C09J11/04 , C09J201/00 , H01B1/22 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To obtain electroconductive adhesives having both adhesion properties and reworking properties, manifesting high conductivity and long term stability of the conductivity by using a specific organic binder with a specific conductive filler. SOLUTION: This adhesive contains (A) the organic binder consisting of a thermoplastic resin(preferably contains a hydrogen bond forming functional group) and a thermosetting resin(for example, an epoxy resin, a phenol resin, etc.) and (B) the conductive filler consisting of (i) conductive particle (one or more kind of metals preferably selected from Cu, Ni, Au, Ag, etc.) and (ii) a conductive coating layer (one or more kind of metals selected from Sn, Zn, In, etc.) which melts approximately at the curing temperature of the component (A) and coats whole surface of the component (i). The amount of the content of the component (B) is 70-95 wt.% and content of the thermoplastic resin in the component (A) is 3-97%.

4. 发明专利

JP2000290617A ELECTROCONDUCTIVE ADHESIVE AND USAGE THEREOF 失效
公开(公告)号：JP2000290617A
公开(公告)日：2000-10-17
申请号：JP10148099
申请日：1999-04-08
申请人： ASAHI CHEMICAL IND
发明人： MORI MARIKO , SEO ATSUSHI , HANABATAKE HIROYUKI
IPC分类号： H01B1/22 , C09J9/02
摘要： PROBLEM TO BE SOLVED: To obtain a copper-based adhesive having a high shear strength and a high electroconductivity, scarcely fluctuating the characteristics with surrounding environments and useful for semiconductor elements, etc., by specifying the ratio of phenolic hydroxyl group equivalents to epoxy equivalents in essential components. SOLUTION: This adhesive comprises (A) a metal filler, (B) an epoxy compound, (C) a novolak type phenol resin, (D) a low-molecular polyhydric phenol (preferably hydroquinone) and (E) a softening agent and the component A is a metal powder containing at least 50-100 wt.% of copper. The ratio of phenolic hydroxyl group equivalents to epoxy equivalents in the objective adhesive is 1-2. For example, a bisphenol A type epoxy resin or a low-molecular epoxy compound such as neopentyl glycol diglycidyl ether is preferably used alone or mixed for use as the component B.

5. 发明专利

JPH11209716A ELECTROCONDUCTIVE ADHESIVE 失效
公开(公告)号：JPH11209716A
公开(公告)日：1999-08-03
申请号：JP1945398
申请日：1998-01-30
申请人： ASAHI CHEMICAL IND
发明人： SEO ATSUSHI , TANABE TSUNEAKI
IPC分类号： C09J9/02 , C09J11/04 , C09J11/08 , C09J163/00 , H01L21/52 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To obtain an electroconductive adhesive that has both high adhesion and good repairing properties and shows high electroconductivity by containing a specific epoxy resin, a phenoxy resin, a specific epoxy compound and an electroconductive filler. SOLUTION: The objective adhesive contains (A) an epoxy resin such as a bisphenol-A type epoxy resin, (B) a phenoxy resin, (C) a liquid epoxy compound that has a viscosity at 25 deg.C of preferably 1-200 cP, more preferably 1-100 cP, particularly 1-50 cP and bears at least one glycidyl group in one molecule, and (D) 65-90 wt.% of an electroconductive filler. In a preferred embodiment, the contents of the organic binders [the components A, B and C except the filler (the component D)] are 5-70 wt.%, 1-20 wt.% and 5-70 wt.%, respectively. This adhesive may contain, when necessary, a curing agent, a solvent, a diluent, a curing accelerator, a leveling agent, a thixotropy-imparting agent, a sedimentation inhibitor, a flame retarder, a pigment and the like.

6. 发明专利

JPH10279903A ELECTROCONDUCTIVE ADHESIVE 失效
公开(公告)号：JPH10279903A
公开(公告)日：1998-10-20
申请号：JP8654697
申请日：1997-04-04
申请人： ASAHI CHEMICAL IND
发明人： SEO ATSUSHI , TANABE TSUNEAKI
IPC分类号： C09J9/02 , C09J11/04 , C09J201/00 , H01B1/22 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To obtain the subject adhesive, sufficiently adhesive and electroconductive simultaneously and also reworkable, by including two types of specific particles and an organic binder. SOLUTION: This adhesive comprises (A) particles of a low-melting metal melting at 300 deg.C or lower, preferably selected from the group consisting of Sn, Zn, In, Bi, Pb, Cd and Sb, (B) electroconductive particles, preferably of a metal selected from the group consisting of Cu, Ni, Au, Ag, Al, Pd and Pt, melting at higher temperature than the component A, wherein the component A/component B wt. ratio is set at (5:95) to (50:50), and total of the components A and B accounts for 70 to 95 wt.% of the whole adhesive, (C) an organic binder of a thermoplastic resin, preferably having a hydrogen bond, mixed, as required, with a thermosetting resin, and (D) a setting accelerator, flame retardan, pigment, tackifier or the like, as required. The components A and B work as the electroconductive fillers. The component A preferably has a smaller particle size than the component B.

7. 发明专利

JPH10279902A ELECTROCONDUCTIVE ADHESIVE 失效
公开(公告)号：JPH10279902A
公开(公告)日：1998-10-20
申请号：JP8291797
申请日：1997-04-01
申请人： ASAHI CHEMICAL IND
发明人： SEO ATSUSHI , TANABE TSUNEAKI
IPC分类号： C09J9/02 , C09J11/04 , C09J201/00 , H01B1/22 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To obtain the subject adhesive, simultaneously adhesive and electroconductive, and keeping its volumetric conductivity fairly unchanged for an extended period of time, by including a specific, electroconductive filler and organic binder. SOLUTION: This adhesive comprises (A) 70 to 95 wt.% of an electroconductive filler composed of (i) a spherical, electroconductive filler and (ii) a flaky, electroconductive filler at a component (i)/component (ii) wt. ratio of (1:99) to (99:1), wherein at least one of the components (i) and (ii) is composed of electroconductive particles, preferably of Cu, Ni, Au, Ag, Al, Pd or Pt, these particles being totally coated with an electroconductive layer, preferably of Sn, Zn, In, Bi, Pb or Sb, and melting at a temperature level close to setting temperature of the component B, below, (B) an organic binder of a thermoplastic resin, mixed, as required, with a thermosetting resin, and (C) a setting accelerator, flame retardant, leveling agent, pigment, tackifier or the like, as required.

8. 发明专利

JPH10251606A CONDUCTIVE ADHESIVE 失效
公开(公告)号：JPH10251606A
公开(公告)日：1998-09-22
申请号：JP5461497
申请日：1997-03-10
申请人： ASAHI CHEMICAL IND
发明人： SEO ATSUSHI , TANABE TSUNEAKI
IPC分类号： C09J9/02 , C09J201/00 , H01B1/22 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To obtain an adhesive which has electric conductivity in addition to adhesiveness and can be easily reworked when heated by compounding a binder comprising a thermopalstic resin and thermosetting resin in a specified wt. ratio with a conductive filler comprising a spherical filler and a flaky filler in a specified wt. ratio. SOLUTION: The thermoplastic resin is pref. one having hydrogen-bonding properties and a glass transition point of 300 deg.C or higher, an example being a phenoxy resin. The thermoplastic resin is selected from among epoxy, phenol, polyimide, polyurethane, melamine, and urea resins; for example, an epoxy resin is used. The wt. ratio of the thermoplastic to the thermosetting resin is (3:97)-(97:3). The conductive filler is e.g. a conductive metal (e.g. silver or gold) or an inorg. insulating material coated with a conductive substance, and a particle size of 0.1-10μm, and is compounded in an amt. of 70-95wt.%. The wt. ratio of the spherical filler to the flaky filler is (1:99)-(99:1).

9. 发明专利

JPH11209715A ELECTROCONDUCTIVE ADHESIVE 失效
公开(公告)号：JPH11209715A
公开(公告)日：1999-08-03
申请号：JP1282998
申请日：1998-01-26
申请人： ASAHI CHEMICAL IND
发明人： SEO ATSUSHI , TANABE TSUNEAKI
IPC分类号： C08L63/00 , C08G59/24 , C08G59/62 , C09J9/02 , C09J11/04 , C09J163/00 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To obtain an elecroconductive adhesive that has both high adhesion and good repairing properties and shows high electroconductivity by containing a specific thermosetting resin, a phenoxy resin, a specific epoxy resin and an electroconductive filler. SOLUTION: The objective adhesive contains (A) a thermosetting resin as a mixture of (i) a phenolic resin such as a novolak type phenolic resin with, when necessary, (ii) an epoxy resin such as a bisphenol-A type epoxy resin, (B) a phenoxy resin, (C) a liquid epoxy compound that has a viscosity at 25 deg.C of preferably 1-200 cP, more preferably 1-100 cP, particularly 1-50 cP and bears at least one glycidyl group in one molecule, and (D) 65-90 wt.% of an electroconductive filler. In a preferred embodiment, the contents of the organic binders [the components A, B and C except the filler (the component D)] are 5-50 wt.%, 1-20 wt.% and 10-80 wt.%, respectively.

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