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1. 发明专利

JP2014175132A Electronic controller and manufacturing method therefor 审中-公开
标题翻译：电子控制器及其制造方法
公开(公告)号：JP2014175132A
公开(公告)日：2014-09-22
申请号：JP2013046099
申请日：2013-03-08
申请人： Hitachi Automotive Systems Ltd , 日立オートモティブシステムズ株式会社
发明人： SAKAMOTO EIJI , KOYAMA HIROSHI , YAMASHITA SHIRO , SAITO MASATO , ABE HIROYUKI , KAMOSHITA MASARU
IPC分类号： H01R13/03 , H01R43/02
摘要： PROBLEM TO BE SOLVED: To solve the problem that when a connector pin is joined using a bismuth (Bi)-containing tin (Sn) solder, copper (Cu) on the connector side and tin (Si) in the solder react, causing a bismuth (Bi) phase saturated in the solder to successively separate out as a result of growth of a thick copper (Cu)-tin(Sn) compound (mainly CuSn) in the surface layer of the connector pin, the bismuth (Si) phase eventually becoming the starting point of a crack and the crack propagating, whereby the joining strength is reduced.SOLUTION: Provided is a method for manufacturing an electronic controller, wherein the method for manufacturing an electronic controller includes an electronic component, a circuit board on which the electronic component is mounted, a connector, and a step of joining a connector pin for joining the circuit board and the connector and containing zinc (Zn) in the surface of part of it with the circuit board by a flow process using a bismuth (Bi)-added solder.
摘要翻译：要解决的问题为了解决当使用含铋（Bi）的锡（Sn）焊料将连接器引脚接合时，连接器侧的铜（Cu）和焊锡中的锡（Si）反应的问题，铋（铋）相在焊料中饱和，由于在连接器针的表面层中生长厚铜（Cu）-tin（Sn）化合物（主要是CuSn），铋（Si）相最终成为裂缝的起点和裂纹扩展，从而降低了接合强度。解决方案：提供一种电子控制器的制造方法，其中电子控制器的制造方法包括电子部件，电路板，电路板安装电子部件，连接器和连接用于接合电路板和连接器的连接器针脚并将其部分表面中的锌（Zn）与电路板接合的步骤，通过使用铋（ Bi）焊锡。

2. 发明专利

JP2012129330A Semiconductor device and manufacturing method of the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2012129330A
公开(公告)日：2012-07-05
申请号：JP2010278744
申请日：2010-12-15
申请人： Hitachi Automotive Systems Ltd , 日立オートモティブシステムズ株式会社
发明人： SAKAMOTO EIJI , FUJIWARA SHINICHI , YOKOZUKA TAKEHIDE , UCHIYAMA KAORU , YAMASHITA SHIRO , SUWA TOKIHITO , ASANO MASAHIKO
IPC分类号： H01L21/52
CPC分类号： H01L24/29 , H01L24/05 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/83 , H01L2224/04026 , H01L2224/05082 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05169 , H01L2224/05639 , H01L2224/05644 , H01L2224/27622 , H01L2224/29011 , H01L2224/29012 , H01L2224/29013 , H01L2224/29076 , H01L2224/291 , H01L2224/29111 , H01L2224/29118 , H01L2224/29223 , H01L2224/29224 , H01L2224/29239 , H01L2224/29244 , H01L2224/29247 , H01L2224/29255 , H01L2224/2926 , H01L2224/29266 , H01L2224/293 , H01L2224/3201 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/83065 , H01L2224/83075 , H01L2224/83104 , H01L2224/8314 , H01L2224/83192 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83815 , H01L2924/01012 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/3511 , H01L2924/3512 , H01L2924/3841 , H01L2924/00014 , H01L2224/83801 , H01L2924/014 , H01L2924/01013 , H01L2924/01029 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device which controls the thickness of a joined part even if a part of a second substrate 4, which is joined to a first substrate 1, is curved.SOLUTION: A joining material joining a fist substrate to a second substrate is composed of a porous metal and solder. The porous metal ranges to both sides in the thickness direction and adjusts a gap between the both substrates in a peripheral part. In a center part, the porous metal exists not in the entire part in the thickness direction. This structure allows a design error caused by a curvature of the substrate to be absorbed with the solder in the center part.
摘要翻译：要解决的问题：即使连接到第一基板1的第二基板4的一部分弯曲，也提供控制接合部的厚度的高度可靠的半导体装置。将第一基板连接到第二基板的接合材料由多孔金属和焊料构成。多孔金属在厚度方向上的两侧均为范围，并且在周边部分中调整两个基板之间的间隙。在中心部分中，多孔金属不是在厚度方向上的整个部分中存在。这种结构允许由基板的曲率引起的设计误差被中心部分中的焊料吸收。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2010212645A Connection structure, power module and method of manufacturing the same 有权
标题翻译：连接结构，功率模块及其制造方法
公开(公告)号：JP2010212645A
公开(公告)日：2010-09-24
申请号：JP2009118448
申请日：2009-05-15
申请人： Hitachi Automotive Systems Ltd , 日立オートモティブシステムズ株式会社
发明人： IKEDA UKYO , NAKAMURA MASATO , YAMASHITA SHIRO
IPC分类号： H01L21/607 , B23K20/10 , B23K101/14 , B23K101/40 , H01L25/07 , H01L25/18
CPC分类号： H01L23/49811 , H01L21/50 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/4847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/1306 , H01L2924/13091 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a compact bonded structure with high reliability, while preventing deterioration in conductivity and heat dissipation. SOLUTION: In ultrasonic bonding of a metal terminal 120 to a substrate pad 113, a thin buffer metal layer 140 which is formed of a soft metal or a highly slidable metal is interposed between a terminal edge and a pad so as to prevent direct contact between an end of the terminal 120 and the pad 113 upon bonding. This prevents abrasion and a crack in the pad 113 caused by pressure and an ultrasonic wave upon the ultrasonic bonding through the end of the terminal 120. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供具有高可靠性的紧凑的结合结构，同时防止导电性和散热性的劣化。解决方案：在金属端子120与衬底焊盘113的超声波接合中，由软金属或高度可滑动的金属形成的薄缓冲金属层140插入在端子边缘和衬垫之间，以防止键合时端子120的端部与焊盘113之间的直接接触。这防止了通过端子120的端部超声波接合时由压力和超声波引起的焊盘113中的磨损和裂纹。（C）2010，JPO＆INPIT

4. 发明专利

JP2010096191A Speed-change controller and electronic circuit sealing device 有权
标题翻译：变速控制器和电子电路密封装置
公开(公告)号：JP2010096191A
公开(公告)日：2010-04-30
申请号：JP2008264745
申请日：2008-10-14
申请人： Hitachi Automotive Systems Ltd , 日立オートモティブシステムズ株式会社
发明人： SHIGYO TOSHIKAZU , TANABE ITARU , TSUYUNO ENJO , YAMASHITA SHIRO
IPC分类号： F16H61/00 , F16J15/04 , F16J15/14 , H01L23/29
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To achieve improvement in heat-dissipation properties and air tightness, size reduction, and ease of inspection by achieving a full mold structure by a sealing resin only with one base member without providing another member by a heat sink in an electronic circuit sealing device. SOLUTION: An electronic circuit sealing device has a support part from a part of an opening window part 23 of a base member 2. The support part includes an adhesive surface 24a adhered to the rear face of a multilayer wiring substrate 4. A part of an electronic component 5 is installed at the opening window part 23. A heat transfer member is provided between the multilayer wiring substrate 4 and the base member 2. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了通过仅通过一个基底部件通过密封树脂实现完整的模具结构，而不通过散热器提供另一个部件来实现散热性能和气密性，尺寸减小和易于检查的改善在电子电路密封装置中。解决方案：电子电路密封装置具有从基体2的开口部分23的一部分的支撑部分。支撑部分包括粘附到多层布线基板4的背面的粘合表面24.A 电子部件5的一部分安装在开口部分23处。传热部件设置在多层布线基板4和基底部件2之间。（C）2010，JPO＆INPIT

5. 发明专利

JP2013012596A Semiconductor device and semiconductor device manufacturing method 有权
标题翻译：半导体器件和半导体器件制造方法
公开(公告)号：JP2013012596A
公开(公告)日：2013-01-17
申请号：JP2011144593
申请日：2011-06-29
申请人： Hitachi Automotive Systems Ltd , 日立オートモティブシステムズ株式会社
发明人： FUJINO SHINICHI , YOSHINARI HIDETO , YAMASHITA SHIRO
IPC分类号： H01L23/48 , H01L25/07 , H01L25/18
CPC分类号： H01L29/45 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/4824 , H01L23/488 , H01L23/492 , H01L23/49524 , H01L23/49531 , H01L23/49575 , H01L24/05 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/95 , H01L25/18 , H01L29/41708 , H01L2224/04042 , H01L2224/05552 , H01L2224/05554 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29101 , H01L2224/32245 , H01L2224/40095 , H01L2224/40137 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83192 , H01L2224/83801 , H01L2224/83815 , H01L2224/84801 , H01L2224/85005 , H01L2224/92247 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit occurrence of voids and flow of a solder, and achieve a long life of a solder joint part.SOLUTION: A semiconductor device comprises: a semiconductor element 1 having at least one electrode plane on each of surfaces; a first conductor member bonded by a solder to the electrode plane 11a provided on the one surface of the semiconductor element 1; and a second conductor member bonded by a solder to the electrode plane provided on the other surface of the semiconductor element 1. At least one of the electrode planes 11a provided on the one surface of the semiconductor element 1 has a double-comb shape.
摘要翻译：要解决的问题：提供一种能够抑制焊料的空隙和流动的发生的半导体器件，并且能够实现焊接部的长寿命化。解决方案：半导体器件包括：半导体元件1，其在每个表面上具有至少一个电极平面; 通过焊料粘合到设置在半导体元件1的一个表面上的电极平面11a的第一导体部件; 以及通过焊料接合到设置在半导体元件1的另一个表面上的电极平面的第二导体构件。设置在半导体元件1的一个表面上的至少一个电极平面11a具有双梳形形状。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2014053462A Semiconductor device manufacturing method and semiconductor device 审中-公开
标题翻译：半导体器件制造方法和半导体器件
公开(公告)号：JP2014053462A
公开(公告)日：2014-03-20
申请号：JP2012197201
申请日：2012-09-07
申请人： Hitachi Automotive Systems Ltd , 日立オートモティブシステムズ株式会社
发明人： KOYAMA HIROSHI , YAMASHITA SHIRO , SAKAMOTO EIJI , HATA SHOHEI , SAITO MASATO , TAKASE KOSUKE , ABE HIROYUKI , KAMOSHITA MASARU
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a technology relevant to a manufacturing method including solder connection of a semiconductor device such as an ECU to inhibit and prevent deformation of a housing part caused by heat transfer at the time of a flow process.SOLUTION: A manufacturing method of an ECU 100 (Electronic Control Unit) having a connector integrated housing 50 comprises: a first process of connecting surface mounting components (12, 14) on a printed circuit board 11 by reflow by using a first solder 41; and a second process of connecting connector pins 52 as insertion mounting components on the printed circuit board 11 by flow by using a second solder 42. The second solder 42 has a composition obtained by addition of Bi or In to the first solder 41 thereby to lower a melting point. In the second process, when heat applied to a connection part 31 is transferred from a connector housing part 53 to a cover 54 through a connector pin 52, a temperature of the cover 54 becomes not more than a softening temperature of a material of the cover 54.
摘要翻译：要解决的问题：提供与包括ECU等半导体装置的焊接连接的制造方法相关的技术，以抑制和防止在流动过程中由热传递引起的壳体部分的变形。解决方案：制造具有连接器集成外壳50的ECU 100（电子控制单元）的方法包括：通过使用第一焊料41通过回流将表面安装部件（12,14）连接在印刷电路板11上的第一工序; 以及通过使用第二焊料42将连接器引脚52作为插入安装部件连接到印刷电路板11上的第二工序。第二焊料42具有通过在第一焊料41中添加Bi或In而获得的组成，从而降低一个熔点。在第二过程中，当连接部分31的热量通过连接器销52从连接器壳体部分53传递到盖54时，盖54的温度变得不超过盖的材料的软化温度 54。

7. 发明专利

JP2013069825A Double side cooling type semiconductor power module 审中-公开
标题翻译：双面冷却型半导体功率模块
公开(公告)号：JP2013069825A
公开(公告)日：2013-04-18
申请号：JP2011206785
申请日：2011-09-22
申请人： Hitachi Automotive Systems Ltd , 日立オートモティブシステムズ株式会社
发明人： YAMASHITA SHIRO , SAKAMOTO EIJI , YOSHINARI HIDETO , KUME TAKASHI
IPC分类号： H01L23/36 , H01L25/07 , H01L25/18
CPC分类号： H01L24/33 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent short circuits from occurring between lead frames and in a semiconductor chip surface due to overflowing solder while inhibiting the deterioration of heat radiation performance and the reliability of a semiconductor chip in a double side cooling type semiconductor power module.SOLUTION: A double side cooling type semiconductor power module includes: a semiconductor element; a first lead frame where a first protruding surface is connected with an electrode part formed on one surface of the semiconductor element by solder; a second lead frame where the one surface of the semiconductor element is connected with an electrode part formed on a surface at the opposite side of the one surface by solder; a first heat radiation member thermally connecting with the first lead frame; and a second heat radiation member thermally connecting with the second lead frame. In the double side cooling type semiconductor power module, the first protruding surface has a shape smaller than the electrode part which is formed on the one surface of the semiconductor element and is connected with the first protruding surface by the solder. The dimension differences between the shapes of the first protruding surface and the electrode part are configured to differ in the direction of the first protruding surface.
摘要翻译：要解决的问题：为了防止引线框架和半导体芯片表面中由于溢出焊料而发生短路，同时抑制双侧冷却型半导体电源中的散热性能的劣化和半导体芯片的可靠性模块。解决方案：双面冷却型半导体功率模块包括：半导体元件; 第一引线框架，其中第一突出表面通过焊料与形成在半导体元件的一个表面上的电极部分连接; 第二引线框架，其中所述半导体元件的一个表面与通过焊料在所述一个表面的相对侧的表面上形成的电极部分连接; 与第一引线框架热连接的第一散热构件; 以及与所述第二引线框架热连接的第二散热构件。在双面冷却型半导体功率模块中，第一突出面的形状比形成在半导体元件的一个面上的电极部的形状小，并且通过焊料与第一突出面连接。第一突出表面和电极部分的形状之间的尺寸差异被构造成在第一突出表面的方向上不同。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2011143442A Power module having highly reliable solder-bonded part 审中-公开
标题翻译：具有高可靠焊接部分的电源模块
公开(公告)号：JP2011143442A
公开(公告)日：2011-07-28
申请号：JP2010005871
申请日：2010-01-14
申请人： Hitachi Automotive Systems Ltd , 日立オートモティブシステムズ株式会社
发明人： YAMASHITA SHIRO , HATA SHOHEI
IPC分类号： B23K35/26 , C22C13/00 , H01L25/07 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To enable Pb-free and heat-resistable solder-bonding when bonding a Cu-metalized electrode on a substrate to a Cu-metalized lead terminal or a Cu-metalized terminal of a semiconductor component.
SOLUTION: A Cu-metalized electrode 9 and a Cu-metalized lead terminal are bonded with a solder 7 containing 0.7-2.5 wt.% Cu, 1.5-9.8 wt.% Ni, and the balance Sn. An alloy layer 8 is formed between the solder 7 and the metalized part 9 of the electrode or of the terminal. In the alloy layer 8, Cu
3 Sn is formed in the side of the Cu-metalized part 9, and Cu
6 Sn
5 is formed in the side of the solder 7. The Cu
3 Sn layer, having a problem of mechanical reliability, of the alloy layer 8 is thinly formed, so that the bonded part is kept high in reliability.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了在将基板上的Cu金属化电极接合到半导体部件的Cu金属化引线端子或Cu金属化端子时实现无铅和耐热焊接。解决方案：Cu金属化电极9和Cu金属化引线端子用含有0.7-2.5重量％Cu，1.5-9.8重量％Ni和余量Sn的焊料7接合。在焊料7和电极或端子的金属化部分9之间形成合金层8。在合金层8中，在Cu金属化部分9的侧面形成Cu 3 S 3 Sn，形成Cu Sn 5 在焊料7的侧面。合金层8的具有机械可靠性问题的Cu 3 S 3 Sn层被薄薄地形成，使得粘接部分保持高可靠性。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2011003680A Electronic circuit sealing device 有权
标题翻译：电子电路密封装置
公开(公告)号：JP2011003680A
公开(公告)日：2011-01-06
申请号：JP2009144850
申请日：2009-06-18
申请人： Hitachi Automotive Systems Ltd , 日立オートモティブシステムズ株式会社
发明人： SHIGYO TOSHIKAZU , TSUYUNO ENJO , YAMASHITA SHIRO , UCHIYAMA KAORU , KAMEYAMA HIROSHI
IPC分类号： H01L23/50 , H01L23/28
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To attain a full-mold structure with a sealing resin using only one single sheet of base member in an electronic circuit sealing device without employing a heatsink which is a separate member, for improved heat radiation property and air tightness and smaller size.SOLUTION: A bridge part is provided to a part of a window of a base member. A multilayer wiring board includes a deflected surface in semicircle. The deflected surface is molded with many conductors arranged on one surface side, and the bridge part is bonded to the deflected surface. An adhesive layer between the deflected surface and the bridge part is thin.
摘要翻译：要解决的问题：为了在不使用作为单独部件的散热器的情况下在电子电路密封装置中仅使用一片基材的密封树脂获得全模结构，以提高散热性和气密性，并且更小尺寸。解决方案：将桥梁部件提供给基座构件窗口的一部分。多层布线板包括半圆形的偏转表面。偏转表面被模制成具有布置在一个表面侧上的许多导体，并且桥接部分结合到偏转表面。偏转表面和桥接部分之间的粘合剂层薄。

10. 发明专利

JP2015015437A 電子制御装置审中-公开
标题翻译：电子控制装置
公开(公告)号：JP2015015437A
公开(公告)日：2015-01-22
申请号：JP2013142747
申请日：2013-07-08
申请人：日立オートモティブシステムズ株式会社 , Hitachi Automotive Systems Ltd
发明人： KOYAMA HIROSHI , YAMASHITA SHIRO , KAWAKITA SHINYA , HATA SHOHEI , ABE HIROYUKI , SAITO MASATO
IPC分类号： H05K3/34 , H05K1/18
摘要：【課題】レーザを照射して半田付けされた被半田付け部材を備える電子制御装置において、レーザの反射光により焼付け部が生じないようにする。【解決手段】コネクタピン11の先端部11aには傾斜面IFが形成されており、レーザLの正反射光LRは、ランド23の外周上に形成されたソルダレジスト24に照射される。配線基板20のランド23の外周に、レーザLの正反射光LRが照射されるソルダレジスト24の領域下に金属膜31を、ランド23と一体に形成した。金属膜31により、レーザLの正反射光LRが反射されるため、ソルダレジスト24の焼付けを防止することができる。【選択図】図8
摘要翻译：要解决的问题：在配备有通过激光束照射焊接的焊接部件的电子控制装置中，防止激光的反射光产生烧焦部。解决方案：在尖端11a形成倾斜面IF 并且规则反射光Lof激光L照射形成在焊盘23的外周上的阻焊剂24.在布线板20的焊盘23的外周中，金属膜31形成为一体其中焊盘抗蚀剂24的区域上的焊盘23被激光L的规则反射光L照射。由于激光L的规则反射光L被金属膜31反射，所以可以防止阻焊剂24被燃烧。

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