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    • 7. 发明专利
    • Manufacturing method of injection molded circuit component
    • 注射成型电路组件的制造方法
    • JP2007083686A
    • 2007-04-05
    • JP2005278609
    • 2005-09-26
    • Sumitomo Electric Ind Ltd住友電気工業株式会社
    • MUTO KOJINISHIKAWA SHINYAMIKAGE MASANARI
    • B29C45/14B29C45/16
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of an injection molded circuit component that inhibits short circuit of a metal layer used as a circuit.
      SOLUTION: A predetermined domain of a front face of a primary molded article 1 having a solid shape is coated with a secondary molded member 3 by insert molding, thereby a two color molded article 4 is formed. When a metal layer 5 used as a circuit is selectively formed on a front face of the primary molded article 1 not covered by the secondary molded member 3 in this two color molded article 4 to manufacture MID (Molded Interconnect Device) 6, a first engaging portion 9 engaged with the secondary molded member 3 is formed to the primary molded article 1 to form the two color molded article 4, in the process, a second engaging part 10 engaged with the first engaging portion 9 of the primary molded article 1 is formed to the secondary molded member 3, the second engaging part 10 formed is engaged with the first engaging part 9, and thereby the secondary molded member 3 is prevented from the detachment in a subsequent process.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供抑制用作电路的金属层的短路的注塑成型电路部件的制造方法。 解决方案:通过嵌件成型将具有固体形状的一次成型品1的正面的预定区域涂覆有二次模制构件3,从而形成双色成型制品4。 当在该双色成型品4中,在未被二次成型品3覆盖的一次成型品1的正面上选择性地形成用作电路的金属层5以制造MID(模制互连器件)6时,首先接合 与一次成型品1形成与二次成型体3接合的部分9,以形成双色成型品4,在该过程中形成与一次成型品1的第一接合部9接合的第二接合部10 在二次模制件3中,形成的第二接合部10与第一接合部9接合,从而防止二次模制件3在随后的过程中脱离。 版权所有(C)2007,JPO&INPIT
    • 8. 发明专利
    • Heat-resistant polyester resin molding and its manufacturing method
    • 耐热聚酯树脂模塑及其制造方法
    • JP2006282917A
    • 2006-10-19
    • JP2005106941
    • 2005-04-01
    • Nippon Synthetic Chem Ind Co Ltd:TheSumitomo Electric Ind Ltd住友電気工業株式会社日本合成化学工業株式会社
    • HAYAMI HIROSHINISHIKAWA SHINYAKANKE SHUNSUI
    • C08J7/00C08K5/3492C08L67/02
    • PROBLEM TO BE SOLVED: To provide a heat-resistant polyester resin molding superior in molding stability and heat resistance (anti-reflow property), and also, strong in weld strength, and superior in the freedom of shape design, and its manufacturing method.
      SOLUTION: The heat-resistant polyester resin molding is formed of at least one kind of dicarboxylic acid component selected from the group consisting of alicyclic dicarboxylic acid components and aromatic dicarboxylic acid components; and a thermoplastic polyester resin selected from the group consisting of alicyclic diol components and aliphatic diol components and having repeated units originated from polycondensation with at least one kind of diol component, or a resin composition containing the thermoplastic polyester resin, wherein the thermoplastis polyester resin is crossliked by irradiation with an ionizing radiation. Also, its manufacturing method is provided.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了提供在成型稳定性和耐热性(抗回流性)方面优异的耐热聚酯树脂成型体,以及焊接强度高,形状设计自由度优异的耐热聚酯树脂成型体, 制造方法。 解决方案:耐热聚酯树脂模塑由至少一种选自脂环族二羧酸组分和芳族二羧酸组分的二羧酸组分形成; 和选自脂环族二醇成分和脂肪族二醇成分的组合物的热塑性聚酯树脂,以及由至少一种二醇成分缩聚产生的重复单元,或含有热塑性聚酯树脂的树脂组合物,其中,热塑性聚酯树脂为 用电离辐射照射交叉。 此外,还提供了其制造方法。 版权所有(C)2007,JPO&INPIT