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    • 1. 发明专利
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • JP2013024970A
    • 2013-02-04
    • JP2011157759
    • 2011-07-19
    • Mitsubishi Electric Corp三菱電機株式会社
    • TAKAI KOICHIITO YASUYOSHIHAYASHI MASAMIISHIGA NOBUAKITODO JUNICHI
    • G02F1/1368G03F7/20H01L21/027H01L21/3205H01L21/768
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, by which a region that can be patterned in a predetermined layer formed on a substrate can be maintained to the maximum and a device with high accuracy can be manufactured.SOLUTION: A process of forming a gate wiring line of a TFT substrate is carried out through the following steps (a) and (b). Step (a): a resist pattern 11 for gate wiring is obtained by exposing exposure regions RA1 and RA2 on a predetermined resist by successively using two reticles and then developing the resist. In this step, a pattern 7 for position correction comprising recesses 7a to 7c is also formed in a part of the resist pattern 11 for gate wiring in an overlapping region DA1 of the exposure regions RA1 and RA2. Step (b): a gate wiring line and a capacitor wiring line are obtained by patterning a wiring material of a base by using the resist pattern 11 for gate wiring obtained in Step (a).
    • 解决的问题:为了提供一种制造半导体器件的方法,通过该方法可以将形成在基板上的预定层中的图案化区域保持在最大程度,并且可以制造高精度的器件。 解决方案:通过以下步骤(a)和(b)进行形成TFT基板的栅极布线的工艺。 步骤(a):通过连续地使用两个掩模将曝光区域RA1和RA2暴露在预定的抗蚀剂上,然后显影抗蚀剂,获得用于栅极布线的抗蚀剂图案11。 在该步骤中,在曝光区域RA1和RA2的重叠区域DA1中的用于栅极布线的抗蚀剂图案11的一部分中还形成用于包括凹部7a至7c的位置校正用图案7。 步骤(b):通过使用步骤(a)中获得的栅极布线用抗蚀剂图案11,对基材的布线材料进行图案化,得到栅极布线和电容布线。 版权所有(C)2013,JPO&INPIT
    • 3. 发明专利
    • Parallax barrier structure and method for manufacturing the same
    • PARALLAX BARRIER结构及其制造方法
    • JP2014029381A
    • 2014-02-13
    • JP2012169631
    • 2012-07-31
    • Mitsubishi Electric Corp三菱電機株式会社
    • TODO JUNICHIYAMAYOSHI ICHIJIITO YASUYOSHI
    • G02B5/20G02B27/22G02F1/1335
    • PROBLEM TO BE SOLVED: To provide a parallax barrier structure in which mixing between a flat film and a color filter is suppressed and also to provide a method for manufacturing the same.SOLUTION: A parallax barrier structure 30 includes: a CF side substrate 1; a parallax barrier 2 on the CF side substrate 1; a flat film 3 which covers the parallax barrier 2 and is at least provided on the CF side substrate 1 in a region excluding a cutting line and can regulate a view angle by a film thickness; a cap layer 4 covering the upper surface and the side surface of the flat film 3; a black matrix 5 provided on the cap layer 4; and a color filter 6 which corresponds to respective colors provided alternately with the black matrix 5 on the cap layer 4.
    • 要解决的问题:提供抑制平板膜和滤色器之间的混合的视差屏障结构,并且还提供其制造方法。视差屏障结构30包括:CF侧基板1; CF侧基板1上的视差屏障2; 平坦膜3覆盖视差屏障2,并且至少在除了切割线之外的区域中设置在CF侧基板1上,并且可以通过膜厚调节视角; 覆盖平膜3的上表面和侧表面的盖层4; 设置在盖层4上的黑色矩阵5; 以及与盖层4上的黑矩阵5交替设置的各颜色对应的滤色器6。
    • 5. 发明专利
    • Methods for manufacturing multilayer thin film pattern and display device
    • 用于制造多层薄膜图案和显示装置的方法
    • JP2012137771A
    • 2012-07-19
    • JP2012030712
    • 2012-02-15
    • Mitsubishi Electric Corp三菱電機株式会社
    • ITO YASUYOSHIHAYASHI MASAMI
    • G09F9/30G02F1/1335G02F1/1343G02F1/1368H01L21/3065H01L21/3213H01L21/768
    • PROBLEM TO BE SOLVED: To provide methods for manufacturing a multilayer thin film pattern and a display device which can easily obtain a pattern having a desired shape.SOLUTION: The methods for manufacturing the multilayer thin film pattern and the display device perform the sequential steps of: forming an interlayer insulating film 1 on a substrate; forming a first thin film 2 having conductivity on the interlayer insulating film 1; forming a second thin film 3 on the first thin film 2; forming a resist pattern 5 having a film thickness difference on the second thin film 3 through multitone exposure; exposing the interlayer insulating film 1 in a region in which the resist pattern does not exist by etching the second thin film 3 and the first thin film 2 through the resist pattern 5 having the film thickness difference; removing a thin film portion 5b of the resist pattern by ashing the resist pattern 5 having the film thickness difference; and etching the second thin film 3 through a resist pattern 5c from which the thin film portion 5b has been removed.
    • 解决的问题:提供可以容易地获得具有所需形状的图案的多层薄膜图案和显示装置的制造方法。 解决方案:制造多层薄膜图案和显示装置的方法执行以下顺序步骤:在基板上形成层间绝缘膜1; 在层间绝缘膜1上形成具有导电性的第一薄膜2; 在第一薄膜2上形成第二薄膜3; 通过多次曝光在第二薄膜3上形成具有膜厚差的抗蚀图案5; 通过蚀刻第二薄膜3和第一薄膜2通过具有薄膜厚度差的抗蚀剂图案5,使层间绝缘膜1暴露在不存在抗蚀剂图案的区域中; 通过灰化具有膜厚度差的抗蚀剂图案5来去除抗蚀剂图案的薄膜部分5b; 并且通过去除了薄膜部分5b的抗蚀剂图案5c来蚀刻第二薄膜3。 版权所有(C)2012,JPO&INPIT
    • 7. 发明专利
    • Thin film transistor array substrate, and liquid crystal display unit
    • 薄膜晶体管阵列基板和液晶显示单元
    • JP2012099721A
    • 2012-05-24
    • JP2010247542
    • 2010-11-04
    • Mitsubishi Electric Corp三菱電機株式会社
    • HAYASHI MASAMIMIYAGAWA OSAMUTAKEGUCHI TORUYANO SHINICHIITO YASUYOSHINAGANO SHINGO
    • H01L29/786G02F1/1368H01L21/3205H01L21/768H01L23/522
    • H01L27/124G02F1/13452G02F1/136286
    • PROBLEM TO BE SOLVED: To obtain a thin film transistor array substrate capable of enhancing the yield or the reliability by preventing or retarding occurrence of the floating of an insulating film formed on the upper layer of a transparent conductive film, and to provide a liquid crystal display unit.SOLUTION: The TFT array substrate 100 comprises a TFT 51, a transparent conductive film pattern 6 formed to directly overlap any one of a source electrode 53, a drain electrode 54, or a metal pattern 5 formed of the same material as the source electrode 53 and the drain electrode 54 on the same layer, and an upper layer insulating film 9 covering a gate insulating film 8 including the transparent conductive film pattern 6. At least the transparent conductive film pattern 6 formed in a frame region 42 is formed so as not to cover the source electrode 53, the drain electrode 54 or the end face of the metal pattern 5.
    • 解决的问题:为了获得能够通过防止或延迟形成在透明导电膜的上层上的绝缘膜的漂浮的发生而提高成品率或可靠性的薄膜晶体管阵列基板,并且提供 液晶显示单元。 解决方案:TFT阵列基板100包括TFT51,形成为直接与源极电极53,漏电极54或金属图案5中的任何一个形成的透明导电膜图案6,所述源极电极53,漏电极54或与由 源电极53和漏电极54,以及覆盖包括透明导电膜图案6的栅极绝缘膜8的上层绝缘膜9.至少形成在框区域42中的透明导电膜图案6形成 以便不覆盖源电极53,漏电极54或金属图案5的端面。版权所有(C)2012,JPO&INPIT