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    • 7. 发明专利
    • A method of manufacturing a semiconductor light-receiving element
    • 空值
    • JP5341056B2
    • 2013-11-13
    • JP2010279978
    • 2010-12-16
    • 三菱電機株式会社
    • 栄治 柳生栄太郎 石村雅晴 中路
    • H01L31/107
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light receiving element to suppress dark current and deterioration. SOLUTION: The method for manufacturing the semiconductor light receiving element includes; a step of preparing a first conductive semiconductor substrate; a step of forming a semiconductor layer including orderly, on the first conductive type semiconductor substrate, a first conductive type layer, a light absorbing layer, a diffusion buffer layer and a second conductive type layer; a second conductive type layer removing step of leaving an inner circumference as a light receiving unit by removing part or the whole of an outer circumference of the diffusion buffer layer and the second conductive type layer; and a step of forming an avalanche multiplying layer after forming the first conductive type layer and before forming the light absorbing layer. COPYRIGHT: (C)2011,JPO&INPIT
    • 解决的问题:提供一种制造半导体光接收元件以抑制暗电流和劣化的方法。 解决方案:半导体光接收元件的制造方法包括: 制备第一导电半导体衬底的步骤; 在第一导电型半导体衬底上形成第一导电类型层,光吸收层,扩散缓冲层和第二导电类型层的有序地形成半导体层的步骤; 第二导电型层去除步骤,通过去除扩散缓冲层和第二导电类型层的外周的一部分或全部而留下内周作为光接收单元; 以及在形成第一导电类型层之后并在形成光吸收层之前形成雪崩倍增层的步骤。 版权所有(C)2011,JPO&INPIT