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    • 10. 发明专利
    • Semiconductor device
    • JP5044151B2
    • 2012-10-10
    • JP2006175184
    • 2006-06-26
    • 株式会社東芝
    • 哲夫 畠山
    • H01L29/78H01L21/336H01L29/12
    • H01L29/66068H01L29/0619H01L29/0878H01L29/1095H01L29/1608H01L29/7802
    • PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing application of high electric field on a gate insulating film. SOLUTION: The semiconductor device includes a semiconductor substrate 11 of first conductive type; a first semiconductor region of first conductive type having a first portion 12 in contact with the semiconductor substrate and a second portion 15 projected from the first portion, in which the second portion has a lower face smaller in width than that of the upper face, and the upper face of the second portion has a recess on the upper face of the semiconductor substrate; and a second semiconductor region 14 of second conductive type arranged on the first portion and pinching the second portion. Further, the device has a third semiconductor region 16 of second conductive type arranged in the recess and having width smaller than that of the upper face of the second portion; a source region 19 arranged on the upper face of the second semiconductor region; a gate insulating film 17 arranged on the second portion, the second semiconductor region, and the third semiconductor region; a gate electrode 18 arranged on the gate insulating film; a source electrode 23; and a drain electrode 13. COPYRIGHT: (C)2008,JPO&INPIT