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1. 发明专利

JP2014045011A The substrate support system 审中-公开
标题翻译：基板支持系统
公开(公告)号：JP2014045011A
公开(公告)日：2014-03-13
申请号：JP2012185442
申请日：2012-08-24
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA , KUWAUCHI SHIGEKI
IPC分类号： H01L21/60 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a substrate support system including a substrate support which allows for heating of a substrate while supporting, without hindering the optical path of light used in the positioning of a chip for the substrate.SOLUTION: In a substrate support system having an optical system for positioning a chip at a predetermined position on a substrate WA by image recognition, and substrate side heating means for heating the substrate while supporting on a substrate supporting surface 501, the optical system includes a light-emitting device and a light-receiving device configured so that light is propagated while transmitting through at least the substrate side heating means in a direction substantially perpendicular to the substrate supporting surface, and an image recognition device for measuring a relative positional error of the chip and substrate, by recognizing a chip side mark put on the chip and a substrate side mark put on the substrate. The substrate side heating means includes a first transparent insulation layer 504 having the substrate supporting surface and a heater surface 502 on the front and back, and a transparent conductive layer 503 provided on the heater surface of the first transparent insulation layer and generating heat by electrification.
摘要翻译：要解决的问题：提供一种基板支撑系统，其包括基板支撑件，其允许在支撑的同时加热基板，而不会妨碍用于定位基板的芯片的光路。解决方案：在基板支撑系统具有用于通过图像识别在芯片WA上的预定位置处定位芯片的光学系统，以及用于在支撑在基板支撑表面501上的同时加热基板的基板侧加热装置，该光学系统包括发光装置和光接收装置，被配置为使得光在基本上垂直于基板支撑表面的方向上至少通过至少基板侧加热装置传播;以及图像识别装置，用于通过识别芯片和基板的相对位置误差，放在芯片上的芯片侧标记和放在基板上的基板侧标记。基板侧加热装置包括具有基板支撑表面的第一透明绝缘层504和前后的加热表面502，以及设置在第一透明绝缘层的加热器表面上并通过带电产生热量的透明导电层503 。

2. 发明专利

JP2013243333A Chip-on wafer bonding method and bonding device and structure including chip and wafer 审中-公开
标题翻译：嵌入式晶片结合方法和结合器件及其结构包括芯片和晶圆
公开(公告)号：JP2013243333A
公开(公告)日：2013-12-05
申请号：JP2012243900
申请日：2012-11-05
申请人： Tadatomo Suga , 唯知須賀 , Bondtech Inc , ボンドテック株式会社
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60 , B23K20/00 , B23K20/16 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/75 , H01L24/81 , H01L24/95 , H01L2224/16145
摘要： PROBLEM TO BE SOLVED: To provide a technique for enhancing mechanical strength by establishing electrical connection between a chip and a wafer or between a plurality of stacked chips, and for bonding a chip onto a wafer efficiently.SOLUTION: The method for bonding a chip-on wafer includes: step S1 for performing surface activation at least of a metal area of a chip side bonding surface by colliding particles having a predetermined kinetic energy, and hydrophilizing by depositing water or an OH-containing material; step S2 for performing surface activation at the bonding part of a substrate by colliding particles having a predetermined kinetic energy, and hydrophilizing by depositing water or an OH-containing material; step S3 for attaching a plurality of chips subjected to surface activation and hydrophilization, respectively, onto the corresponding bonding parts of the substrate subjected to surface activation and hydrophilization so that the metal area of the chip comes into contact with the bonding part of the substrate; and step S4 for heating a structure including the substrate and the plurality of chips attached onto the substrate.
摘要翻译：要解决的问题：提供一种通过建立芯片和晶片之间或多个堆叠芯片之间的电连接并且有效地将芯片接合到晶片上的机械强度的技术。解决方案：在晶片上包括：步骤S1，用于通过碰撞具有预定动能的颗粒，并且通过沉积水或含OH材料进行亲水化来至少对芯片侧接合表面的金属区进行表面活化; 步骤S2，用于通过碰撞具有预定动能的颗粒在基底的接合部分进行表面活化，并通过沉积水或含OH材料进行亲水化; 分别将经表面活化和亲水处理的多个芯片附着到经过表面活化和亲水处理的基板的相应接合部分上，使芯片的金属区域与基板的接合部分接触的步骤S3; 以及用于加热包括基板和附接到基板上的多个芯片的结构的步骤S4。

3. 发明专利

JP2012166263A Pressurizing device and pressurizing method 有权
标题翻译：加压装置和压缩方法
公开(公告)号：JP2012166263A
公开(公告)日：2012-09-06
申请号：JP2012011655
申请日：2012-01-24
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： B30B15/06 , B30B15/24
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of more flexibly controlling the flatness of a pressurizing face.SOLUTION: The pressurizing device 1 is the device pressurizing the objects 91, 92 to be pressurized. The pressurizing device 1 includes: a head 22; and a stage 12. After the head 22 and the stage 12 are relatively moved in a mutually adjoining direction in a Z direction (vertical direction), both the objects 91, 92 to be pressurized are sandwiched between the stage 12 and the head 22 to be pressurized. The head 22 includes: a pressurizing face FC of transmitting force for pressurization to the object 92 to be pressurized; and a piezo actuator 37. The piezo actuator 37 displaces the central part of the pressurizing face FC in a Z direction, and relatively displaces the central part of the pressurizing face FC in a Z direction to the outer circumferential side part of the pressurizing face FC.
摘要翻译：要解决的问题：提供能够更灵活地控制加压面的平坦度的技术。解决方案：加压装置1是对被加压物体91,92加压的装置。加压装置1包括：头部22; 在平台12和台架12沿Z方向（垂直方向）相互相邻的方向相对移动之后，被加压物体91,92被夹在台架12和头部22之间，加压。头部22包括：用于加压的物体92被加压的传递力的加压面FC; 和压电致动器37.压电致动器37沿Z方向移动加压面FC的中心部分，并且使加压面FC的Z方向的中心部位相对于加压面FC的外周侧部位。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011119293A Alignment device 有权
标题翻译：对齐设备
公开(公告)号：JP2011119293A
公开(公告)日：2011-06-16
申请号：JP2009268266
申请日：2009-11-26
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： H01L21/02 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of miniaturizing an alignment device. SOLUTION: The alignment device includes a stage 12 holding an article 91 to be joined, a supporting member slidably supporting the stage 12, and a positioning mechanism 50 moving the stage 12 in the direction parallel with a substantially horizontal plane by applying a pushing force from the side of the stage 12. The positioning mechanism 50 includes a pushing-force applicator 51 pushing the stage 12 in the X direction at pushing points PT11, a pushing-force applicator 52 pushing the stage 12 in the Y direction at the pushing point PT12, and a pushing-force applicator 53 pushing the stage 12 in the Y direction at the pressing point PT13. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够使对准装置小型化的技术。解决方案：对准装置包括保持待接合物品91的台架12，可滑动地支撑台架12的支撑部件和定位机构50，该台架12沿平行于基本上水平的平面的方向移动台架12，定位机构50包括：推力施加器51，其在推压点PT11处沿X方向推压平台12，推力施加器52沿着Y方向推动平台12 推压点PT12，以及推压施加器53，在按压点PT13沿着Y方向推动台12。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2017079316A ウエハの接合方法及び接合装置审中-公开
公开(公告)号：JP2017079316A
公开(公告)日：2017-04-27
申请号：JP2015214012
申请日：2015-10-30
申请人：ボンドテック株式会社 , Bondtech Inc
发明人： YAMAUCHI AKIRA
IPC分类号： H01L21/02 , B23K20/00 , B23K20/24
摘要：【課題】スループットの向上と装置の簡素化が図れるウエハの接合方法及び接合装置を提供する。【解決手段】ウエハの接合方法であって、接合されるウエハの接合予定面の少なくとも一部を親水化させる親水化処理と、親水化処理の後にウエハを接合する接合処理とを含み、親水化処理が、ラジカルプラズマ処理、原子ビーム又はイオンビーム照射のいずれかによるものである。【選択図】図2

6. 发明专利

JP2014113633A Bonding method and bonding device 审中-公开
标题翻译：接合方法和接合装置
公开(公告)号：JP2014113633A
公开(公告)日：2014-06-26
申请号：JP2012271409
申请日：2012-12-12
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： B23K20/00 , H01L21/60 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a bonding technique that improves the accuracy of positioning between objects to be bonded in the bonding, while applying surface activation treatment.SOLUTION: A bonding method includes the steps of: bringing the bonding surface between a first object to be bonded and a second object to be bonded into contact with each other; measuring the positional displacement between the objects to be bonded in the in-plane direction of the bonding surface in a contact state; moving the objects to be bonded in the in-plane direction of the bonding surface so as to separate the objects to be bonded and correct the positional displacement in the in-plane direction of the bonding surface, when the positional displacement measured in the contact state exceeds a tolerance range; repeating the above step until measured positional displacement becomes lower than the tolerance range; separating the bonding surface of the object to be bonded and applying the surface activation treatment to the bonding surface of the objects to be bonded; and bringing the bonding surface of the objects to be bonded into contact with each other.
摘要翻译：要解决的问题：提供一种在施加表面活化处理的同时提高在接合中要结合的物体之间的定位精度的接合技术。解决方案：接合方法包括以下步骤：将第一物体之间的接合表面并且第二物体彼此接合; 在接触状态下测量接合面的面内方向上待接合物体之间的位置偏移; 在待接合物体的面内方向上移动待接合物体，以便在接合状态下测量的位置位移时分离被接合物体并校正接合面的面内方向的位置偏移超过公差范围; 重复上述步骤直到测得的位置位移变得低于公差范围; 分离待接合物体的接合表面并将表面活化处理施加到被接合物体的接合表面; 使待粘合物的接合面彼此接触。

7. 发明专利

JP2013251405A Bonding method of substrate having metal region 审中-公开
标题翻译：具有金属区域的基板的接合方法
公开(公告)号：JP2013251405A
公开(公告)日：2013-12-12
申请号：JP2012125246
申请日：2012-05-31
申请人： Tadatomo Suga , 唯知須賀 , Bondtech Inc , ボンドテック株式会社
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60 , B23K20/00 , B23K20/24 , H01L21/603
摘要： PROBLEM TO BE SOLVED: To provide a technique for mutually bonding substrates having a junction interface having metal regions.SOLUTION: The method of mutually bonding substrates having a junction interface having metal regions includes a step (S1) for polishing a junction interface having metal regions, a step (S2) for performing surface activation by colliding particles having predetermined kinetic energy against a polished junction interface, and further performing hydrophilic treatment by depositing the water, a step (S3) for forming a substrate assembly by bonding the junction interfaces of the substrates so that the metal regions subjected to surface activation and hydrophilic treatment come into contact with each other, and a step (S4) for heating the substrate assembly.
摘要翻译：要解决的问题：提供一种用于相互粘合具有金属区域的接合界面的基板的技术。解决方案：具有金属区域的具有接合界面的基板的相互粘合的方法包括用于抛光具有金属区域的接合界面的步骤（S1），用于通过使具有预定动能的颗粒与抛光的接合界面碰撞来进行表面活化的步骤（S2），以及进一步通过沉积水来进行亲水处理;步骤（S3），用于通过将所述接合界面的接合界面基板，使得经受表面活化和亲水处理的金属区域彼此接触;以及用于加热基板组件的步骤（S4）。

8. 发明专利

JP2013221175A Method for removing surface oxide using organic acid gas under existence of metal catalyst or inert gas atmosphere, and joining device 有权
标题翻译：在金属催化剂或惰性气体环境存在下使用有机酸气体除去表面氧化物的方法和接合装置
公开(公告)号：JP2013221175A
公开(公告)日：2013-10-28
申请号：JP2012093437
申请日：2012-04-16
申请人： Tadatomo Suga , 唯知須賀 , Bondtech Inc , ボンドテック株式会社
发明人： SUGA TADATOMO , AKAIKE MASATAKE , YANG WENHUA , YAMAUCHI AKIRA
IPC分类号： C23G5/00 , B23K20/00 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/75 , H01L2924/1461 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for joining members having a metallic region and a resin region at least on its surface portion without heating at a high temperature and without degrading resin surfaces during joining.SOLUTION: A method includes the steps of: removing an oxide film on a metallic region 3 on a first member having the metallic region and a resin region at least on its surface portion and an oxide film on a metallic region 5 on a second member having the metallic region and a resin region at least on its surface portion by blowing organic gas passed through a catalyst and hydrogen generated by degrading the organic acid gas from an opening 11 of a nozzle 6; and joining the first member and the second member so that the metallic regions from which the oxide films have been removed may contact with each other.
摘要翻译：要解决的问题：提供一种在接合期间至少在其表面部分上连接具有金属区域和树脂区域的构件而不在高温下加热而不降低树脂表面的方法。方法包括以下步骤：除去在具有金属区域的第一构件和至少在其表面部分上具有树脂区域的金属区域3上的金属区域3上的氧化物膜和具有金属区域的第二构件上的金属区域5上的氧化膜和至少在其上的树脂区域通过吹入通过催化剂的有机气体的表面部分和由喷嘴6的开口11使有机酸气体降解而产生的氢; 并且将第一构件和第二构件接合，使得已经从其去除氧化膜的金属区域彼此接触。

9. 发明专利

JP2012138423A Bonding device and bonding method 有权
标题翻译：绑定装置和绑定方法
公开(公告)号：JP2012138423A
公开(公告)日：2012-07-19
申请号：JP2010288599
申请日：2010-12-24
申请人： Bondtech Inc , ボンドテック株式会社
发明人： YAMAUCHI AKIRA
IPC分类号： H01L21/02 , B23K20/00 , B23K20/24 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a bonding technology which can inhibit a disadvantageous effect on an alignment resulting from thermal expansion.SOLUTION: In the present bonding technology, a first bonding object and a second bonding object are aligned by a relative transfer between the first bonding object and the second bonding object in a horizontal direction with both bonding objects, the first bonding object and the second bonding object being in a heated state (step S10, S11, S12). Subsequently, the first bonding object and the second bonding object are bonded with the both being in a contact state (step S13, S19).

10. 发明专利

JP2011249643A Bonding method and bonding system 有权
标题翻译：结合方法和结合系统
公开(公告)号：JP2011249643A
公开(公告)日：2011-12-08
申请号：JP2010122616
申请日：2010-05-28
申请人： Bondtech Inc , Shinko Seiki Co Ltd , Tadatomo Suga , ボンドテック株式会社 , 神港精機株式会社 , 唯知須賀
发明人： WANG CHENXI , SUGA TADATOMO , YAMAUCHI AKIRA , KAGAMI JOJI
IPC分类号： H01L21/02 , B23K20/00 , B23K20/24
摘要： PROBLEM TO BE SOLVED: To provide a bonding technology capable of minimizing occurrence of micro voids even when heat treatment is performed in a process subsequent to a bonding process.SOLUTION: A porous oxide is created on the bonding surface of at least one of two objects to be bonded by irradiating the bonding surface with an energy wave (e.g. plasma processing) (step S10). Subsequently, an appropriate amount of water molecules is stuck to the bonding surface on which the porous oxide is created (step S20). Thereafter, the two objects to be bonded are pressed while touching the bonding surfaces thereof each other in a state where water molecules are stuck to the bonding surfaces, thus bonding the two objects to be bonded (step S30).
摘要翻译：要解决的问题：即使在接合工艺之后的过程中进行热处理，也提供能够最小化微细孔的发生的接合技术。解决方案：通过用能量波（例如等离子体处理）照射接合表面，在要接合的两个物体中的至少一个的接合表面上形成多孔氧化物（步骤S10）。随后，在形成多孔氧化物的接合面上粘贴适量的水分子（步骤S20）。此后，在水分子粘附到接合表面的状态下，接触两个接合表面的同时按压两个待粘合的物体，从而粘接待接合的两个物体（步骤S30）。版权所有（C）2012，JPO＆INPIT

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