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2. 发明专利

JP5346241B2 Semiconductor device 有权
公开(公告)号：JP5346241B2
公开(公告)日：2013-11-20
申请号：JP2009123399
申请日：2009-05-21
申请人：パナソニック株式会社
发明人：真太郎林 , 充彦植田 , 佳治佐名川
IPC分类号： H01L23/08 , H01L21/50
CPC分类号： H01L2224/45124 , H01L2224/45144 , H01L2224/48137 , H01L2224/49171 , H01L2924/1461 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device that can reduce stress generated in a semiconductor element in a package at low cost and improve reliability of a junction to a wiring board. SOLUTION: A surface mounting type package 101 comprises a hollow plastic package body 102 which is formed in a box shape having one surface made open, and has outer leads 112b of a plurality of leads 112, electrically connected to the semiconductor element A, led out from an outer side face, and a package lid 103 joined airtightly to the plastic package body 102 to close the one surface of the plastic package body 102. The semiconductor element A is fixed to a bottom portion of the plastic package body 102 with adhesion portions 104 made of an adhesive (for example, silicone-based resin such as silicon resin of ≤1 MPa in elastic modulus) at three places corresponding to three vertexes of a virtual triangle defined on the basis of an outer circumferential shape of the semiconductor element A. COPYRIGHT: (C)2011,JPO&INPIT

3. 发明专利

JP5221940B2 Mounting structure of the semiconductor element 有权
公开(公告)号：JP5221940B2
公开(公告)日：2013-06-26
申请号：JP2007302017
申请日：2007-11-21
申请人：パナソニック株式会社
发明人：充彦植田 , 佳治佐名川 , 孝昌酒井
IPC分类号： H01L21/52 , G01P15/08 , H01L29/84
CPC分类号： H01L24/32 , H01L2224/48091 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure of semiconductor elements, reducing a stress generated in a semiconductor element. SOLUTION: In this mounting structure, a semiconductor element 1 is bonded to a substrate in three positions corresponding to three apexes of an imaginary triangle defined based on an outer circumference shape of the semiconductor element 1 through an adhesion part 2 composed of an adhesive (for example, a silicon-based resin such as a silicon resin having an elastic modulus of 1 MPa or less). Here, in the semiconductor element 1, all pads 19 are arranged along one side in the surface side (the above one surface side) opposite a substrate 3 side and the adhesion part 2 is positioned at each apex of an imaginary triangle having three apexes at three positions including two positions of both terminals of the above one side and one position on one side parallel to the above one side, so that a bonding wire is stably bonded to each pad 19. COPYRIGHT: (C)2009,JPO&INPIT

4. 发明专利

JP5177910B2 Semiconductor device and a method of manufacturing the same 有权
公开(公告)号：JP5177910B2
公开(公告)日：2013-04-10
申请号：JP2010065379
申请日：2010-03-23
申请人：パナソニック株式会社
发明人：充彦植田 , 伸宏吉岡 , 佳治佐名川 , 威中筋 , 貞幸角 , 利彦高畑
IPC分类号： H01L23/12 , H01L21/60
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/00

5. 发明专利

JP5049253B2 Semiconductor device 有权
公开(公告)号：JP5049253B2
公开(公告)日：2012-10-17
申请号：JP2008301460
申请日：2008-11-26
申请人：パナソニック株式会社
发明人：佳治佐名川 , 真太郎林 , 充彦植田 , 孝昌酒井
IPC分类号： G01P15/12 , G01P15/18 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can relax stress which occurs in a functional section caused by a difference in the linear expansion coefficient between a semiconductor substrate and a mounting substrate. SOLUTION: The semiconductor device 1 includes: the semiconductor substrate 10 in which a flexural part 13 is formed at the central part, which is thinner than the peripheral part; a circuit which is formed in the flexural part 13 on one side of the semiconductor device 10; an external connection electrode 17 which is provided on the other side of the semiconductor device 10; a through-hole wire 18 which passes through the semiconductor device 10 in the thickness direction for connecting the circuit and the external connection electrode 17; and a connecting part 43 which is provided on the one side of the semiconductor device 10 for connecting the through-hole wire 18 and the circuit. The semiconductor device further includes a first groove 31 which is formed nearer to the center of the semiconductor device 10 than the through-hole wire 18 on the other side of the semiconductor device 10 and a second groove 32 which is formed nearer to the periphery of the semiconductor device 10 than the through-hole wire 18 on the one side of the semiconductor device 10. COPYRIGHT: (C)2010,JPO&INPIT

6. 发明专利

JP5010199B2 Luminescent device 有权
公开(公告)号：JP5010199B2
公开(公告)日：2012-08-29
申请号：JP2006203964
申请日：2006-07-26
申请人：パナソニック株式会社
发明人：威中筋 , 雅男久保 , 佳治佐名川 , 和司吉田 , 昌男桐原 , 健一郎田中 , 將有鎌倉
IPC分类号： H01L33/48 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/32225 , H01L2224/73253
摘要： PROBLEM TO BE SOLVED: To provide a high-reliability light-emitting device that achieves a thickness reduction and miniaturization of the device. SOLUTION: The light-emitting device is provided with an LED chip 1 and a mounting substrate 2 that has an LED mounting base substrate 20 onto which the LED chip 1 is mounted, and each wall 2b protruded from the LED mounting substrate 20 in a shape of surrounding the LED chip 1. One electrode 12a of both electrodes 12a, 12b of the LED chip 1 is provided on one surface side opposite to the LED mounting substrate 20 side in the LED chip 1. The mounting substrate 2 has a beam-like piece 2c that is internally projected from the tip of the wall 2b to a position overlapped with a pad as the electrode 12a provided on the one surface side of the LED chip 1. A wiring 45 joined and electrically connected with the pad 12a is provided to the beam-like piece 2c. COPYRIGHT: (C)2008,JPO&INPIT

7. 发明专利

JP4925273B2 Semiconductor device 有权
公开(公告)号：JP4925273B2
公开(公告)日：2012-04-25
申请号：JP2006231340
申请日：2006-08-28
申请人：パナソニック株式会社
发明人：威中筋 , 佳治佐名川
IPC分类号： B81B3/00 , B23K1/00 , B23K101/40

8. 发明专利

JP4925272B2 Semiconductor device 有权
公开(公告)号：JP4925272B2
公开(公告)日：2012-04-25
申请号：JP2006231339
申请日：2006-08-28
申请人：パナソニック株式会社
发明人：威中筋 , 佳治佐名川
IPC分类号： B81B3/00 , B81C3/00 , G01P15/08 , G01P15/12 , G01P15/18 , H01L23/02 , H01L23/12 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of loosening a stress generated to a flexible element due to a linear expansion coefficient difference from a mounting board. SOLUTION: This acceleration sensor A, which is a semiconductor device, comprises a sensor substrate (function substrate) 1 having a flexion part (flexible element part) 13, a first cover substrate 2 jointed to the sensor substrate 1, and a second substrate 3 jointed to one surface side of the first cover substrate 2 in a form for surrounding the sensor substrate 1 between it and the first cover substrate 2. A groove part 20b for loosening a stress generated to the flexion part 13 together with joint of an electrode 25 for external connection and a conductor pattern 43 of a mounting board 40 is formed on the first cover substrate 2. A formation position of the groove 20b on one surface side is displaced from the formation position of the groove 20b on the other surface side so that a bellow-like structure part 28 is formed between a second electric connecting metal layer 29 and an external connecting electrode 25 electrically connected to the electric connecting metal layer 29. COPYRIGHT: (C)2008,JPO&INPIT

9. 发明专利

JP5671213B2 金属ガラス層への導線の接合方法有权
标题翻译：接合引线到金属玻璃层的方法
公开(公告)号：JP5671213B2
公开(公告)日：2015-02-18
申请号：JP2009044049
申请日：2009-02-26
申请人：パナソニック株式会社 , 国立大学法人東北大学 , 竹本正 , 正竹本 , 西川宏 , 宏西川
发明人：佐名川　佳治 , 佳治佐名川 , 久保　雅男 , 雅男久保 , 酒井　孝昌 , 孝昌酒井 , 竹本　正 , 正竹本 , 西川　宏 , 宏西川 , 幹夫福原 , 幹夫福原 , 井上　明久 , 明久井上
IPC分类号： H01L21/607 , H04R19/00
CPC分类号： H01L2224/45 , H01L2224/45124 , H01L2224/48091 , H01L2224/48472 , H01L2224/78301 , H01L2224/85186 , H01L2924/1461 , H01L2924/00014 , H01L2924/00

10. 发明专利

JP5571988B2 Joining method 有权
公开(公告)号：JP5571988B2
公开(公告)日：2014-08-13
申请号：JP2010073567
申请日：2010-03-26
申请人：パナソニック株式会社
发明人：洋一西嶋 , 剛岡本 , 佳治佐名川 , 隆司西條
IPC分类号： B23K20/00 , B23K20/24 , H01L21/02

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