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    • 10. 发明专利
    • Thin-film transistor and method of manufacturing the same
    • 薄膜晶体管及其制造方法
    • JP2009272427A
    • 2009-11-19
    • JP2008121384
    • 2008-05-07
    • Canon Incキヤノン株式会社
    • SATO AYUMIHAYASHI SUSUMUYABUTA HISATOSANO MASAFUMI
    • H01L21/336G02F1/1368H01L29/786H01L51/50
    • H01L29/7869H01L29/78621
    • PROBLEM TO BE SOLVED: To provide a thin-film transistor in a coplanar structure with a small threshold voltage change due to an electric stress; and to provide a method of manufacturing the transistor. SOLUTION: The thin-film transistor has at least a gate electrode, a gate insulating layer, an oxide semiconductor layer formed of a source electrode, a drain electrode and a channel region, a channel protective layer and an interlayer insulating layer on a substrate. The channel protective layer is formed of one or more layers. A layer brought into contact with the oxide semiconductor layer is constituted of an insulator comprising oxygen. The film thickness of an end part of the channel protective layer is smaller than that of a center part of the channel protective layer. The interlayer insulating layer comprises hydrogen; and a region of the oxide semiconductor layer, which is directly brought into contact with the interlayer insulating layer, forms source/drain electrodes. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供具有由于电应力导致的小阈值电压变化的共面结构中的薄膜晶体管; 并提供制造晶体管的方法。 解决方案:薄膜晶体管至少具有栅电极,栅极绝缘层,由源电极,漏电极和沟道区形成的氧化物半导体层,沟道保护层和层间绝缘层 底物。 沟道保护层由一层或多层形成。 与氧化物半导体层接触的层由包含氧的绝缘体构成。 沟道保护层的端部的膜厚小于沟道保护层的中心部分的膜厚。 层间绝缘层包括氢; 并且直接与层间绝缘层接触的氧化物半导体层的区域形成源极/漏极。 版权所有(C)2010,JPO&INPIT