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    • 1. 发明专利
    • 移動検知装置とアクチュエータならびにアクチュエータの組立方法
    • 移动检测装置,执行器和组装执行器的方法
    • JP2015045507A
    • 2015-03-12
    • JP2013175242
    • 2013-08-27
    • アルプス電気株式会社Alps Electric Co Ltd
    • KODAMA YUJIHOSOGOE JUNICHISATO SHUICHI
    • G01B7/00G01D5/12
    • G01D5/145G01D11/30
    • 【課題】ダイヤフラムならびに移動ホルダと駆動軸とを一度の工程で連結でき、しかも駆動軸と移動ホルダに保持された磁石との相対位置を高精度に決めることができる移動検知装置とアクチュエータさらにはアクチュエータの組立方法を提供する。【解決手段】合成樹脂製の移動ホルダ10に金属ブッシュ32が装着され、ダイヤフラム5が移動ホルダ10と金属支持部材33とで挟まれた状態で、駆動軸20が金属ブッシュ32に挿通される。磁石14を保持している保持部12の内部に空間部13が設けられており、空間部13内で駆動軸20の先端部20aが押圧加工されてカシメ部23が形成される。空間部13を設けることで、一度のカシメ工程で、移動ホルダ10とダイヤフラム5ならびに駆動軸20を一体に固定させることができる。【選択図】図2
    • 要解决的问题:提供一种能够在一个步骤中连接隔膜,换档保持器和驱动轴的换档检测装置,并且还能够精确地确定驱动轴和由换档保持器保持的磁体的相对位置, 致动器和组装致动器的方法。解决方案:将金属衬套32装配到合成树脂制移位架10上,并且在隔膜5夹在变速架10和金属支承构件之间的状态下 如图33所示,驱动轴20插入到金属衬套32中。空的部分13设置在保持磁体14的保持器12内,驱动轴20的末端20a被压入空部13内以形成铆接部 通过设置空的部分13,移位保持器10,隔膜5和驱动轴20能够以一个单一的铆接步骤一体地固定。
    • 2. 发明专利
    • Mounting structure for led
    • LED安装结构
    • JP2003051619A
    • 2003-02-21
    • JP2001239507
    • 2001-08-07
    • Alps Electric Co Ltdアルプス電気株式会社
    • SATO TAKASHISUDO HIROKISATO SHUICHI
    • H01L33/48H01L33/00
    • PROBLEM TO BE SOLVED: To provide a mounting structure for an LED which can apply a common holder to the LEDs of different sizes, and for reducing a component manufacture cost and component management cost.
      SOLUTION: A holder for positioning/holding a body of the LED with a lead terminal on a circuit board 17 is provided with a plurality of positioning parts for selectively arranging the body of a two or more kinds of the LEDs of different diameters. For instance, the holder 10 holding the LED in an upward posture is provided with a recessed step 10a, on which the body 12 of one LED 11 of a larger diameter of two kinds of large and small LEDs can be loaded, and a recessed part 10b exposed on the inner side of the recessed step part 10a on which the body part 15 of the other LED 14 of a smaller diameter can be loaded. Thus, the cost of dies for the holder is saved, and the number of components is reduced as well.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:提供一种用于LED的安装结构,其可以将共用保持器应用于不同尺寸的LED,并且用于降低部件制造成本和部件管理成本。 解决方案:用于在电路板17上用引线端子定位/保持LED的本体的保持器设置有多个定位部件,用于选择性地布置不同直径的两种或更多种LED的主体。 例如,将LED保持在向上姿态的保持器10设置有凹部10a,两个大型和小型LED的大直径的一个LED 11的主体12可以装载在凹部10a上, 10b露出在其中可以装载较小直径的另一个LED 14的主体部分15的凹入步骤部分10a的内侧。 因此,保持器的模具的成本被节省,并且部件的数量也减少。
    • 3. 发明专利
    • Torque inspection device for motor
    • 电机扭矩检测装置
    • JP2003035616A
    • 2003-02-07
    • JP2001221554
    • 2001-07-23
    • Alps Electric Co Ltdアルプス電気株式会社
    • SATO SHUICHIKAMATA HIROAKITANAKA KENKICHI
    • G01L3/14G01L5/00
    • PROBLEM TO BE SOLVED: To provide a torque inspection device for a motor capable of efficiently judging the acceptance or rejection of the no-load torque and maximum set torque of the motor in a short time.
      SOLUTION: The weight of a first weight 6 is set to the magnitude corresponding to the allowable upper limit value of the no-load torque of the motor 20, and the sum total of the weights of first and second weights 6 and 8 is set to the magnitude corresponding to the allowable lower limit value of the maximum set torque of the motor 20. Whereupon, a sensor 12 detects whether or not the second weight 8 is drawn up when predetermined maximum drive voltage is applied to the motor 20, and the acceptance or rejection of the maximum set torque of the motor 20 can be judged. Succeedingly, the application of voltage to the motor 20 is stopped to allow the first and second weights 6 and 8 to fall. After the tension of a connection wire 9 is removed, a sensor 11 detects whether or not the first weight 6 falls under its own weight and the acceptance or rejection of the no-load torque of the motor 20 can be judged.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:提供一种能够在短时间内有效地判断无负载转矩的接受或拒绝以及电动机的最大设定转矩的电动机的转矩检查装置。 解决方案:将第一重物6的重量设定为与电动机20的无负载转矩的容许上限值对应的大小,将第一和第二配重6,8的重量的总和设定为 与电动机20的最大设定转矩的允许下限值相对应的大小。因此,传感器12检测当向电动机20施加规定的最大驱动电压时第二重物8是否被牵伸, 或者可以判断电动机20的最大设定转矩的抑制。 成功地,停止向电动机20施加电压,以允许第一和第二重物6和8落下。 在去除连接线9的张力之后,传感器11检测第一重物6是否落在其自身重量下,并且可以判断马达20的空载转矩的接受或拒绝。
    • 4. 发明专利
    • Rotary variable resistor
    • 旋转变压器
    • JP2005158758A
    • 2005-06-16
    • JP2003307228
    • 2003-08-29
    • Alps Electric Co Ltdアルプス電気株式会社
    • OBARA TATSUYASATO SHUICHI
    • H01C10/32
    • PROBLEM TO BE SOLVED: To provide a rotary variable resistor that is wide in variable range.
      SOLUTION: After a first electrode pattern 6A is formed on a substrate 1, an insulator 11 is formed on the substrate 1 so that the insulator 11 may partially overlap the first connector 6a1 of the electrode pattern 6A. Then the second connector 6a2 of a second electrode pattern 6B is formed so that the connector 6a2 may partially overlap the insulator 11 and the substrate 1. Finally, the rotary variable resistor is formed by respectively laminating resistors 5 upon the connectors 6a1 and 6a2. Since the insulator 11 is interposed between the first and second connectors 6a1 and 6a2, the rotary variable resistor having a large effective rotational angle α and a wide variable range can be obtained by narrowing the clearance size W between the connectors 6a1 and 6a2 in the top view of the resistor.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供可变范围宽的旋转可变电阻器。 解决方案:在基板1上形成第一电极图案6A之后,在基板1上形成绝缘体11,使得绝缘体11可以部分地与电极图案6A的第一连接器6a1重叠。 然后,第二电极图案6B的第二连接器6a2形成为使得连接器6a2可以部分地与绝缘体11和基板1重叠。最后,旋转可变电阻器通过在连接器6a1和6a2上分别层叠电阻器5而形成。 由于绝缘体11插入在第一和第二连接器6a1和6a2之间,因此可以通过使顶部中的连接器6a1和6a2之间的间隙尺寸W变窄来获得具有大的有效旋转角α和宽的可变范围的旋转可变电阻器 电阻的视图。 版权所有(C)2005,JPO&NCIPI
    • 5. 发明专利
    • JPH05309530A
    • 1993-11-22
    • JP11618092
    • 1992-05-08
    • ALPS ELECTRIC CO LTD
    • AJIMIZU MANABUTAKAHASHI KOICHISATO SHUICHISATO SEIICHI
    • B21D28/34B23H9/12
    • PURPOSE:To enable both a punch and a member fixing the punch to be simultaneously fabricated by forming the circumferential surface of the punch in a convergent taper toward a die plate, and thereby projecting the punch out of a hole in a state that the punch is closely adhered onto the inner surface of the hole formed in a taper identical to that of the punch. CONSTITUTION:A plate member carried in between a die plate 11 and a stripper 7 is punched out with a punch 5 pressed onto the stripper 7 so as to be coupled in a cavity 12, the circumferential surface of the punch 5 in press dies as mentioned above is formed into a convergent taper toward the die plate 11. And next, the punch 5 is projected out of a hole 17 in a state that the punch is closely adhered onto the inner surface of the hole 17 of a punch plate 4, which is formed into a taper identical to that of the punch 5. By this constitution, both the punch plate 4 and the punch 5 can be simultaneously fabricated out of one material, and time required for fabrication can thereby be shortened.
    • 6. 发明专利
    • PRINTED WIRING BOARD
    • JP2003234556A
    • 2003-08-22
    • JP2002030990
    • 2002-02-07
    • ALPS ELECTRIC CO LTD
    • TERASHITA SATOSHISATO SHUICHIFUJIOKA KAZUNORI
    • H05K3/34H05K1/18
    • PROBLEM TO BE SOLVED: To provide a low-cost printed wiring board which solves the problem that in a conventional printed wiring board 1, a solder adhesion preventing layer 7 and a heat-resistant film 9 are arranged on a connecting land part 4 containing an angle part 2b so that a solder by automatic soldering will not adhere to the connecting land part 4, whereby the number of works is increased in arrangements in coatings and stickings of the solder adhesion preventing layer 7 and the heat-resistant film 9, and each releasing works after the automatic soldering, to form the printed wiring board at a higher cost. SOLUTION: There are provided an insulating substrate 2, a through-hole 3 formed in the insulating substrate, and connecting land parts 4 facing each other and provided along an outer periphery 3c, facing the through-hole of the insulating substrate. The through-hole comprises a center hole 3a and an escape hole 3b, continuously connecting in the outward direction of the center hole, and an angle part 2b is formed in the insulating substrate by the center hole and the escape hole and the connecting land part is not provided in the angle part. COPYRIGHT: (C)2003,JPO
    • 8. 发明专利
    • LEAD TERMINAL CONNECTION STRUCTURE FOR IC
    • JPS63229741A
    • 1988-09-26
    • JP6256187
    • 1987-03-19
    • ALPS ELECTRIC CO LTD
    • SATO SHUICHI
    • H01L23/50H05K3/34
    • PURPOSE:To prevent the short-circuit between adjacent fellow connecting electrodes by a method wherein adjacent fellow lead terminals and the adjacent fellow coonnecting electrodes are arranged in such a way that they do not superpose on one another on lines parallel to the sides of the package of an IC. CONSTITUTION:Lead terminal groups 6 and 7 protruded from the sides of a package 2 of an IC are formed their connecting sites to a printed substrate 4 in such a way that the adjacent fellow lead terminals 6 and 7 do not superpose on one another on lines parallel to the sides of the package 2. Moreover, connecting electrodes 8 for lead terminal connection on the substrate 4 are also arranged in such a way that the adjacent fellow connecting elecrodes 8 do not superpose on one another on the lines parallel to the sides of the package. Thereby, even though the arrangement of the lead terminals of the IC 1 comes to be finely pitched, the connection structure of the IC 1, which has no possibility of causing a short-circuit between the adjacent fellow connecting electrodes 8, to the printed substrate 4 can be obtained.
    • 10. 发明专利
    • FORMING METHOD AND DEVICE OF IC PACKAGE LEAD TERMINAL
    • JPH03272160A
    • 1991-12-03
    • JP6958790
    • 1990-03-22
    • ALPS ELECTRIC CO LTD
    • SATO SHUICHI
    • H01L23/50H05K3/34
    • PURPOSE:To protect an IC package against connection failure caused by the deformation of a lead terminal by a method wherein the lead terminal of the IC main body fixed to a mounting pad is formed in such a shape that its tip is brought into contact with a corresponding land and its root side is made separate from the land concerned. CONSTITUTION:An IC main body 2 sucked by a tool 10 is set located a few millimeters above a mounting table 41, and when the tools 10 is made to stop sucking air to make the IC main body 2 drop, the tip of a bonding part 3a is made to bear against the slope 43 and the IC chip main body 2 is placed on the table 41 as corrected in position. When the tool 10 is made to descend gradually, a middle cylinder 13 and an outer cylinder 11 descend together keeping an inner cylinder 15 bearing against the main body 2, and main body 2 is positioned and fixed as the slope 33 bears on the corner of the main body 2. The tips 17 is made to press down the bonding parts 3a to form. After the forming of a lead 3 is finished, the IC 1 is sucked by the tool 10 and placed on a cream solder 52 printed on lands 51 provided to pattern formed on a printed board 50, which in sent in a reflow oven to be soldered. By this setup, the tip of a lead can be surely brought into contact with a land, so that contact failure or soldering failure can be prevented.