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1. 发明专利

JP2003136554A METHOD FOR MANUFACTURING LAMINATED SHEET 审中-公开
公开(公告)号：JP2003136554A
公开(公告)日：2003-05-14
申请号：JP2001341652
申请日：2001-11-07
申请人： RISHO KOGYO KK
发明人： KARIBA TSUTOMU
IPC分类号： B29C43/20 , B29C43/52 , B29K101/10
摘要： PROBLEM TO BE SOLVED: To obtain a laminated sheet being used for a base sheet for a printed- wiring board and the like and with excellent thickness accuracy with good productivity. SOLUTION: When sheet-like prepregs impregnated with a thermosetting resin are placed between mirror plates and they are heated and pressed between heating platens to mold the laminated sheet, by heating the mirror plates in advance before molding is started, temperature difference between the prepreg at the nearest position to the heating platens and the prepreg at the most separated position to the heating platens is made small to improve accuracy of thickness of the laminated sheet obtained.

2. 发明专利

JP2003089157A THERMOSETTING RESIN LAMINATED PIPE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：JP2003089157A
公开(公告)日：2003-03-25
申请号：JP2001281993
申请日：2001-09-17
申请人： RISHO KOGYO KK
发明人： TOSHIKURA KOICHI
IPC分类号： B29C70/16 , B29C70/06 , B29K101/10 , B29K105/06 , B29L23/00
摘要： PROBLEM TO BE SOLVED: To obtain a thermosetting resin laminated pipe 6 having mechanical strength not generating deformation at the time of formation of winding, and excellent in characteristics as an insulating cylinder for the winding having interlaminar withstand voltage increased by the penetration of insulating oil. SOLUTION: A paper substrate is impregnated with a thermosetting resin so as to form a thermosetting resin impregnated layer 1a and an unimpregnated layer 1b in a thickness direction, and the impregnated substrate is dried to form a prepreg 1 which is, in turn, wound around a winding core 4 under heating and pressure to manufacture the thermosetting resin laminated pipe 6.

3. 发明专利

JP2001259911A BACKUP BOARD FOR DRILL MACHINING 失效
公开(公告)号：JP2001259911A
公开(公告)日：2001-09-25
申请号：JP2000078380
申请日：2000-03-21
申请人： RISHO KOGYO KK
发明人： SAKANISHI SUEHIRO , TAKAHASHI YUKITO , SAKATA TOMOJI
IPC分类号： B23B35/00 , B23B41/00
摘要： PROBLEM TO BE SOLVED: To suppress wear of a drill cutting edge when a drill enters a backup board for drill machining used for drilling in a manufacturing process of a printed wiring board. SOLUTION: A mixture prepared by evenly mixing crushed articles of paper base material thermosetting resin hardened material and uncured phenolic resin is put between pre-impregnations with thermosetting resin impregnated in the paper base material and a backup board for drill machining is composed of laminating plates molded by heating and pressurizing.

4. 发明专利

JP2946134B2 失效
公开(公告)号：JP2946134B2
公开(公告)日：1999-09-06
申请号：JP27168291
申请日：1991-07-18
申请人： RISHO KOGYO KK
发明人： ISHIMARU OSAMU , NOBUKAWA TAKUYA
IPC分类号： C08G69/20

5. 发明专利

JPH11227107A SILICONE RUBBER STICKING LAMINATE 失效
公开(公告)号：JPH11227107A
公开(公告)日：1999-08-24
申请号：JP7478098
申请日：1998-02-16
申请人： RISHO KOGYO KK
发明人： HARA HIDEO , NAKADA SUEMITSU
IPC分类号： B32B25/20 , C09K3/10
摘要： PROBLEM TO BE SOLVED: To manufacture a silicone rubber sticking laminate of large silicone rubber release strength. SOLUTION: One to several first prepreg sheets in the cured state formed of a base impregnated with a thermosetting resin, one second prepreg sheet in the cured state formed of a base of same kind of or different kind from the base of the first prepreg sheet in the cured state and impregnated with a thermosetting polyphenylene ether resin composition and one silicone rubber sheet in the uncured state formed of a vulcanizing agent kneaded and formed into a sheet are laminated successively in the above order, and a laminate thus formed is heated, pressurized and integrated. Or one to several second prepreg sheets in the uncured state formed of a base impregnated with thermosetting polyphenylene ether resin composition and silicone rubber sheet in the uncured state formed by kneading the vulcanizing agent are laminated successively in the above order, and a laminate thus formed is heated, pressurized, reacted and integrated.

6. 发明专利

JPH11220233A NICKEL FOIL CLAD BOARD FOR SLIDE CIRCUIT BOARD 失效
公开(公告)号：JPH11220233A
公开(公告)日：1999-08-10
申请号：JP5876698
申请日：1998-02-02
申请人： RISHO KOGYO KK
发明人： SAITO YOSHIFUMI , MUKAI TAKESHI
IPC分类号： H05K1/09 , B32B7/02 , B32B15/08
摘要： PROBLEM TO BE SOLVED: To decrease abrasion of the electrode in a slide circuit board by using the electrolytic nickel foil, wherein the thickness in the specified range is provided, the arithmetic average roughness of a shiny surface is in the specified range, and the Vickers hardness of the shiny surface is in a specified range. SOLUTION: As the nickel foil of a nickel clad board 1a for a slide circuit board, the electrolytic nickel foil, wherein the thickness is 5-18 μm, the arithmetic average roughness of a shiny surface (S surface) is 0-0.7 μm, the arithmetic average roughness of a mat surface is 0.7-1.5 μm and the Vickers hardness of the S surface is 250-600, is used. Since the electrolytic nickel foil is used, the damage to the electrode by slide friction which is caused at the time when a vibrator is in elastic contact to slide can be decreased. Furthermore, since the thickness of the electrolytic nickel foil is 5-18 μm, the slide friction is stabilized. Furthermore, since the Vickers hardness of the S surface is made 250-600, the abrasion of the electrode by the slide friction is decreased.

7. 发明专利

JP2844235B2 失效
公开(公告)号：JP2844235B2
公开(公告)日：1999-01-06
申请号：JP468190
申请日：1990-01-12
申请人： RISHO KOGYO KK
发明人： MAEDA ITSURO
IPC分类号： C09J129/14 , C09J163/00 , H05K3/38

8. 发明专利

JPH10308568A ADDITIVE METHOD LAMINATED BOARD FOR PRINTED WIRING BOARD 失效
公开(公告)号：JPH10308568A
公开(公告)日：1998-11-17
申请号：JP23570996
申请日：1996-08-01
申请人： RISHO KOGYO KK
发明人： NISHIGUCHI KENJI , KATO AKIRA , INOUE HIROSHI
IPC分类号： C08J5/24 , B29C70/06 , B29L9/00 , H05K1/03 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an additive method laminated board for a printed wiring board wherein copper precipitation is little, by improving plating stickiness of nonelectrolytic copper of a laminated board, and performing nonelectrolytic copper plating in the state that activity of nonelectrolytic copper plating solution is decreased. SOLUTION: A prepreg is obtained by impregnating a reinforcing substrate with epoxy resin varnish containing at least epoxy resin, epoxy resin curing agent, nonelectrolytic plating catalyst and organic solvent. A laminated board is obtained by laminating a specified number of the prepregs and heating, pressing and molding the laminated prepregs. The epoxy resin curing agent is parasubstituted alkyl phenolic novolak resin of phenolic hydroxyl group equivalent from 1.0 to 1.6 to epoxy resin of 1 epoxy equivalent.

9. 发明专利

JPH10219010A PRODUCTION OF PREPREG FOR COPPER-CLAD LAMINATE 失效
公开(公告)号：JPH10219010A
公开(公告)日：1998-08-18
申请号：JP6718897
申请日：1997-02-12
申请人： RISHO KOGYO KK
发明人： YAMADA MICHIICHI , TANAKA NORIAKI
IPC分类号： B29B11/16 , B29B15/08 , B29K105/08 , B29L7/00 , B29L31/34 , B32B5/02 , B32B15/08 , B32B17/04 , C08J5/24 , H05K1/03 , H05K3/02
摘要： PROBLEM TO BE SOLVED: To produce a prepreg having an improved impregnating ability of an epoxy resin varnish to a fiber reinforcing agent of a glass fabric and hardly causing deterioration of insulation at the interface between the fiber reinforcing agent of the glass fabric and the epoxy resin. SOLUTION: This method for producing a prepreg for copper-clad laminate comprises a step for preparing epoxy resin varnish by dissolving an epoxy resin, a hardener, dicyandiamide and a hardening promoter in an organic solvent and 1-5 pts.wt. water solvent based on 100 pts.wt. epoxy resin, a step for impregnating the epoxy resin varnish into a glass fiber fabric and a step for drying the glass fiber fabric impregnated with the epoxy resin varnish.

10. 发明专利

JPH10217199A ENTRY BOARD FOR DRILL MACHINING 失效
公开(公告)号：JPH10217199A
公开(公告)日：1998-08-18
申请号：JP23643097
申请日：1997-07-28
申请人： RISHO KOGYO KK
发明人： OHASHI YOSHITAKA , MATSUOKA KIKUKO
IPC分类号： B26F1/16 , B32B27/42 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To restrain a copper foil burr of a drill machining hole edge part and reduce abrasion of a cutting blade by applying and impregnating varnish type phenol resin with lubricant dispersed in it on a paper base material, overlapping a proper number of prepreg sheets made by drying it and heating, pressurizing and molding the whole of them. SOLUTION: The whole is integrated by making phenol resin react by heating and pressurization in a state where a varnish with lubricant dispersed and contained in the phenol resin is applied and impregnated in a paper base material. Consequently, it works to smoothen a drill hole inwall surface by lubricating the rotation of a drill. Additionally, a surface making contact with a base plate for print wiring of a board is a molded surface reactively hardening phenol resin while overlapping a proper number of prepreg sheets made by applying and impregnating varnish type phenol resin with lubricant dispersed in it on the paper base material and drying it and heating, pressurizing and molding the whole. The surface is a smooth surface and has hardness to a certain degrees. Consequently, it is possible to restrain warp of a drill hole edge part and production of copper foil burr.

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