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1. 发明专利

JPH10270477A MANUFACTURE OF SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH10270477A
公开(公告)日：1998-10-09
申请号：JP7617197
申请日：1997-03-27
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： OBA TAKASHI
IPC分类号： H01L21/60 , H01L21/56 , H01L23/12 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To provide a technique for enabling reduction of a filling completion time necessary for filling with resin a gap between a semiconductor chip subjected to a flip chip binding process and a wiring board. SOLUTION: In the semiconductor package manufacturing method of filing with resin 3 a gap between a semiconductor chip 4 subjected to a flip chip bonding process and a wiring board 5, a through hole 5A for resin injection is made in the wiring board 5 at a predetermined position, a nozzle 2 for resin supply is inserted into the through hole 5A, and then the resin 3 is filled into the gap of the chip 4 and the board 5 number the injection pressure of the resin.

2. 发明专利

JP2000150548A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000150548A
公开(公告)日：2000-05-30
申请号：JP31869098
申请日：1998-11-10
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： OBA TAKASHI
IPC分类号： H01L23/12 , H01L21/301 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing technique by which a sealing section having an accurate external size can be formed by preventing the burring or chipping of the sealing section. SOLUTION: A substrate sheet 9 composed of a plurality of bases 2 each carrying a plurality of connection terminals formed on one surface and a plurality of substrate dividing grooves 11 respectively formed on the other surfaces of the boundary sections of the bases 2 is constituted so that individual sealing sections 7 formed at every base 2 may be separated from each other by bending the sheet 9 from the grooves 11, in such a way that, after semiconductor chips 4 are respectively mounted on the bases 2 and electrically connected to the connection terminals and a sealing resin 13 is supplied to the sheet 9, the resin 13 is divided into parts by mounting a partitioning jig 15 on the sheet 9, and, when the resin is half cured, removing the jig 15 and forming the sealing sections 7 at every base 2. Therefore, the burring and chipping of a semiconductor device can be prevented and sealing sections having accurate outside dimensions can be formed easily, because the sealing sections 7 are not divided at the time of dividing the sheet 9.

3. 发明专利

JPH0574857A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0574857A
公开(公告)日：1993-03-26
申请号：JP25983691
申请日：1991-09-11
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： MIYAMOTO TOSHIO , ISHII SHIGERU , YAMADA TOMIO , KANEKO MAYUMI , OBA TAKASHI , SAKURABA TADAKI
IPC分类号： H01L21/60 , H01L23/12
摘要： PURPOSE:To prevent a crack and exfoliation from being caused in a connecting terminal due to a stress by a difference in a coefficient of thermal expansion. CONSTITUTION:In a semiconductor device wherein a silicon pellet 11 is bonded to a substrate 21 by CCB, connecting terminals 34 are constructed on the basis of bump main bodies 17 composed of a soft silicone rubber. Thereby, the difference in a deformation amount between the substrate 21 and the pellet 11 in a thermal fluctuation on the basis of the difference in a coefficient of thermal expansion between an alumina ceramic and silicon can be absorbed by the elastic deformation of the soft bump main bodies 17. Consequently, it is possible to restrain or suppress a stress acting on the connecting terminals 34 by the difference in the deformation amount. As a result, it is possible to prevent exfoliation and crack from being caused in the connecting terminals 31 formed by a CCB operation.

4. 发明专利

JPH1012810A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1012810A
公开(公告)日：1998-01-16
申请号：JP16546796
申请日：1996-06-26
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： OBA TAKASHI
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07
摘要： PROBLEM TO BE SOLVED: To miniaturize a highly integrated semiconductor device. SOLUTION: A semiconductor device 1 comprises an external electrode 11, and also comprises a substrate 2 wherein a recessed part 8 is provided on a main surface and a wiring 9 is provided, at least one semiconductor chip 12 wherein, while it is fixed to the recessed part of the substrate, an electrode 13 is connected to the wiring 9 of the substrate 2 through electrical means, and a cap 15 so fixed to the main surface of the substrate 2 as to block the recessed part. The cap 15 is formed with a semiconductor chip 16 and an electrode 17 of the semiconductor chip 16 is connected to the wiring 9 of the substrate 2 by electrical means. The gap between the substrate 2 and the cap 15 is filled with an insulating resin 14, and an electrode surface of the semiconductor chip 16 constituting the cap and the semiconductor chip 12 fixed to the recessed part of the substrate 2 are coated with the insulating resin 14. The semiconductor chip 16 constituting the cap 15 has a size similar to that of the substrate 2. In addition, the rear surface of the substrate 2 contains the external electrode 11.

5. 发明专利

JPH09107067A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09107067A
公开(公告)日：1997-04-22
申请号：JP26165495
申请日：1995-10-09
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： OBA TAKASHI
IPC分类号： H01L23/12 , H01L25/065 , H01L25/07 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To realize good handling property and increase the memory capacity by attaching a semiconductor element constituting a memory into recesses on front and back sides of a wiring board and covering the semiconductor element with an insulating resin. SOLUTION: A semiconductor device 1 has a rectangular wiring board 2, and an upper side electrode 3 and a lower side electrode 4 provided on front and back sides of the wiring board 2. The upper side electrode 3 and the lower side electrode 4 are electrically connected with each other via a lateral side electrode 5. Thus, the upper side electrode 3 and the lower side electrode 4 are vertically overlapped in a perspective view, and form electrodes of the same function. Also, semiconductor elements 14a, 14b made of memory elements are fixed on recessed front and back surfaces of the wiring board 2, respectively, and the upper side electrode 3, the lower side electrode 4 and the lateral side electrode 5 as lead-out terminals of the semiconductor elements 14a, 14b are commonly used by these semiconductor elements. Therefore, the memory capacity is increased. Since the semiconductor element is embedded in the recess of the rigid wiring board 2 and covered with resin, good handling property of the semiconductor device 1 is realized.

6. 发明专利

JPS61181975A MODULE TYPE INTEGRATED CIRCUIT APPARATUS 失效
公开(公告)号：JPS61181975A
公开(公告)日：1986-08-14
申请号：JP2165985
申请日：1985-02-08
申请人： HITACHI LTD
发明人： FUJITA MINORU , OBA TAKASHI , ITO KAZUO
IPC分类号： H01L21/66 , G01R31/02 , H01L21/822 , H01L27/04
摘要： PURPOSE:To perform a function test simply, by providing the wire formed on a module substrate with a testing circuit which supplies an input signal for function tests selectively into a plurality of semiconductor integrated circuit units with an external terminal connected thereto separately to fetch output signals. CONSTITUTION:Input terminals and output terminals of latch circuits FF11-FF2 N are connected to common input signal lines Di and output signal lines Do respectively. The latch circuits FF11-FF2N are selectively enabled by a decode control signal DCR formed with a test controlling circuit TSTCONT, which is provided with an external terminal from which a test pattern signal, an output signal with respect thereto and an address input terminal for specifying a semiconductor integrated circuit units to be tested. A test signal is sent out from a latch circuit provided in one semiconductor integrated circuit unit and received with a latch circuit provided in a semiconductor integrated circuit unit so arranged to be connected thereto. Thus, a testing can be done in a relatively short period of time proportional to the semiconductor integrated circuit.

7. 发明专利

JPS63154888A FORCIBLE OPERATING METHOD OF SUB PUMP IN WATER SUPPLY DEVICE 失效
公开(公告)号：JPS63154888A
公开(公告)日：1988-06-28
申请号：JP29991586
申请日：1986-12-18
申请人： HITACHI LTD , HITACHI KEIYO ENG
发明人： IDEKI TAKESHI , OBA TAKASHI
IPC分类号： F04D15/00
摘要： PURPOSE:To prevent over rise of pressure of supply water, by temporarily carrying out combined operation within an allowable output range of an inverter at a time point where the operational characteristic point of a main pump transfers to a forcible operation starting point of a sub pump because of reduction of usage of water. CONSTITUTION:If the operational characteristic point of a main pump 1 transfers to a forcible operation starting point of a sub pump 5 because of reduction of usage of water during when the main pump 1 is operated independently by means of an inverter 10 while a standby pump 7 and the sub pump 5 stopped and the total input signal for the main and sub pumps 1, 5 is within an allowable output signal of the inverter 10, the sub pump 5 is operated forcibly in parallel. Here upon, the delivery pressure may increase remarkably, but since the pump is controlled such that the total input signal for the main and sub pumps 1, 5 will be within the allowable output signal of the inverter 10, over rise of the delivery pressure can be suppressed. Furthermore, a pressure detector 6 detects the pressure rise so as to enable constant control of the delivery pressure.

8. 发明专利

JPS63100297A WATER SUPPLY FACILITY 失效
公开(公告)号：JPS63100297A
公开(公告)日：1988-05-02
申请号：JP24315286
申请日：1986-10-15
申请人： HITACHI LTD
发明人： NAKAZATO TSUNEO , OBA TAKASHI
IPC分类号： F04D15/00
摘要： PURPOSE:To clear water stored in a pump, by operating a flushing means for a drainage mechanism when the operating point of a main pump comes ahead of a sub-pump starting point. CONSTITUTION:Positioning of a main pump 1 at a point ahead of the starting point of a sub-pump 2 is detected by a flow meter 6. Consequently, an open/close control section 11 for a flushing means opens a supply valve 8 and a drainage valve 9 to feed fluid from the main pump 1 through a bypass tube 7 into the sub-pump 2. Water stored in the sub-pump 2 is discharged through a discharge pipe 10. Consequently, water stored in the sub-pump can be cleared reliably.

9. 发明专利

JPS6269537A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6269537A
公开(公告)日：1987-03-30
申请号：JP20866085
申请日：1985-09-24
申请人： HITACHI LTD
发明人： SHIRAI MASAYUKI , OBA TAKASHI
IPC分类号： H01L23/28 , H01L23/31 , H01L23/538
摘要： PURPOSE:To prevent the effect of the warping of a board printed-circuit, by hanging a semiconductor element, which is fixed to the wiring substrate with a protruded electrode, in the part of a through hole, which is provided in the board, filling silicon gel in the through hole, and covering the semiconductor element. CONSTITUTION:A through hole 2 is provided in a printed-circuit board 1. A wiring substrate 5, to which a semiconductor element 3 is fixed with its protruded electrode 4, is made to hang in a space of the hole 2 with a connector wires 6. Then, a flat plate 7 is stuck to the back surface of the board 2 with a bonding material 8. Thereafter, silicon gel 9 is filled in the hole 2 so as to cover the element 3, the wires 6 and the entire body of the substrate 5. A dam for stopping the flow of the gel and a cap (both are not shown in the drawing) are attached. Thus, stress to the element 3 from the board 1 can be alleviated, and the effect of the warping of the board 1 can be prevented.

10. 发明专利

JPS61177710A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61177710A
公开(公告)日：1986-08-09
申请号：JP1853885
申请日：1985-02-04
申请人： HITACHI LTD
发明人： FUJITA MINORU , OBA TAKASHI , ITO KAZUO
IPC分类号： H01L21/02 , H01L21/60
摘要： PURPOSE:To precisely fix a pellet by mounting the pellet provided with a face electrode on a surface for a circuit forming face, and by providing an optional position of a back portion of the pellet with a predetermined marking. CONSTITUTION:A mother chip 3 made of silicon where a large number of pellets 2 are face-down-bonded on the upper surface of a ceramic substrate 1 is bonded by a gold-silicon eutectic 4. The pellet 2 is formed by a silicon single crystal, and a soldering bump 10 is formed as a face electrode on a surface of the circuit forming surface of one side of 2. A complicated shaped circuit is formed in the silicon single crystal, and is electrically connected with the soldering bump 10 by means of wiring of such as aluminium. By providing a marking 11 in a back portion of the pellet 2 and distinguishing the pellet with the said marking, such as a kind of the pellet, a direction of the pellet, and a position for fixing the pellet are distinguished by only the back portion without any confirmation of a front surface of the pellet 2.

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