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1. 发明专利

JPH10335561A MANUFACTURE OF SEMICONDUCTOR DEVICE AND LEAD FRAME USED IN THE METHOD 失效
公开(公告)号：JPH10335561A
公开(公告)日：1998-12-18
申请号：JP14742697
申请日：1997-06-05
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： TAGUCHI ATSUHIKO , HAGIWARA TAKATOSHI
IPC分类号： H01L21/56 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To prevent separation of a small piece of a lead frame or a resin block upon cutting and removing a dummy resin body and a lead frame part, by connecting the lead frame part to a support member in the dummy resin body via a connection piece and supporting the lead frame part by the support member. SOLUTION: A support member 24 and a lead frame part 9 to be cut and removed are connected with a fine connection piece 30 such that when the lead frame part 9 is cut at both ends and separated from a read frame 1, the cut lead frame part 9 is integrated with the dummy resin body formed in a dummy resin formation region 22. Further, a connection piece is provided such that it projects from a connection resin formation region 27 into an opening 23 of the dummy resin formation region 22. By this arrangement, the very small lead frame part 9 can be prevented from being solely removing from the read frame 1, and it can be discarded integrally with the dummy resin body to be removed.

2. 发明专利

JPS6269625A BURR REMOVAL 失效
公开(公告)号：JPS6269625A
公开(公告)日：1987-03-30
申请号：JP20866785
申请日：1985-09-24
申请人： HITACHI LTD
发明人： OSHINO TOSHIKAZU , HAGIWARA TAKATOSHI , KOIZUMI KOJI
IPC分类号： H01L21/56 , B29C37/02
摘要： PURPOSE:To enable highly efficient and highly reliable removal of burrs by pressing and removing resin burrs formed between a dam of a lead frame and a package main body by means of a punch before a blast of high-pressure fluid or powder and granulates is given to the periphery of the package main body. CONSTITUTION:When a package main body 2 is placed on a prescribed position of a jig 8, a comb teeth-shaped punch 9 descends and operates to be penetratingly shifted between the package main body 2 and a dam 6. A resin 7a in the dam 2 is bent off from the package main body 2 along with the operation of the punch 9 and falls downward. Then, a high-pressure water current 13 is jetted through the tip of a nozzle 12. A resin flash 7b adherent to the surface of a lead 3 or the dam 6 is peeled, scattered and removed by the water pressure of the high-pressure water current 13 along with a movement of the nozzle 12 and at that time, resin scrap 7c is also scattered and removed by the water pressure of the high-pressure water current 13, and the surfaces of the lead 3 and the like are cleansed. According to this way, the removal of burrs can be attained with a high efficiency.

3. 发明专利

JP2000252410A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JP2000252410A
公开(公告)日：2000-09-14
申请号：JP5396999
申请日：1999-03-02
申请人： HITACHI LTD , HITACHI ULSI SYS CO LTD
发明人： FUJISHIMA ATSUSHI , NAKAJIMA YASUYUKI , HAGIWARA TAKATOSHI , KOIZUMI KOJI , KAWADA YOICHI , SUGIYAMA MICHIAKI
IPC分类号： H01L25/18 , H01L23/50 , H01L25/065 , H01L25/07
摘要： PROBLEM TO BE SOLVED: To improve yield and reliability of a semiconductor device by laminating a first and a second chips in the state that the respective backs of the chips are made to face with each other, and fusing and bonding the chips with laser in the state that parts of the respective leads are overlapped. SOLUTION: In a semiconductor device 20, semiconductor chips 15, 16 are vertically laminated in the state that backs (other main surfaces) out of the respective surfaces and backs (one main surfaces and the other main surfaces which face with each other) of the chips are made to face with each other, and sealed with resin sealing member 19. On the respective edge sides of two long edges which face with each other of the resin sealing member 19, a plurality of leads 3, 4 are arranged along the respective long edges. The chips are laminated in the state that the respective parts of the leads 3, 4 are overlapped in a vertical direction (laminating direction of the semiconductor chips). The respective parts of the leads 3, 4 are stretched along the inside and the outside of the resin sealing member 19 and electrically and mechanically connected in the outside of the resin sealing member 19 with fusion bonding by laser welding. As a result, yield and reliability of the semiconductor device can be improved.

4. 发明专利

JPH10125844A SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND LEAD FRAME THEREFOR 失效
公开(公告)号：JPH10125844A
公开(公告)日：1998-05-15
申请号：JP29331396
申请日：1996-10-15
申请人： HITACHI LTD
发明人： IWATANI AKIHIKO , HAGIWARA TAKATOSHI
IPC分类号： H01L21/56 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To keep a standard value of max. width with dams disposed near the cavity periphery. SOLUTION: In an SOJ IC 10, small width parts 9 are formed near resin seals 17 at both ends of each outer lead 8, dam cuts 10b are formed in the small width parts 9. Each outer lead 8 is bent in the dam cut 10b. The width of the small width part 9 is set to be less than a reference value of the outer lead 8. The dams are disposed near the resin seals 17 and hence thick burrs formed in the gaps between the outer leads 8 and between the dam and the resin seal 17 can be made very small enough to avoid dropping the burrs from the seals 17. The dam cuts 10b are bent to cause plastically deformed protrusions 10c remaining in the small width parts, without extruding outside over the reference size of the outer lead 8. Thus, the reference value of max. width of the outer leads 8 can be maintained whereas the dam cuts 10b are bent.

5. 发明专利

JPH05175406A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH05175406A
公开(公告)日：1993-07-13
申请号：JP34288691
申请日：1991-12-25
申请人： HITACHI LTD
发明人： MASUDA MASACHIKA , HAGIWARA TAKATOSHI
IPC分类号： H01L23/50 , H01L23/52 , H01L25/10 , H01L25/11 , H01L25/18 , H05K3/34
摘要： PURPOSE:To facilitate the mounting on a substrate and to improve mounting reliability by constituting each lead of Fe-based metal or metal having the same bending strength as the Fe-based metal, and bending the intermediate part of the outer lead part upward. CONSTITUTION:A semiconductor chip 3 comprising silicon single crystal, wherein a memory LSI such as a DRAM is formed, is sealed in a package main body 2 of a surface-mounting LSI-package-type TSOP 1. At the side surface of the package main body 2, a plurality of leads 4 constituting the outer terminals of the TSOP 1 are extending outward. The lead 4 is formed of Fe-based metal such as 42 alloy. The tip of the outer lead part of the lead 4 is bent so that the surface mounting is possible. The intermediate part of the lead 4 is bent upward. Thus the deformation of the lead can be prevented, and the regenerating mounting by soldering can be performed.

6. 发明专利

JPS6219412A MOLD ASSEMBLY 失效
公开(公告)号：JPS6219412A
公开(公告)日：1987-01-28
申请号：JP15813585
申请日：1985-07-19
申请人： HITACHI LTD
发明人： HAGIWARA TAKATOSHI , OZAWA MASAKAZU , TABATA KATSUHIRO , OSHINO TOSHIKAZU
IPC分类号： H01L21/56 , B29C33/12 , B29C45/14 , B29C45/36 , B29L31/34
摘要： PURPOSE:To prevent a member to be molded from shifting positionally and consequently realize favorable molding by a method wherein a soft-landing mechanism is provided so as to fully automatically and quietly set a loading jig in a horizontal state. CONSTITUTION:A soft-landing mechanism 4 has the respective vertically movable pairs of stems and 6. A loading jig L is transferred by a roller means to the soft- landing mechanism 4 from its adjoining position. At this time, the stems 5 are moved upwards so as to shift the jig L by means of the respective rollers 8 and 8, which are arranged at the four corners of a bottom force 2, of the soft-landing mechanism 4, from the one side position of a mold assembly 1 to the position just above the bottom force 2. After that, the stems 5 are shifted at high speed to the positions lower than those of the stems 6. It follows that the jig L is allowed to be supported by the supporting pins 10 of the stems 6, which are moved downwards at slow speed so as to quietly set the jig L onto the bottom force 2 while keeping on holding the jig L in its horizontal posture. Thus, the jig L can accurately be set onto the bottom force 2 and consequently a member to be molded can correctly be positioned so as to face to a cavity in order to perform the molding of the member to be molded favorably.

7. 发明专利

JPS61215023A MOLDING DEVICE 失效
公开(公告)号：JPS61215023A
公开(公告)日：1986-09-24
申请号：JP5455685
申请日：1985-03-20
申请人： HITACHI LTD
发明人： KOIZUMI KOJI , HAGIWARA TAKATOSHI , TANAKA HIDEKI
IPC分类号： H01L21/56 , B29C33/44 , B29C45/02 , B29C45/14 , B29C45/40
摘要： PURPOSE:To prevent a molded article from damaging by facilitating release of the molded article from a cavity, by a method wherein an ejector pin is formed so that the same fronts on about the whole sphere extending over an upper and lower bottom surfaces and the tip surface of the same is set up at a little recessed position from the bottom surface of the cavity. CONSTITUTION:Ejector pins 16, 21 provided respectively on a bottom and top forces 7, 8 are formed in large diameters, the top end surface 16a of the lower ejector pin 16 constitutes almost the whole sphere of the lower bottom surface of a cavity 11 and the lower end surface 21a of the upper ejector pin 16 constitutes almost the whole sphere of the upper bottom surface of the cavity 11. Then the end surface 16a, 21a each of the ejector pins 16, 21 each are set up so that the bottom and top forces 7, 8 are positioned by hollowing downward and upward by the size of less than 0.3mm from the lower and upper bottom surfaces of the cavity 11 respectively when the cavity 11 is divided by the bottom and top forces 7, 8. With this construction, it becomes that contacts among a molded article M and the ejector pins 16, 21 are performed only at the tip surfaces of the ejector pin and release of the molded article can be facilitated.

8. 发明专利

JPH0567724A MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH0567724A
公开(公告)日：1993-03-19
申请号：JP22934991
申请日：1991-09-10
申请人： HITACHI LTD , HITACHI YONEZAWA DENSHI KK
发明人： SUZUKI MASARU , TAKASHIMA KAZUHISA , WATANABE KENJI , HAGIWARA TAKATOSHI , TABATA KATSUHIRO
IPC分类号： H01L21/56 , H01L23/28 , H01L23/50
摘要： PURPOSE:To provide a technique to improve the lead formation precision for the lead frame of an LSI package. CONSTITUTION:Leads are formed by fixing part of outer leads 3 and part of tab hanging leads 5 by use of the supporting members 8 which are independently arranged for the respective sides of a package main body 2 before executing the lead formation process. Then, the supporting members 8 are removed to form the leads.

9. 发明专利

JPS62169427A MOLDING APPARATUS 失效
公开(公告)号：JPS62169427A
公开(公告)日：1987-07-25
申请号：JP1009686
申请日：1986-01-22
申请人： HITACHI LTD
发明人： OSHINO TOSHIKAZU , HAGIWARA TAKATOSHI , OZAWA MASAKAZU , TABATA KATSUHIRO
IPC分类号： B29C39/10 , B29C39/22 , B29K105/20 , B29L31/34 , H01L21/56
摘要： PURPOSE:To position an object to be molded to a loading jig and molds with high precision, by providing a positioning mechanism between the molds and the loading jig. CONSTITUTION:Positioning pins 8 on a loading jig 5 are fit in second positioning holes 6b in lead frames 6 of a semiconductor structure 7 at a station position other than that of molds 1, so that the lead frames 6 are arranged on the loading jig 5. The loading jig 5 is moved to over the lower one of the molds 1 and is lowered so that positioning holes 9 are fit on pilot pins of the molds 1. In this manner, the loading jig 5 can be positioned correctly to the molds 1.

10. 发明专利

JPS62169426A MOLDING APPARATUS 失效
公开(公告)号：JPS62169426A
公开(公告)日：1987-07-25
申请号：JP1009586
申请日：1986-01-22
申请人： HITACHI LTD
发明人： OSHINO TOSHIKAZU , HAGIWARA TAKATOSHI , OZAWA MASAKAZU , TABATA KATSUHIRO
IPC分类号： B29C39/10 , B29C39/22 , B29K105/20 , B29L31/34 , H01L21/56
摘要： PURPOSE:To position a lead frame to a loading jig and molds with high precision, by forming the loading jig of a material having a thermal expansion coefficient equal to that of an object to be molded. CONSTITUTION:A loading jig 5 has a low temperature before it is disposed n a mold 1. A lead frame 6 is carried on the loading jig under the low temperature condition. When the lead frame 6 is set in the mold 1, the loading jig 5 is heated and thermally expanded by heat of the mold, but no discrepancy is caused between a positioning pin 8 on the loading jig 5 and a second positioning hole 6b in the lead frame 6 since the lead frame 6 is also expanded integrally with the loading jig. Further, thermal expansion of the loading jig 5 and the lead frame 6 will not prevent them from being set in the mold correctly, because such thermal expansion has been considered when various dimensions thereof are designed.

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