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1. 发明专利

JP2010189018A Box with ic tag and manufacturing method of the same 审中-公开
标题翻译：具有IC标签的盒子及其制造方法
公开(公告)号：JP2010189018A
公开(公告)日：2010-09-02
申请号：JP2009033025
申请日：2009-02-16
申请人： Daiichi Ohmiya Co Ltd , Morimura Bros Inc , 森村商事株式会社 , 第一大宮株式会社
发明人： SUMIUCHI HIDEFUMI , MATSUOKA TAKAMINE
IPC分类号： B65D25/20 , B65D5/32 , B65D5/44 , B65D77/28 , G06K19/00 , G06K19/07 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide a box with an IC tag capable of preventing the IC tag from being damaged or the like and performing information management of an article with high reliability or durability. SOLUTION: The box 10 with the IC tag is composed of a plastic material and includes a first face 22, a second face 32 adjoining the first face 22, a connecting part 34 welded at least on the first face 22 and connecting the first face 22 with the second face 32, and the IC tag 40 provided between the welded first face 22 and the connecting part 34. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供具有能够防止IC标签被损坏等的IC标签的盒子，并且以高可靠性或耐久性进行物品的信息管理。解决方案：具有IC标签的盒10由塑料材料构成，包括第一面22，邻接第一面22的第二面32，至少在第一面22上焊接的连接部34，具有第二面32的第一面22和设置在焊接的第一面22和连接部34之间的IC标签40.（C）2010，JPO＆INPIT

2. 发明专利

JP2007049101A Circuit substrate, circuit substrate forming ink and method for forming circuit substrate 审中-公开
标题翻译：电路基板，形成电路的基板和形成电路基板的方法
公开(公告)号：JP2007049101A
公开(公告)日：2007-02-22
申请号：JP2005234896
申请日：2005-08-12
申请人： Morimura Bros Inc , Morimura Chemicals Ltd , 森村ケミカル株式会社 , 森村商事株式会社
发明人： OGUCHI TOSHIHIKO , SUGANAMI KEIKI , SUMIUCHI HIDEFUMI , HIRONAKA MUNEATSU
IPC分类号： H05K3/18 , B82Y30/00 , B82Y99/00 , C09D11/02 , C09D11/023 , C09D11/03 , H01B1/22
摘要： PROBLEM TO BE SOLVED: To form a conductive circuit with a linewidth of sub-μm to 20 μm that has not been achieved by neither screen-printing method nor ink-jetting method, with high reliability.
SOLUTION: A circuit pattern is formed in metal colloid with a particle size of 1 to 100 nm containing palladium colloid and ink containing binder resin with a thickness of 5 nm to 5 μm, and a metalclad layer is formed thereon to obtain a conductive pattern. This allows a predetermined precision-conductive circuit with a linewidth of sub-μm to 20 μm to be prepared at a time with high reliability.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：以高可靠性形成丝网印刷法和喷墨法都未实现的亚μm至20μm的线宽的导电电路。解决方案：在包含钯胶体和含有粘合剂树脂的油墨的厚度为5nm至5μm的金属胶体中形成粒径为1至100nm的电路图案，并在其上形成金属层，以获得导电图案。这允许准确地准确地制造具有次于μm至20μm的线宽的预定精密导电电路。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP4517010B1 Apparatus and method for plating the carbon fiber 有权
公开(公告)号：JP4517010B1
公开(公告)日：2010-08-04
申请号：JP2010063201
申请日：2010-03-18
申请人：株式会社ムラタ , 森村商事株式会社
发明人：和彦加藤 , 哲也武川
IPC分类号： C25D7/06 , C25D5/54 , C25D17/00 , D06M10/00
摘要：【課題】バイポーラ電極を利用することにより、カーボンファイバに対して導電性を有する金属を薄膜被覆すること。
【解決手段】めっき用金属を溶存した電解液１０を貯液し、電源１２に接続された陰極１４と陽極１６とを設けてなるめっき槽１８を用いて長尺状のカーボンファイバＣＦの表面にめっきを施すめっき装置であって、カーボンファイバＣＦを、陰極１４および陽極１６の何れにも接触しないように電解液１０に浸漬させた状態で、めっき槽１８内において陰極側から陽極側へと移動させることによって、カーボンファイバＣＦの表面に対し、陰極近傍２０において前処理を施し、しかる後に、陽極近傍２２においてめっき用金属をめっきする。
【選択図】図１

4. 发明专利

JP2003301140A Coating material for forming transparent electroconductive film and emboss processed electronic part carrier tape 审中-公开
标题翻译：用于形成透明电极膜和电子零件加载带的涂层材料
公开(公告)号：JP2003301140A
公开(公告)日：2003-10-21
申请号：JP2002108437
申请日：2002-04-10
申请人： Colcoat Kk , Morimura Bros Inc , Morimura Chemicals Ltd , コルコート株式会社 , 森村ケミカル株式会社 , 森村商事株式会社
发明人： MURATA SHIYOUZOU , KUDO HIDEJIRO
IPC分类号： C09D201/00 , C09D5/24 , C09D7/12 , H01B1/22
摘要： PROBLEM TO BE SOLVED: To provide a transparent electroconductive coating material which forms a transparent electroconductive film possessing transparency, electroconductivity and extensibility and an emboss processed carrier tape obtained by using the same.
SOLUTION: The coating material for forming the transparent electroconductive coating film comprises a hybrid electroconductive material which comprises a mixture of (a) electroconductive particles comprising a minute electroconductive fine particle (a1) and a coarse electroconductive fine particle (a2) with (b) an organic electroconductive material, where the ratio of the electroconductive fine particle (a) to the organic electroconductive material (b) is such that (a):(b) is 10:(0.02-5.0) in terms of weight ratio, and a binder component. The emboss processed carrier tape having a coating film formed thereon using the coating material is featured in an elongation of at least 60%, a total light transmission at a film thickness of 2 μm of at least 50% and a surface resistance at an elongated part after emboss processing of 5×10
6 -9×10
10 Ω/(square).
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种透明导电涂层材料，其形成具有透明度，导电性和延展性的透明导电膜，以及通过使用该透明导电涂层材料得到的压花加工载带。用于形成透明导电涂膜的涂料包括混合导电材料，其包含（a）包含微小导电细颗粒（a1）和粗导电细颗粒（a2）的导电颗粒与（ b）有机导电材料，其中导电细颗粒（a）与有机导电材料（b）的比例使得（a）：（b）的重量比为10：（0.02-5.0）和粘合剂组分。具有在其上使用涂层材料形成的涂膜的压花加工载带的特征在于至少为60％的延伸率，2μm的膜厚度的总光透射率为至少50％，在细长部分的表面电阻为在5×10 6 -9×10 10 Ω/（正方形）的压花加工之后。版权所有（C）2004，JPO

5. 发明专利

JP2011089194A Device and method for plating carbon fiber 有权
标题翻译：碳纤维布的设备和方法
公开(公告)号：JP2011089194A
公开(公告)日：2011-05-06
申请号：JP2010063201
申请日：2010-03-18
申请人： Morimura Bros Inc , Murata:Kk , 株式会社ムラタ , 森村商事株式会社
发明人： TAKEGAWA TETSUYA , KATO KAZUHIKO
IPC分类号： C25D19/00 , C25D3/38 , C25D5/34 , C25D5/54 , C25D7/06 , C25D21/00
摘要： PROBLEM TO BE SOLVED: To coat a carbon fiber with a thin film metal having conductivity by utilizing a bipolar electrode.
SOLUTION: In a plating device for plating the surface of a long sized carbon fiber CF using a plating vessel 18 storing an electrolyte 10 in which a plating metal is dissolved and having a cathode 14 and an anode 16 connected to a power source 12, the surface of the carbon fiber CF is subjected to pre-treatment in the vicinity 20 of the cathode and then subjected to plating with a plating metal in the vicinity 22 of the anode by moving the carbon fiber CF from a cathode side to an anode side in the plating vessel 18 in an immersed state in the electrolyte 10 so as not to come in contact with the cathode 14 and the anode 16.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过利用双极电极涂覆具有导电性的薄膜金属的碳纤维。解决方案：在电镀装置中，使用电镀容器18对长条碳纤维CF的表面进行电镀，所述电镀容器18储存电解液10，电解液10溶解有电镀金属，并且具有阴极14和与电源连接的阳极16 如图12所示，碳素纤维CF的表面在阴极附近进行预处理，然后通过将碳纤维CF从阴极侧移动到阳极的附近，用阳极的附近的电镀金属进行镀覆电解槽18中的阳极侧浸入电解液10中，以便不与阴极14和阳极16接触。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP4429214B2 The method of forming the surface treatment liquid and chemical conversion coating 有权
公开(公告)号：JP4429214B2
公开(公告)日：2010-03-10
申请号：JP2005167327
申请日：2005-06-07
申请人：サーテック・インターナショナル・ゲー・エム・ベー・ハー , 株式会社ムラタ , 森村商事株式会社
发明人：広司古谷 , 史長谷川
IPC分类号： C23C22/30
CPC分类号： C23C22/46 , C23C2222/10

7. 发明专利

JP2014117839A Laminated antifogging film 审中-公开
标题翻译：层压抗皱胶片
公开(公告)号：JP2014117839A
公开(公告)日：2014-06-30
申请号：JP2012273097
申请日：2012-12-14
申请人： Kanae Toryo Kk , カナヱ塗料株式会社 , I K C Kk , アイケーシー株式会社 , Morimura Bros Inc , 森村商事株式会社
发明人： OGA KOJI , YAMAGAMI KEN
IPC分类号： B32B27/30 , C08G81/02 , C09D7/12 , C09D133/14 , C09D133/26 , C09D175/04 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a laminated antifogging film which is composed of an antifogging composition layer (A) and a transparent support layer (B) and exerts antifogging performance, water resistant performance, adhesion performance, optical performance, mechanical strength and their persistency in an antifogging measure for e.g. window glasses, lenses, mirrors and optical sensors.SOLUTION: A laminated antifogging film consists of an antifogging composition layer (A) obtained by reacting a copolymer having isocyanate groups and obtained by copolymerization of an isocyanate ethyl(meth)acrylate, a specified N-substituted alkyl(meth)acrylamide and (meth)acrylate monomer with a polyol of a hydroxyl value of 150-650 mgKOH/g and having a water absorption characteristic of 1-100 g/mand a transparent support layer (B). The laminated antifogging film exerts higher antifogging performance owing to its excellent water absorption and also has excellent water resistant performance, adhesion performance, optical performance, mechanical strength and their persistency meeting practical requirements.
摘要翻译：要解决的问题：提供由防雾组合物层（A）和透明支撑层（B）组成的层压防雾膜，并且具有防雾性能，防水性能，粘合性能，光学性能，机械强度及其持续性在防雾措施中例如窗玻璃，镜片，镜子和光学传感器。解决方案：层压防雾膜由防雾组合物层（A）组成，该防雾组合物层（A）通过使具有异氰酸酯基的共聚物与（甲基）丙烯酸异氰酸乙酯共聚而得到的特定N- 取代的（甲基）丙烯酰基烷基酯和（甲基）丙烯酸酯单体与羟值为150-650mgKOH / g的多元醇并且具有1-100g / l的吸水特性的透明支撑层（B）。层压防雾膜由于其优异的吸水性而具有更高的防雾性能，并且还具有优异的防水性能，粘合性能，光学性能，机械强度以及其持久性满足实际要求。

8. 发明专利

JP2006024721A Electronic component module and manufacturing method therefor 审中-公开
标题翻译：电子元件模块及其制造方法
公开(公告)号：JP2006024721A
公开(公告)日：2006-01-26
申请号：JP2004201124
申请日：2004-07-07
申请人： Morimura Bros Inc , Morimura Chemicals Ltd , 森村ケミカル株式会社 , 森村商事株式会社
发明人： OGUCHI TOSHIHIKO , SUGANAMI KEIKI , SUMIUCHI HIDEFUMI , HIRONAKA MUNEATSU
IPC分类号： H01L21/60
CPC分类号： H01L2224/16 , H01L2224/16235 , H01L2224/16237 , H01L2224/83192 , H01L2924/01046 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an electronic component module that enables the achievement of reliable electrode connections as well as simultaneous interlayer connection by through-holes without employing a thermally-melting type connection member, such as solder.
SOLUTION: The electronic component module comprises an insulating substrate formed with a plurality of through-holes; a surface mount electronic component fixed to one main surface of the insulating substrate by inserting connection electrodes into the through-holes, or by causing them to abut the through-holes; a circuit pattern made of metal particles that is formed on the other main surface of the insulating substrate, in such a way that part of the circuit pattern electrically contacts the connection electrodes of the surface mount electronic component; and a solder layer formed on the circuit pattern made of metal particles.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电子部件模块，其能够实现可靠的电极连接以及通过通孔的同时层间连接，而不使用诸如焊料的热熔型连接部件。解决方案：电子部件模块包括形成有多个通孔的绝缘基板; 通过将连接电极插入到通孔中或通过使它们抵靠通孔而固定到绝缘基板的一个主表面上的表面安装电子部件; 由形成在绝缘基板的另一个主表面上的金属颗粒构成的电路图形，使电路图案的一部分与表面安装电子部件的连接电极电接触; 以及形成在由金属颗粒制成的电路图案上的焊料层。版权所有（C）2006，JPO＆NCIPI

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